Abstract: A method of prefetching data in a hard disk drive includes searching for a logic block address (LBA) of data requested by an external apparatus in a history of a non-volatile cache of the hard disk drive, and if the LBA of the data is stored in the history, storing data recorded in a LBA stored after the LBA of the data requested by the external apparatus from among LBAs stored in the history in a buffer of the hard disk drive.

Abstract: A socket assembly for testing semiconductor devices includes a socket board electrically connected to an outside testing device, and a socket guide which covers the socket board. The socket guide has an open part to receive the semiconductor device and allows pins on the semiconductor device to couple with connection pins on the socket board. A spacer may be interposed between the socket board and the socket guide to maintain a predetermined distance between the semiconductor device and the socket board. In this manner, the balls or the leads of each semiconductor device may be pressed onto connection pins of the socket to a predetermined depth, even when the semiconductor devices have different thicknesses.

Abstract: A hardware apparatus for receiving a packet for a TCP offload engine (TOE), and receiving system and method using the same are provided. Specifically, information required to protocol processing by a processor is stored in the internal queue included in the packet receiving hardware. Data to be stored in a host memory is transmitted to the host memory after the data is stored in an external memory and protocol processing is performed by the processor.

Abstract: A light guide plate for a surface light-emitting device and a method of manufacturing the same are disclosed wherein the light guide plate is constructed in the form of an optical waveguide including an upper cladding film, core films formed with V-cut grooves, and a lower cladding film, so that since the upper and lower cladding films with a relatively low refractive index are respectively located on upper and lower surfaces of the core films, external foreign substances cannot penetrate into the core films, and the core films are not brought into contact with other components, whereby optical transmission properties are not changed and brightness can be also enhanced, and since the V-cut grooves are formed or both the V-cut grooves and optical waveguides are formed at the same time by means of a simple hot embossing process, the manufacturing costs can be saved.

Abstract: A capacitor structure of a semiconductor device includes: a plurality of first metal elements connected in a vertical direction by first vias; a plurality of second metal elements connected in the vertical direction by second vias and arranged alternately with the first metal elements in a horizontal direction; dielectric materials formed between the first and the second metal elements; and a branch unit for supplying current to each layer of the capacitor structure and grounding each layer of the capacitor structure, each layer having the first and the second metal elements disposed in an identical horizontal plane, wherein one ends of the first metal elements and one ends of the second metal elements are extended in opposite horizontal directions to form a first and a second extension unit, respectively; and the first and the second extension units are connected to the branch unit.

Abstract: Handler for testing a semiconductor device including a carrier unit for detachably holding, and carrying a plurality of devices, a test board having a plurality of test sockets for respectively coming into contact with the devices held at the carrier unit for testing the devices, a press unit for respectively pressing, and bringing the devices on the carrier unit into contact with the test sockets on the test board when the carrier unit is aligned with the test board, a spray unit for directly, and selectively spraying a high or low temperature gas to surfaces of the devices in contact with the test sockets from a position in a neighborhood of the devices of the carrier unit, to heat or cool the devices to a preset temperature, a gas supply unit for selectively supplying the high or low temperature gas to the spray unit, and a control unit for controlling the gas supply to the spray unit from the gas supply unit, thereby directly spraying high or low temperature gas to a surface of the device without an enclo

Abstract: A method of manufacturing a capacitor, which uses metal as a top electrode and a bottom electrode. A plurality of first electrodes may be formed with a plurality of first conductive lines and a plurality of plugs. A plurality of second electrodes may be formed with a plurality of second conductive lines and a plurality of plugs. Oxide layers may be formed between first electrodes and second electrodes. First and second electrodes may be formed such that they intersect each other on every side.

Abstract: Provided is an apparatus and a method for creating and managing Transmission Control Protocol (TCP) transmission information based on a TCP Offload Engine (TOE). The apparatus includes: a TCP transmission processing unit for receiving a data transmission request from a predetermined network program, creating transmission information and deleting the transmission information; a TCP reception processing unit for receiving a reception command of the data, creating and managing the reception information; a transmission information region managing unit for allocating memory regions for storing the transmission information according to a command of the TCP transmission processing unit, creating an identification (ID) of each region, and managing a deleting process; and a storing unit for storing and deleting the transmission information according to control of the TCP transmission processing unit.

Abstract: An apparatus for searching a socket ID of a received packet in a transmission control protocol (TCP) and a user datagram protocol (UDP) is provided. The apparatus includes: a master managing unit for analyzing command information from a processor, transferring a command to a branch table managing unit and a tree table managing unit, receiving results from the branch table managing unit and the tree table managing unit, and reporting the received results to the processor; a branch table managing unit for receiving a command from the mater managing unit and managing a branch table; and a tree table managing unit for managing a binary tree.

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.

Abstract: A carrier module for a semiconductor device handler, in which grooves for flow of cooling fluid are formed in a seating surface of the carrier module for the semiconductor device. The grooves improve cooling efficiency by forcing the cooling fluid sprayed from a test temperature deviation compensating system onto the carrier module to spread throughout substantially an entire surface of the semiconductor device, and to remain in the carrier module for a period of time before being discharged.

Abstract: A high voltage semiconductor device, including: a high concentration collector area of a first conductive type; a low concentration collector area of a first conductive type formed on the high concentration collector area; a base area of a second conductive type formed on the low concentration collector area and having a trench perforating the low concentration collector area in a vertical direction at the edge of the trench; a high concentration emitter area of a first conductive type formed on a predetermined upper surface of the base area; and an emitter electrode, a base electrode, and a collector electrode isolated from one another and connected to the emitter area, the base area, and the collector area, respectively. High breakdown voltage can be obtained with a narrow junction termination area due to the trench.

Abstract: A metal-to-metal capacitor including a plurality of first metal blocks formed apart from each other in a vertical direction and arranged in an array format, and a plurality of second metal blocks formed apart from each other in a vertical direction and alternately arranged with the array of the first metal blocks. A first plurality of via contacts interconnect the first metal blocks in a vertical direction and are arranged in parallel, and a second plurality of via contacts interconnect the second metal blocks in a vertical direction and are arranged in parallel.

Abstract: Methods for compensating for a test temperature deviation in a semiconductor device handler are provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing of the semiconductor device at a preset temperature is compensated for. This allows a test of the semiconductor device to be carried out at an exact temperature.

Abstract: Handler for testing a semiconductor device including a carrier unit for detachably holding, and carrying a plurality of devices, a test board having a plurality of test sockets for respectively coming into contact with the devices held at the carrier unit for testing the devices, a press unit for respectively pressing, and bringing the devices on the carrier unit into contact with the test sockets on the test board when the carrier unit is aligned with the test board, a spray unit for directly, and selectively spraying a high or low temperature gas to surfaces of the devices in contact with the test sockets from a position in a neighborhood of the devices of the carrier unit, to heat or cool the devices to a preset temperature, a gas supply unit for selectively supplying the high or low temperature gas to the spray unit, and a control unit for controlling the gas supply to the spray unit from the gas supply unit, thereby directly spraying high or low temperature gas to a surface of the device without an enclo

Abstract: A bipolar transistor in which the occurrence of Kirk effect is suppressed when a high current is injected into the bipolar transistor and a method of fabricating the bipolar transistor are described. The bipolar transistor includes a first collector region of a first conductive type having high impurity concentration, a second collector region of a first conductive type which has high impurity concentration and is formed on the first collector region, a base region of a second conductive type being formed a predetermined portion of the second collector region, and an emitter region of a first conductive type being formed in the base region. The bipolar transistor further includes the third collector region, which has higher impurity concentration than the second collector region, at the bottom of the base region.

Abstract: A semiconductor device handler is provided, in which a test temperature deviation of a semiconductor device caused by heat produced by the semiconductor device itself during testing is compensated for, allowing a test of the semiconductor device to be carried out at an exact temperature, or within an exact temperature range.

Abstract: Handler for testing a semiconductor device including a carrier unit for detachably holding, and carrying a plurality of devices, a test board having a plurality of test sockets for respectively coming into contact with the devices held at the carrier unit for testing the devices, a press unit for respectively pressing, and bringing the devices on the carrier unit into contact with the test sockets on the test board when the carrier unit is aligned with the test board, a spray unit for directly, and selectively spraying a high or low temperature gas to surfaces of the devices in contact with the test sockets from a position in a neighborhood of the devices of the carrier unit, to heat or cool the devices to a preset temperature, a gas supply unit for selectively supplying the high or low temperature gas to the spray unit, and a control unit for controlling the gas supply to the spray unit from the gas supply unit, thereby directly spraying high or low temperature gas to a surface of the device without an enclo

Abstract: Disclosed is a note DVR comprising a housing, and storage and control unit of DVR installed in the housing, characterized by having a display plate bonded to an edge of the upper surface of the housing by a hinge, a front panel switch part disposed at one side of the upper surface of the housing, which is open and closed by the display plate, and input-output ports for audio and video signals at the rear surface of the housing.

Abstract: A device for compensating for heat generation in a modular IC test handler is provided which includes at least one supporting member positioned adjacent to a press unit of the handler, and having a cooling fluid flow passage formed therein for flow of cooling fluid, and a plurality of cooling fluid spraying units for spraying the cooling fluid supplied through the cooling fluid flow passage toward faces of modular ICs in an oblique direction from a position between adjacent push bars of the press unit, thereby spraying cooling fluid directly onto ICs attached to a surface of modular ICs during testing and enhancing an efficiency of heat compensation.