Abstract: A semiconductor device includes an active region in a substrate. The active region extends in a first direction. The semiconductor device further includes a gate structure extending in a second direction different from the first direction. The gate structure extends across the active region. The semiconductor device further includes a plurality of source/drain contacts extending in the second direction and overlapping a plurality of source/drain regions in the active region on opposite sides of the gate structure. A first source/drain contact of the plurality of source/drain contacts has a first width, and a second source/drain contact of the plurality of source/drain contacts has a second width less than the first width.

Abstract: This application provides a terminal device which includes a housing and a metal line. The metal line is disposed on an outer surface of the housing or embedded in the housing, and the metal line is configured to receive or send an electromagnetic wave signal. In the terminal device provided in this application, the metal line (an antenna) of the terminal device is disposed on the outer surface of the housing of the terminal device or embedded in the housing. This can increase a distance from the metal line to a circuit board of the terminal device, thereby reducing interference of a metal component on the circuit board to radiation of the metal line (radiation of the antenna) and improving operating bandwidth and efficiency of the antenna. This improves operating efficiency of the antenna of the terminal device, thereby improving signal receiving and signal sending quality of the terminal device.

Abstract: A power gating cell on an integrated circuit is provided. The power gating cell includes: a central area; a peripheral area surrounding the central area; a first active region located in the central area, the first active region having a first width in a first direction corresponding to at least four fin structures extending in a second direction perpendicular to the first direction; and a plurality of second active regions located in the peripheral area, each second active region having a second width in the first direction corresponding to at least one and no more than three fin structures extending in the second direction.

Abstract: A vibration damper capable of damping vibrations occurring from a turbine casing, an exhaust diffuser system including the vibration damper, and a gas turbine including the exhaust diffuser system are provided. The vibration damper installed on an outer casing of a gas turbine to damp vibrations generated in the gas turbine, the vibration damper includes a reinforcing support part including a plurality of reinforcing plates, a first flange coupled to both longitudinal ends of the reinforcing support part and fixed to a protruding support protruding from the outer casing, and a second flange disposed between the plurality of reinforcing plates to connect the plurality of reinforcing plates, wherein each of the plurality of reinforcing plates is erected and installed on an outer circumferential surface of the outer casing.

Abstract: The present disclosure provides a double-folding unlocking device of a rear seat for a vehicle. The double-folding unlocking device of a rear seat is capable of preventing the occurrence of excessively tight fitting and deformation of components due to excessively tight contact between bracket members when a seatback is rotated in an opposite direction while the seatback is folded or unfolded.

Abstract: A semiconductor device including: an active region; first, second and third metal-to-drain/source (MD) contact structures which extend in a first direction and correspondingly overlap the active region; a via-to-via (V2V) rail which extends in a second direction perpendicular to the first direction, and overlaps the first, second and third MD contact structures; a first conductive segment which overlaps the V2V rail, is in a first metallization layer, and, relative to the second direction, overlaps each of the first, second and third MD contact structures; and a first via-to-MD (VD) structure between the first MD contact structure and the first conductive segment, the first VD structure electrically coupling the first conductive segment, the V2V rail and the first MD contact structure; wherein at least one of the second or third MD contact structures is electrically decoupled from the V2V rail.

Abstract: A layout method includes generating a design data comprising an electronic circuit, and generating a design layout by placing a first cell corresponding to the electronic circuit. The first cell includes a first source/drain region and a second source/drain region extending in a first direction in a first layer, a gate electrode extending in a second direction perpendicular to the first direction in a second layer, and a first conductive line arranged in a third layer over the second layer and electrically connected to one of the first source/drain region, the second source/drain region and the gate electrode. The first cell is defined by a left cell side and a right cell side. At least one of the left cell side, the right cell side, the gate electrode and the first conductive line extends in a third direction not parallel to the first and second directions.

Abstract: The present disclosure relates to a diagnostic method and a device performing the same. According to an aspect of the present disclosure, a diagnostic device is a diagnostic device that uses a test kit including a specimen plate having a specimen region in which a specimen is smeared and a patch plate configured to store a contact-type patch, which comes into contact with the specimen to stain the specimen, and the diagnostic device includes a body having a loading region in which the test kit is placed, a moving unit configured to move the patch plate and the specimen plate of the test kit relative to each other so that the specimen placed in the test kit is smeared in the specimen region, and a contact unit configured to move a structure of the test kit such that the contact-type patch comes into contact with the smeared specimen so that the smeared specimen is stained.

Abstract: A method of forming an integrated circuit includes generating a first and a second standard cell layout design, generating a first set of cut feature layout patterns extending in a first direction, and manufacturing the integrated circuit based on the first or second standard cell layout design. Generating the first standard cell layout design includes generating a first set of conductive feature layout patterns extending in the first direction, and overlapping a first set of gridlines extending in the first direction. Generating the second standard cell layout design includes generating a second set of conductive feature layout patterns extending in the first direction and overlapping a second set of gridlines extending in the first direction. A side of a first cut feature layout pattern extending in the first direction is aligned with a first gridline of the first or second set of gridlines.

Abstract: A semiconductor device includes several first cell rows extending in a first direction, each of the first cell rows having a first row height; several second cell rows extending in the first direction, each of the second cell rows having a second row height smaller than the first row height, wherein the first cell rows and the second cell rows are interlaced; a first cell arranged in a first row of the first cell rows; and at least one second cell arranged in at least one row of the second cell rows, wherein the at least one second cell abuts the first cell in a second direction different from the first direction, wherein the at least one second cell and at least one circuit component included in the first cell have the same operation configuration.

Abstract: An integrated circuit includes at least one source/drain (S/D) line extending in second direction in a cell of the integrated circuit. The integrated circuit further includes a conductive element extending in a first direction in the cell of the integrated circuit, the first direction being perpendicular to the second direction. The integrated circuit further includes a power rail extending over the conductive element, wherein the power rail includes a first power rail portion and a second power rail portion, and an inner edge of the first power rail portion is offset from an inner edge of the second power rail portion, wherein the first power rail portion has a first edge and the second power rail portion has a second edge on the same side as the first edge of the first power rail portion, and the first edge and the second edge are laterally separated.

Abstract: The present disclosure relates to a culturing patch, culturing method, culture test method, culture test device, drug test method, and drug test device, and the culturing patch according to an aspect of the present disclosure includes component required for growth of an object to be cultured, and a mesh structural body provided in a mesh structure forming micro-cavities in which the component required for growth are contained that is configured to come into contact with a reaction region in which the object to be cultured is placed and provide some of the contained component required for growth to the reaction region.

Abstract: A semiconductor device having a standard cell, includes a first power supply line, a second power supply line, a first gate-all-around field effect transistor (GAA FET) disposed over a substrate, and a second GAA FET disposed above the first GAA FET. The first power supply line and the second power supply line are located at vertically different levels from each other.

Abstract: A method includes reserving a routing track within a cell, wherein the cell comprises signal lines for connection to elements within the cell, the cell further comprises a plurality of routing tracks, the reserved routing track is one of the plurality of routing tracks, and the reserved routing track is free of the signal lines. The method further includes determining whether any power rails overlap with any of the plurality of routing tracks other than the reserved routing track. The method further includes adjusting a position of the cell in response to a determination that at least one power rail overlaps with at least one routing track of the plurality of routing tracks other than the reserved routing track.

Abstract: In at least one cell region, a semiconductor device includes fin patterns and at least one overlying gate structure. The fin patterns (dummy and active) are substantially parallel to a first direction. Each gate structure is substantially parallel to a second direction (which is substantially perpendicular to the first direction). First and second active fin patterns have corresponding first and second conductivity types. Each cell region, relative to the second direction, includes: a first active region which includes a sequence of three or more consecutive first active fin patterns located in a central portion of the cell region; a second active region which includes one or more second active fin patterns located between the first active region and a first edge of the cell region; and a third active region which includes one or more second active fin patterns located between the first active region and a second edge of the cell region.

Abstract: A turbine exhaust unit supporting device that supports a turbine exhaust unit is provided. The turbine exhaust unit supporting device installed at a rear side of a turbine casing to support a turbine exhaust unit through which exhaust gas passing through a turbine is discharged, the supporting device includes a casing supporting block unit installed on an outer circumferential surface of the turbine casing, an exhaust unit supporting block unit spaced apart from the casing supporting block unit and installed on an outer circumferential surface of the turbine exhaust unit, and a rotary coupler including a first end rotatably coupled to the casing supporting block unit and a second end rotatably coupled to the exhaust unit supporting block unit.

Abstract: The present disclosure describes an example method for routing a standard cell with multiple pins. The method can include modifying a dimension of a pin of the standard cell, where the pin is spaced at an increased distance from a boundary of the standard cell than an original position of the pin. The method also includes routing an interconnect from the pin to a via placed on a pin track located between the pin and the boundary and inserting a keep out area between the interconnect and a pin from an adjacent standard cell. The method further includes verifying that the keep out area separates the interconnect from the pin from the adjacent standard cell by at least a predetermined distance.

Abstract: A method for designing an integrated circuit includes steps of selecting a power rail of a cell, determining that a clearance distance for an electrical connection to or around the power rail is not sufficient to fit the electrical connection, selecting a power rail portion of the power rail for modification, and modifying a shape of the power rail portion to provide a clearance distance sufficient to fit the electrical connection. As clearance distances between features in an interconnection structure of an integrated circuit become smaller, manufacturing becomes more difficult and error-prone. Increasing clearance distances improves manufacturability of an integrated circuit. Modifying the shape of an integrated circuit power rail increases clearance distance to and/or around a power rail.

Abstract: An integrated circuit is disclosed, including a first conductive pattern and a second conductive pattern that are disposed in a first layer and extend in a first direction, at least one first conductive segment disposed in a second layer different from the first layer, and at least one via disposed between the first layer and the second layer. The at least one via is coupled between the at least one first conductive segment and one or both of the first conductive pattern and the second conductive pattern, at an output node of the integrated circuit. The at least one via comprises a tapered shape with a width that decreases from a first width to a second width narrower than the first width. The first width of the at least one via is greater than widths of the first conductive pattern and the second conductive pattern.

Abstract: An IC layout diagram generation system includes a processor and a non-transitory, computer readable storage medium including computer program code for one or more programs. The non-transitory, computer readable storage medium and the computer program code are configured to, with the processor, cause the system to align a border segment of a cell at a predetermined location relative to a plurality of second metal layer tracks, position the cell relative to a first metal layer cut region alignment pattern based on the plurality of second metal layer tracks, overlap the cell with a first metal layer cut region based on the first metal layer cut region alignment pattern, and generate an IC layout diagram of an IC device based on the cell and the first metal layer cut region.