Abstract: Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.

Abstract: Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a hybrid interposer with a first region and a second region. The first region is comprised of glass or low thermal conductive materials, and the second region is comprised of silicon or diamond materials. The semiconductor package includes a first die on the first region of the hybrid interposer, a second die on the second region of the hybrid interposer, and an integrated heat spreader over the first die, the second die, and the hybrid interposer. The hybrid interposer includes first and second interconnects, where the first interconnects vertically extend from a bottom surface of the first region to a top surface of the first region, and where the second interconnects vertically extend from a bottom surface of the second region to a top surface of the second region. The first interconnects are through-glass vias, and the second interconnects are through-silicon vias.

Abstract: A method and a system of deploying an ignition interlock device (IID). The method comprises receiving a time series of breath alcohol content (BrAC) measurements that are unitarily sourced from a pre-identified user, each BrAC measurement of the time series including an alveolar breath component and an interferent breath component; estimating a dissipation rate of alcohol attributable to the pre-identified user in accordance with the time series of BrAC measurements; determining, responsive to estimating the dissipation rate of alcohol, at least a subset of the BrAC measurements as being based on the alveolar breath component but not the interferent breath component; and performing one of triggering and not triggering the IID into a lockout state based on the at least a subset of the BrAC measurements.

Abstract: Embodiments of the disclosure include an electrical assembly. The electrical assembly can include a converter including a DC side and an AC side, the DC side configured for connection to a DC network, the AC side configured for connection to an AC network, the converter including at least one switching element; a circuit interruption device operably connected to the AC side of the converter; a DC voltage modification device operably connected to the DC side of the converter, the DC voltage modification device including a DC chopper; and a controller configured to selectively control the or each switching element, the circuit interruption device and the DC voltage modification device, wherein the controller is configured to be responsive to a converter internal fault by carrying out a fault operating mode.

Abstract: A shear panel construction includes a patterned upper sheet metal panel including a planar section and having a plurality of upwardly protruding portions defining first strengthening crossbar sections extending upward from the planar section, the planar section of the patterned upper sheet metal panel extends to an edge of the patterned upper sheet metal panel. A patterned lower sheet metal panel is secured to a bottom surface of the patterned upper sheet metal panel, the patterned lower sheet metal panel having a plurality of protruding portions defining second strengthening crossbar sections.

Abstract: Embodiments disclosed herein include semiconductor dies and methods of forming such dies. In an embodiment, the semiconductor die comprises a semiconductor substrate, an active device layer in the semiconductor substrate, where the active device layer comprises one or more transistors, an interconnect layer over a first surface of the active device layer, a first bonding layer over a surface of the semiconductor substrate, a second bonding layer secured to the first bonding layer, and a heat spreader attached to the second bonding layer.

Abstract: A method and a system of deploying an ignition interlock device (IID). The method comprises receiving a time series of breath alcohol content (BrAC) measurements that are unitarily sourced from a pre-identified user, each BrAC measurement of the time series including an alveolar breath component and an interferent breath component; estimating a dissipation rate of alcohol attributable to the pre-identified user in accordance with the time series of BrAC measurements; determining, responsive to estimating the dissipation rate of alcohol, at least a subset of the BrAC measurements as being based on the alveolar breath component but not the interferent breath component; and performing one of triggering and not triggering the IID into a lockout state based on the at least a subset of the BrAC measurements.

Abstract: Embodiments disclosed herein comprise a die and methods of forming a die. In an embodiment, a die comprises, a die substrate, wherein the die substrate has a first thermal conductivity, and a first layer over the die substrate, wherein the first layer has a second thermal conductivity that is greater than the first thermal conductivity. In an embodiment, the die further comprises a second layer over the first layer, wherein the second layer comprises transistors.

Abstract: Embodiments disclosed herein include semiconductor dies and methods of forming such dies. In an embodiment, the semiconductor die comprises a semiconductor substrate, an active device layer in the semiconductor substrate, where the active device layer comprises one or more transistors, an interconnect layer over a first surface of the active device layer, a first bonding layer over a surface of the semiconductor substrate, a second bonding layer secured to the first bonding layer, and a heat spreader attached to the second bonding layer.

Abstract: Disclosed herein are vented lids for integrated circuit (IC) packages, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A vent may extend between the interior surface and the exterior surface of the lid, and the vent may at least partially overlap the die.

Abstract: Devices, systems, and methods for filter life prediction for an aspirating smoke detector are described herein. In some examples, one or more embodiments include a computing device comprising a memory and a processor to execute instructions stored in the memory to log operational data of the aspirating smoke detector for a first time period to generate an initial data set, fit a machine learning model to the initial data set, and determine, based on the machine learning model, a remaining useful life of the filter.

Abstract: Embodiments disclosed herein include electronic packages and thermal solutions for such electronic packages. In an embodiment, an electronic package comprises, a package substrate with a first surface, a second surface opposite from the first surface, and a sidewall surface connecting the first surface to the second surface. In an embodiment, the electronic package further comprises a heat spreader, where a first portion of the heat spreader is attached to the first surface of the package substrate and a second portion of the heat spreader is attached to the second surface of the package substrate. In an embodiment, a third portion of the heat spreader adjacent to the sidewall surface of the package substrate connects the first portion of the heat spreader to the second portion of the heat spreader.

Abstract: Non-invasive methods of risk stratification and treatment of bladder cancer in a subject are based on evaluating D-dimer in a urine sample of the subject, and assay systems thereof for evaluation of D-dimer in the urine sample.

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises an interposer, a first die attached to the interposer, and a second die attached to the interposer. In an embodiment, the electronic package further comprises a heatsink thermally coupled to the first die and the second die. In an embodiment, the heatsink has a first surface facing away from the first die and the second die and a second surface facing the first die and the second die. In an embodiment, the heatsink comprises a thermal break between the first die and the second die.

Abstract: The present invention provides a high voltage direct current (HVDC) transmission system (300, 600) comprising: a first station (102) comprising series-connected first and second HVDC converters (110, 130); a second station (104) comprising series-connected third and fourth HVDC converters (150, 170), wherein a neutral node (164) coupling the third HVDC converter (150) to the fourth HVDC converter (170) is coupled to earth; a first transmission line (200) connecting a positive node (114) of the first HVDC converter (110) to a corresponding positive node (154) of the third HVDC converter (150), wherein a first pole (240) of the system (300, 600) comprises the first HVDC converter (110), the third HVDC converter (150) and the first transmission line (200); a second transmission line (210) connecting a negative node (138) of the second HVDC converter (130) to a corresponding negative node (178) of the fourth HVDC converter (170), wherein a second pole (250) of the system (300, 600) comprises the second HVDC conve

Abstract: The present solution, approach or method, including an end-to-end automated data pipeline for data ingestion, storage, analysis, deployment, and a machine learning model maintenance. The present solution, approach or method, which computes a baseline using machine learning methods, may help in the following ways. Accurate real time estimation may help evaluate the deviation in the actual energy consumption, effectively identifying underlying root causes for an increase in actual consumption, as compared to the estimated energy. Triangulating the time of day and place of high energy consumption results in quicker resolution. Accurately quantifying energy savings may be helpful. Forecasting energy consumption in the future, may enable planning for future energy needs. Energy saving calculations may be done by comparing actual consumption versus baseline predicted consumption based for a specific baseline period.

Abstract: Embodiments may relate to a microelectronic package that includes a die coupled with a package substrate. A plurality of solder thermal interface material (STIM) thermal interconnects may be coupled with the die and an integrated heat spreader (IHS) may be coupled with the plurality of STIM thermal interconnects. A thermal underfill material may be positioned between the IHS and the die such that the thermal underfill material at least partially surrounds the plurality of STIM thermal interconnects. Other embodiments may be described or claimed.

Abstract: Methods and systems are provided for predictive maintenance of a vehicle component. One method involves mapping a current instance of a component of a vehicle to one of plurality of degradation groups of prior lifecycles for other instances of the component based on a relationship between performance measurement data for the current instance and historical performance measurement data associated with that respective degradation group, obtaining contextual data associated with operation of the vehicle, and determining a maintenance recommendation for the current instance of the component based on the contextual data using a predictive maintenance model associated with the mapped degradation group.

Abstract: A converter including a first terminal and a second terminal, the first terminal configured for connection to a first network, the second terminal configured for connection to a second network; at least one switching module arranged to interconnect the first terminal and the second terminal, the switching module including at least one module switching element and at least one energy storage device, the module switching element and the energy storage device arranged to be combinable to selectively provide a voltage source, the switching module switchable to control a transfer of power between the first and second networks; the switching module including a discharge circuit, the discharge circuit including a discharge switching element and a discharge resistor, the discharge switching element switchable to switch the corresponding discharge resistor into and out of the corresponding switching module; and a controller configured to selectively control the switching of the discharge switching element.