Abstract: Embodiments include a microelectronic device package structure having a first die on the substrate. One or more additional dice are on the first die, and a thermal electric cooler (TEC) is on the first die adjacent at least one of the one or more additional dice. A dummy die is on the TEC, wherein the dummy die is thermally coupled to the first die.

Abstract: Embodiments herein relate to systems, apparatuses, processing, and techniques related to a first heat-conducting plate to be thermally coupled to a first heat source, a thermoelectric cooler (TEC) thermally coupled to the first plate, a second heat-conducting plate thermally coupled to the TEC and to be thermally coupled to a second heat source where the TEC is to at least partially thermally isolate the first plate from the second plate to reduce heat transfer from the first plate to the second plate.

Abstract: Heat dissipation techniques include using metal features having one or more slanted or otherwise laterally-extending aspects. The metal features include, for example, tilted metal pillars, or metal bodies or fillets having an angled or sloping sidewall, or other metal features that extend both vertically and laterally. Such metal features increase the effective heat transfer area significantly by spreading heat in the in-plane (lateral) direction, in addition to the vertical direction. In some embodiments, slanted trenches are formed in photoresist/mold material deposited over a lower die, using photolithography and a multi-angle lens, or by laser drilling mold material deposited over the lower die. The trenches are then filled with metal. In other embodiments, metal features are printed on the lower die, and then molding material is deposited over the printed features. In any such cases, heat is conducted from a lower die to an upper die and/or an integrated heat spreader.

Abstract: Disclosed herein are thermal assemblies for multi-chip packages (MCPs), as well as related methods and devices. For example, in some embodiments, a thermal assembly for an MCP may include a heat pipe having a ring shape.

Abstract: A system, method and the like for front-end comprehensive validation of data files that require processing by multiple different computing systems having different validation requirements. Validation for all of the multiple different computing systems is performed upon receipt of the data file by the data processing entity and, as such, in the event that validation results in an error/failure, the originator/sender of the data file can be notified of the error failure proximate in time to when the data file is transmitted to the data processing entity and can re-submit a valid data file in due time. In addition, the present invention is configured to insure that the validation meets the current requirements of all the computing systems that process the data file by employing a centralized data file validation requirements database that stores validation requirements for each of the computing systems.

Abstract: A network where FC and Ethernet storage traffic share the underlying network. The network extends FC SAN storage specific attributes to Ethernet storage devices. The network is preferably formed of FC switches, so each edge switch acts as an FCoE FCF, with internal communications done using FC. IP packets are encapsulated in FC packets for transport. Preferably, either each outward facing switch port can be configured as an Ethernet or EC port, so devices can be connected as desired. FCoE devices connected to the network are in particular virtual LANs (VLANs). The name server database is extended to include VLAN information for the device and the zoning database has automatic FCOE_VLAN zones added to provide a mechanism for enhanced soft and hard zoning. Zoning is performed with the conventional zoning restrictions enhanced by including the factor that any FCoE devices must be in the same ULAN.

Abstract: Disclosed are a system, method and devices for simultaneous MACsec key agreement (MKA) negotiation between the devices. The present application controls a basic TLV message exchange between supplicant and authenticator in case of race condition to establish the secure association key (SAK) channel. The present application by controlling a basic TLV message exchange enables to establish a secure channel in race condition and achieves a high reliability of the product as this makes product launch MACsec services quickly and available for the service. Accordingly, when both sides (two supplicants) exchange hello with basic TLV at the same time, triggering the race condition, drops first message from the authenticator at supplicant and update the peer MN and the supplicant will not send reply. The authenticator when send next message (basic+potential peer TLV) with peer MN incremented by 1, the supplicant will respond with incremental message with live peer TLV.

Abstract: Disclosed herein is a display controller and display controller techniques to self-refresh a non-self-refresh display. The display controller can be configured to determine when display data is static. During periods where display data is static, the display controller can cache display data output in device memory and “refresh” the display data using the cached display data output. A display controller can receive a number of display data elements to be overlaid. The display controller can blend the display data elements into blended display data and can send the blended display data to a display. The display controller can determine whether the display data elements are static. The display controller can cache the blended display data based on determining that the display data elements are static and can send the cached blended display data to the display every refresh while the display data elements are no longer static.

Abstract: A network where FC and Ethernet storage traffic share the underlying network. The network extends FC SAN storage specific attributes to Ethernet storage devices. The network is preferably formed of FC switches, so each edge switch acts as an FCoE FCF, with internal communications done using FC. IP packets are encapsulated in FC packets for transport. Preferably, either each outward facing switch port can be configured as an Ethernet or FC port, so devices can be connected as desired. FCoE devices connected to the network are in particular virtual LANs (VLANs). The name server database is extended to include VLAN information for the device and the zoning database has automatic FCOE_VLAN zones added to provide a mechanism for enhanced soft and hard zoning. Zoning is performed with the conventional zoning restrictions enhanced by including the factor that any FCoE devices must be in the same VLAN.

Abstract: A network where FC and Ethernet storage traffic share the underlying network. The network extends FC SAN storage specific attributes to Ethernet storage devices. The network is preferably formed of FC switches, so each edge switch acts as an FCoE FCF, with internal communications done using FC. IP packets are encapsulated in FC packets for transport. Preferably, either each outward facing switch port can be configured as an Ethernet or FC port, so devices can be connected as desired. FCoE devices connected to the network are in particular virtual LANs (VLANs). The name server database is extended to include VLAN information for the device and the zoning database has automatic FCOE_VLAN zones added to provide a mechanism for enhanced soft and hard zoning. Zoning is performed with the conventional zoning restrictions enhanced by including the factor that any FCoE devices must be in the same VLAN.

Abstract: A network where FC and Ethernet storage traffic share the underlying network. The network extends FC SAN storage specific attributes to Ethernet storage devices. The network is preferably formed of FC switches, so each edge switch acts as an FCoE FCF, with internal communications done using FC. IP packets are encapsulated in FC packets for transport. Preferably, either each outward facing switch port can be configured as an Ethernet or FC port, so devices can be connected as desired. FCoE devices connected to the network are in particular virtual LANs (VLANs). The name server database is extended to include VLAN information for the device and the zoning database has automatic FCOE_VLAN zones added to provide a mechanism for enhanced soft and hard zoning. Zoning is performed with the conventional zoning restrictions enhanced by including the factor that any FCoE devices must be in the same VLAN.

Abstract: A network where FC and Ethernet storage traffic share the underlying network. The network extends FC SAN storage specific attributes to Ethernet storage devices. The network is preferably formed of FC switches, so each edge switch acts as an FCoE FCF, with internal communications done using FC. IP packets are encapsulated in FC packets for transport. Preferably, either each outward facing switch port can be configured as an Ethernet or FC port, so devices can be connected as desired. FCoE devices connected to the network are in particular virtual LANs (VLANs). The name server database is extended to include VLAN information for the device and the zoning database has automatic FCOE_VLAN zones added to provide a mechanism for enhanced soft and hard zoning. Zoning is performed with the conventional zoning restrictions enhanced by including the factor that any FCoE devices must be in the same VLAN.

Abstract: Triterpenoid drugs such as CDDO-Me can be used as to treat autoimmune diseases such as graft versus host disease, lupus, and lupus nephritis. Triterpenoid drugs can also be used to prevent the effects of an autoimmune disease.

Abstract: Systems and methods utilize an all-or-none switchover to prevent split-brain problems in a Multi-Chassis Link Aggregation Group (MC-LAG) network. A standby node in the MC-LAG network can perform the steps of remaining in a standby state responsive to a loss of adjacency with an active node, wherein, in the standby state, all standby links between the standby node and a common endpoint are non-distributing; monitoring frames transmitted by the common endpoint to the standby node over the standby links; and determining based on the monitoring frames whether all active links between the active node and the common endpoint have failed and entering an active state with all the standby links distributing based thereon.

Abstract: Systems and methods utilize an all-or-none switchover to prevent split-brain problems in a Multi-Chassis Link Aggregation Group (MC-LAG) network. A standby node in the MC-LAG network can perform the steps of remaining in a standby state responsive to a loss of adjacency with an active node, wherein, in the standby state, all standby links between the standby node and a common endpoint are non-distributing; monitoring frames transmitted by the common endpoint to the standby node over the standby links; and determining based on the monitoring frames whether all active links between the active node and the common endpoint have failed and entering an active state with all the standby links distributing based thereon.

Abstract: A process of depositing zirconium oxide (ZrO2) layers possessing dual properties of anti-reflection and passivation of silicon surfaces, including passivation of n-type and p-type silicon substrates. To grow a ZrO2 anti-reflection passivation layer, a precursor layer of zirconium oxide is spun on a silicon surface then dried, pyrolyzed and fired at suitable contact firing conditions, avoiding additional deposition. Thermal annealing in a hydrogen environment improves passivation quality of ZrO2 layer to a level 3-4 times higher than that of fired films alone. ZrO2 dielectric passivation layers exhibit improved passivation quality after illumination due to photo-enhanced passivation and higher passivation quality at higher thermal budget suitable for screen printed metal contact firing, unlike standard PECVD deposited passivation layers. The method is adaptable for fabrication of silicon solar cells and other structures utilizing passivated layers.

Abstract: Embodiments of the present invention provide path MTU discovery of a network path, such as an IPv4 network. According to various embodiments of the invention, a node receives a packet at a node along the network path between a source node and a destination node, compares a MTU size of a next hop along the network path with the size of the packet, responsive to the MTU size of the next hop along the network path being less than the size of the packet and responsive to the packet supporting path MTU discovery, the node truncates the packet to the MTU size of the next hop, stores the MTU size in the portion of the packet reserved for PMTU size, and forwards the packet.

Abstract: Disclosed herein is a display controller and display controller techniques to self-refresh a non-self-refresh display. The display controller can be configured to determine when display data is static. During periods where display data is static, the display controller can cache display data output in device memory and “refresh” the display data using the cached display data output. A display controller can receive a number of display data elements to be overlaid. The display controller can blend the display data elements into blended display data and can send the blended display data to a display. The display controller can determine whether the display data elements are static. The display controller can cache the blended display data based on determining that the display data elements are static and can send the cached blended display data to the display every refresh while the display data elements are no longer static.

Abstract: Thermoelectric coolers having solderless electrical interconnects, and semiconductor packages incorporating such thermoelectric coolers, are described. In an example, a thermoelectric cooler includes a solderless electrode electrically connecting a P-type semiconductor column to an N-type semiconductor column, and the solderless electrode is in direct contact with diffusion barrier layers separating the solderless electrode from the P-type and N-type semiconductor material layers of the semiconductor columns. Methods of manufacturing thermoelectric coolers having solderless electrical interconnects are also described.

Abstract: A fractional-N divider of a frequency synthesizer is driven by a dither-less and seed-less multi-stage noise shaping (MASH) modulator to alleviate fractional spurious tones introduced by the cyclic train of division ratios from delta-sigma modulators. The MASH modulator includes at least two cascaded dither-less delta-sigma modulators where each modulator includes a first feedback loop the generates the modulator feedback signal, a second feedback loop that disrupts fractional spurious tones and a third feedback loop that provides approximately zero static error. The MASH modulator further includes a combining circuit delays at least one code sequence from at least one of the delta-sigma modulators and that combines the code sequence generated by each of the delta-sigma modulators and at least one delayed code sequence.