Abstract: The disclosure relates to an electronic device including a device main portion and a handle portion. The handle portion is connected to the device main portion. The handle portion includes at least one cushioning unit and an outer sleeve. The at least one cushioning unit extends in a direction away from the device main portion, and the outer sleeve is sleeved on the at least one cushioning unit.

Abstract: The disclosure relates to an electronic device including a device main portion and a handle portion. The handle portion is connected to the device main portion. The handle portion includes at least one cushioning unit and an outer sleeve. The at least one cushioning unit extends in a direction away from the device main portion, and the outer sleeve is sleeved on the at least one cushioning unit.

Abstract: A metal-insulator-semiconductor-insulator-metal (MISIM) device includes a semiconductor layer, an insulating layer disposed over an upper surface of the semiconductor layer, a back electrode disposed over a lower surface of the semiconductor layer opposing the upper surface, and first and second electrodes disposed over the insulating layer and spaced-apart from each other.

Abstract: The disclosure relates to a holding device and an electronic device assembly and an electronic apparatus having the same. The holding device is able to hold an insertion device. At least one holding structure of the holding device includes a first holding portion and a second holding portion, and the second holding portion is located closer to the insertion opening than the first holding portion. The first holding portion is configured to hold the insertion device at an installed position, and the second holding portion is configured to hold the insertion device at a non-installed position.

Abstract: The present invention relates to data communication and electrical circuits. More specifically, embodiments of the present invention provide a clock and data recovery (CDR) architecture implementation for high data rate wireline communication links. In an embodiment, a CDR device includes a phase detector, a loop filter, and a fractional-N PLL. The fractional-N PLL generates output clock signal based on output of the loop filter. There are other embodiments as well.

Abstract: The present invention relates to data communication and electrical circuits. More specifically, embodiments of the present invention provide a clock and data recovery (CDR) architecture implementation for high data rate wireline communication links. In an embodiment, a CDR device includes a phase detector, a loop filter, and a fractional-N PLL. The fractional-N PLL generates output clock signal based on output of the loop filter. There are other embodiments as well.

Abstract: A locking structure includes a main body, a first combining portion, and a second combining portion. The second combining portion is disposed on an outer periphery of the main body. The first combining portion is connected to a bottom portion of the main body. A chamber is formed inside the first combining portion. At least one slot is formed on a side wall or a bottom wall of the first combining portion and communicated with the chamber. The chamber is at least partially filled with the workpiece via the at least one slot, and the workpiece is at least partially combined with an inner side and an outer side of the first combining portion, so as to combine the locking structure with the workpiece tightly.

Abstract: The disclosure relates to a holding device and an electronic device assembly and an electronic apparatus having the same. The holding device is able to hold an insertion device. At least one holding structure of the holding device includes a first holding portion and a second holding portion, and the second holding portion is located closer to the insertion opening than the first holding portion. The first holding portion is configured to hold the insertion device at an installed position, and the second holding portion is configured to hold the insertion device at a non-installed position.

Abstract: A metal-insulator-semiconductor-insulator-metal (MISIM) device includes a semiconductor layer, an insulating layer disposed over an upper surface of the semiconductor layer, a back electrode disposed over a lower surface of the semiconductor layer opposing the upper surface, and first and second electrodes disposed over the insulating layer and spaced-apart from each other.

Abstract: A substrate processing system includes a substrate processing set and a substrate holding unit. The substrate processing set includes a substrate supporting part for supporting a vertical substrate. The substrate holding unit includes two cantilevers and two substrate holding parts. Each of the substrate holding parts is respectively located on each of the cantilevers. The two substrate holding parts are used for holding the substrate vertically. When the substrate holding unit moves next to the substrate processing set and the two substrate holding parts touch the substrate, the two substrate holding parts hold the substrate.

Abstract: A metal-insulator-semiconductor-insulator-metal (MISIM) device includes a semiconductor layer, an insulating layer disposed over an upper surface of the semiconductor layer, a back electrode disposed over a lower surface of the semiconductor layer opposing the upper surface, and first and second electrodes disposed over the insulating layer and spaced-apart from each other.

Abstract: A locking structure includes a main body, a first combining portion, and a second combining portion. The second combining portion is disposed on an outer periphery of the main body. The first combining portion is connected to a bottom portion of the main body. A chamber is formed inside the first combining portion. At least one slot is formed on a side wall or a bottom wall of the first combining portion and communicated with the chamber. The chamber is at least partially filled with the workpiece via the at least one slot, and the workpiece is at least partially combined with an inner side and an outer side of the first combining portion, so as to combine the locking structure with the workpiece tightly.

Abstract: Provided herein is an apparatus, including a magnetically soft underlayer (SUL); an interlayer stack overlying the SUL, wherein the interlayer stack comprises a seed layer of an fcc material; and a perpendicular magnetic recording layer overlying the interlayer stack, wherein a thickness of the SUL in combination with a distance of the SUL from the perpendicular recording layer is sufficient to orient a total magnetic field corresponding to a magnetic transducer head at an angle of about 45°.

Abstract: A metal-insulator-semiconductor-insulator-metal (MISIM) device includes a semiconductor layer, an insulating layer disposed over an upper surface of the semiconductor layer, a back electrode disposed over a lower surface of the semiconductor layer opposing the upper surface, and first and second electrodes disposed over the insulating layer and spaced-apart from each other.

Abstract: A method for communication includes establishing multiple communication links over a packet network between a server and plurality of client computers that are to participate in a video teleconference. The client computers may also create secondary communication links that function similarly to links between the server and client computers. The server receives from the client computers uplink audio packets and uplink video packets, which respectively contain audio and video data captured by each of the client computers. The server mixes the audio data from the uplink audio packets so as to create respective streams of mixed audio data for transmission to the client computers and transmits to the client computers downlink audio packets containing the respective streams of mixed audio data. The server relays the video data to the client computers in downlink video packets. The client computers receive and synchronize the video data with the mixed audio data.

Abstract: A method for communication includes establishing multiple communication links over a packet network between a server and plurality of client computers that are to participate in a video teleconference. The client computers may also create secondary communication links that function similarly to links between the server and client computers. The server receives from the client computers uplink audio packets and uplink video packets, which respectively contain audio and video data captured by each of the client computers. The server mixes the audio data from the uplink audio packets so as to create respective streams of mixed audio data for transmission to the client computers and transmits to the client computers downlink audio packets containing the respective streams of mixed audio data. The server relays the video data to the client computers in downlink video packets. The client computers receive and synchronize the video data with the mixed audio data.

Abstract: A method for communication includes establishing multiple communication links over a packet network between a server and plurality of client computers that are to participate in a video teleconference. The client computers may also create secondary communication links that function similarly to links between the server and client computers. The server receives from the client computers uplink audio packets and uplink video packets, which respectively contain audio and video data captured by each of the client computers. The server determines the optimal bandwidth for each client computer. The server also mixes the audio data from the uplink audio packets so as to create respective streams of mixed audio data for transmission to the client computers and transmits to the client computers downlink audio packets containing the respective streams of mixed audio data. The server relays the video data to the client computers in downlink video packets.

Abstract: In an example, the present invention provides an analog to digital converter device for a high speed data transmission from 1 GS-s to 100 GS-s, although there can be other variations. In an example, the device has an input receiver device coupled to a transimpedance amplifier. In an example, the transimpedance amplifier is coupled to an input stream of data at 10 GHz to 100 GHz, or other variations.

Abstract: The instant disclosure relates to a hard disk quick release unit and a hard disk replacement module which includes a plurality of fixed guiding grooves and hard disk quick release units; each hard disk quick release unit includes a slidable guiding groove having at least a guiding member; at least a side fixing unit arranged adjacent to the outer side surface of the slidable guiding groove, the side fixing unit has a restricting groove, the guiding member engaged into the restricting groove for guiding the slidable guiding groove to move along a straight path; a cover board pivotally connected to the front end of the slidable guiding groove; and a resilient positioning member arranged on the front end of the slidable guiding groove, when the slidable guiding groove is moved to an exit position, the resilient positioning member engages with a side of the hard disk socket.

Abstract: A docking station suitable for connecting to a portable electronic device is provided. The docking station includes a main body, a connector, a cover, and an elastic sealing member. The connector is movably disposed in the main body for connecting the portable electronic device. The cover is detachably connected to the main body and has an opening for exposing the connector. The elastic sealing member is fit on the connector and abuts a side wall of the opening for preventing water from entering the main body.