Abstract: An exercise hoop has an outer loop, an inner loop and an adjustable centrifugal weight assembly. The inner loop is mounted rotatably in the outer loop. The adjustable centrifugal weight assembly is connected pivotally to the inner loop. The weight of the adjustable centrifugal weight assembly may be increased or decreased depending on different users. A beginner may use less weight and a skilled user more for tailored exercise.

Abstract: A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

Abstract: A waist exercising device has a waist cushion, a weight roundel and a centrifugal weight assembly. The weight roundel is mounted rotatably on the waist cushion and has a cavity defined in the weight roundel and a pivot shaft formed in the cavity. The centrifugal weight assembly is mounted in the cavity and has an arm and a weight. The arm is connected pivotally to the pivot shaft. The weight is connected to the arm and generates centrifugal force and has at least one detachable weight element. A beginner may use less weight elements and a skilled user more for tailored difficulty exercise.

Abstract: Systems and methods utilizing the network layer and/or application layer to provide security in distributed computing systems in order to thwart denial of service attacks. The systems and methods of the present invention utilize puzzles placed at the network layer level and/or application layer level to protect against denial of service attacks. Further, the systems and methods of the present invention advantageously provide a robust and flexible solution to support puzzle issuance at arbitrary points in the network, including end hosts, firewalls, and routers and thereby a defense against denial of service attacks.

Abstract: A constant temperature gas/liquid mixture generating system for using in wafer drying process includes: an interior tank; a first liquid supplying device for supplying liquid IPA to the interior tank; a gas supplying device for supplying nitrogen to the interior tank; an exhausting device for exhausting IPA and nitrogen mixture from said constant temperature gas/liquid mixture generating system; an exterior tank, surrounding the interior tank; a second liquid supplying device for supplying a second liquid to the exterior tank; a temperature control device for controlling the second liquid to be within a desired temperature range; and a draining device for draining the second liquid out of the exterior tank.

Abstract: An avalanche photodiode is operated in avalanche mode at a selected reverse bias that achieves high gain and a reduced gain normalized dark current.

Abstract: A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed from epoxy-bonded single-crystalline silicon wafer as its cap, epoxy and deposited metal or insulator as at least part of its sidewall, on substrate wafers.

Abstract: A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

Abstract: A structure for reducing stress for vias and a fabricating method thereof are provided. One or more wires or vias in the thickness direction are enframed with the use of a stress block in a lattice structure to be isolated from being directly contacted with the major portion of insulating materials with a high coefficient of thermal expansion. Thus, the shear stress resulting from temperature loading can be blocked or absorbed by the stress block.

Abstract: The present invention is related to a method for manufacturing micro-electro-mechanical systems (MEMS) having movable and stationary suspended structures formed from mono-crystalline silicon wafer or chip, bonded to a substrate wafer with an polymer adhesive layer that serves as spacer and as a sacrificial layer which is undercut by dry etch means. The substrate wafer contains electronic circuits for sensing and actuating the suspended structure by electrical means. Electrical interconnections between the suspended structures and the substrate can be made by etching through via holes in the suspended structure and the adhesive, depositing metal layers in the via holes, and removing the metal layers from outside the via holes. The metal layers in the via holes can also be used as pillars for supporting the suspended structures. This method can be used to manufacture inertial sensors.

Abstract: A charging device (1) for a camera flash includes a digital signal processor (10) providing a pulse width modulation signal and receiving a feedback signal, a voltage boosting circuit (20) electrically connected with the digital signal processor for outputting an induced current under the control of the pulse width modulation signal, a flash capacitor (40), and a charging circuit (30) electrically connected with the voltage boosting circuit and the flash capacitor for charging the flash capacitor by the induced current. The charging circuit includes a protection circuit (310) for protecting the flash capacitor and a feedback circuit (320) for outputting the feedback signal to the digital signal processor.

Abstract: A camera system with function of automatically coordinating flash intensity includes a lens, an image sensor, a focus system, a focus sensor and a control unit. The lens controls light amount that entrance into camera. The focusing system drives the lens to focus thereby forming a clear image on the image sensor. The focus sensor senses first step information of the focusing system during the focusing process, and sending the information to a control unit. The control unit transforms the result of the focusing system to a distance that the object apart from the camera, and configures out the guide number with the aperture number thereby calculating the flash intensity. The present camera systems may measure the distance that the objects apart from the camera, and low down the cost and power consumption. The camera systems may also precisely control the flash intensity thereby coordinating the exposure effect.

Abstract: A method for performing an efficient handoff of a wireless endpoint to an access point in a wireless network environment includes measuring a number of stations utilizing the access point, selecting a broadcast count of the wireless endpoint according to the number of stations, selecting a retry count of the access point according to the number of stations, and performing the handoff of the wireless endpoint to the access point utilizing the selected broadcast count and retry count. The broadcast count corresponding to a number of probe request frames sent by the wireless endpoint to initiate the handoff of the wireless endpoint, and the retry count corresponding to a number of probe response frames sent by the access point to acknowledge receipt of the probe request frames.

Abstract: An embodiment of the present invention provides a method of manufacturing hermetic packaging for devices on a substrate wafer, comprising forming a plurality of adhesive rings on a cap wafer or the substrate wafer, bonding the cap wafer to the substrate wafer with an adhesive layer, forming trenches in the cap wafer and the adhesive rings along outer rim of the adhesive rings, and covering sidewall of the trenches by at least one deposited film to provide a diffusion barrier to moisture or gas.

Abstract: A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed from epoxy-bonded single-crystalline silicon wafer as its cap, epoxy and deposited metal or insulator as at least part of its sidewall, on substrate wafers.

Abstract: A current supply includes a current mirror arrangement having a feedback circuit. The current supply includes a current mirror input stage connected to a constant current source providing a reference current; a current mirror output stage providing an output current substantially mirroring the reference current; and a feedback circuit feeding back to the current mirror input stage a feedback signal representing perturbations in the output current to cause the output current to more accurately mirror the reference current. In one embodiment, a dummy current mirror output stage substantially mirrors the reference current, and the feedback circuit receives a signal from the dummy current mirror output stage, and in response thereto, supplies the feedback signal to the current mirror input stage to cause the output current to more accurately mirror the reference current.

Abstract: A system and method for manufacturing micro cavities at the wafer level using a unique, innovative MEMS (MicroElectroMechanical Systems) process, wherein micro cavities are formed, with epoxy bonded single-crystalline silicon membrane as cap and deposited and/or electroplated metal as sidewall, on substrate wafers. The epoxy is also the sacrificial layer. It is removed from within the cavity through small etch access holes etched in the silicon cap before the etch access holes are sealed under vacuum. The micro cavities manufactured therein can be used as pressure sensors or for packaging MEMS devices under vacuum or inert environment. In addition, the silicon membrane manufactured therein can be used to manufacture RF switches.

Abstract: A system and method for establishing and maintaining two-way peer-to-peer network communication between clients who are behind symmetric firewalls/NATs is presented (FIG. 7). In one exemplary embodiment, the inventive system discovery servers to ascertain the nature and port-mapping metrics of a given client's firewall/NAT. A systematic, multiple UDP Hole Punch method is employed for ports within a predicted range, and the source port of the first successful forwarding of an inbound packet is used by the client for subsequent outgoing traffic. Preferably, the method occurs symmetrically, thus ensuring that both clients' firewalls receive packets for which the source/destination ports and source/destination addresses fully-tuple-match with a previous client request originating from within the protected network, and therefore forwards packets to the respective clients successfully (peer-to-peer).

Abstract: The present invention is related to a method for manufacturing micro-electro-mechanical systems (MEMS) having movable and stationary suspended structures formed from mono-crystalline silicon wafer or chip, bonded to a substrate wafer with an polymer adhesive layer that serves as spacer and as a sacrificial layer which is undercut by dry etch means. The substrate wafer contains electronic circuits for sensing and actuating the suspended structure by electrical means. Electrical interconnections between the suspended structures and the substrate can be made by etching through via holes in the suspended structure and the adhesive, depositing metal layers in the via holes, and removing the metal layers from outside the via holes. The metal layers in the via holes can also be used as pillars for supporting the suspended structures. This method can be used to manufacture inertial sensors.