Abstract: An encoder module adapted for a robotic arm is provided and includes a bracket, a bearing embedded in the bracket, an adaptor ring embedded in the bearing, a circuit board fixed on the bracket and an encoder plate. The bracket includes a ring-shaped structure. The adaptor ring includes a ring-shaped flange portion and a protruding portion. The protruding portion is located adjacent to an inner periphery of the ring-shaped flange portion and protrudes from the ring-shaped flange portion. An outer periphery and an inner periphery of the bearing engage with an inner periphery of the ring-shaped structure and an outer periphery of the protruding portion respectively. The circuit board includes a detector. The encoder plate is fixed on the ring-shaped flange portion and located at a position corresponding to the detector and between the detector and the adaptor ring. The encoder module has less accumulated error and improved accuracy.

Abstract: The present disclosure relates to the field of remote controller technologies and discloses a protective cover for a control stick and a remote controller. The control stick protective cover includes: a first elastic member, where a first accommodation groove is provided in a middle of the first elastic member, and the first accommodation groove is configured to mount the control stick; a second elastic member, arranged around the first elastic member, where the second elastic member is fixed to a panel of the remote controller; and a buffer member, connected between the first elastic member and the second elastic member, where the buffer member is provided with a bent portion.

Abstract: A type of fragrant eyeglasses is revealed. The fragrant eyeglasses include an eyeglass body and a nose bridge which is arranged at the eyeglass body and provided with a mounting space for mounting fragrance tablets. At least one air inlet and at least one air outlet for guiding air flows are disposed on a front side and a rear side of the mounting space respectively. Thereby the fragrance tablet mounted in the nose bridge is just adjacent to the user's nose when the eyeglasses are fitted on bridge of user's nose by the nose bridge. Thus the user smells scents emanated from the fragrance tablet and feels refreshing and soothing. The air inlet and the air outlet not only help emanation of scents from the fragrance tablet, but also guide the scents to spread along with air flows induced by movements of people who while walking or riding bicycles.

Abstract: A semiconductor structure, including a substrate, a first well, a second well, a first doped region, a second doped region, a first gate structure, a first insulating layer, and a first field plate structure. The first and second wells are disposed in the substrate. The first doped region is disposed in the first well. The second doped region is disposed in the second well. The first gate structure is disposed between the first and second doped regions. The first insulating layer covers a portion of the first well and a portion of the first gate structure. The first field plate structure is disposed on the first insulating layer, and it partially overlaps the first gate structure. Wherein the first field plate structure is segmented into a first partial field plate and a second partial field plate separated from each other along a first direction.

Abstract: An unmanned aerial vehicle (UAV) includes a fuselage, a power driving unit, and an UAV arm. The UAV arm includes a cantilever, a mounting base, and a connecting portion. The mounting base is connected to a first end of the cantilever. The mounting base is configured for a power driving unit of the UAV to be mounted. The connecting portion is connected to a second end of the cantilever. The connecting portion is configured to be connected to the fuselage of the UAV. An upper end of a cross section of the cantilever is arc-shaped, and a lower end of the cross section of the cantilever is pointed. The cross section of the cantilever is a section perpendicular to a direction from the first end of the cantilever toward the second end of the cantilever.

Abstract: A touch screen, a display panel, and a vehicle diagnosis equipment. The touch screen (100) is applied to the vehicle diagnosis equipment. The touch screen (100) comprises: a touch assembly (20) and a metal support (40). The touch assembly (20) comprises a touch function layer (22) and a flexible circuit board (24). The touch function layer (22) is electrically connected to the flexible circuit board (24). The flexible circuit board (24) is provided with a first grounding portion (26). The first grounding portion (26) is electrically connected to the flexible circuit board (24). The metal support (40) is grounded, and the metal support (40) is provided with a second grounding portion (42). The first grounding portion (26) is electrically connected to the second grounding portion (42).

Abstract: A projection system and a control method thereof are provided. The projection system includes a projection module, a mmWave sensor, and a control circuit. The projection module projects an image beam to a projection surface. The mmWave sensor is configured to sense an object entering a sensing range and obtain a sensing result. The control circuit is coupled to the projection module and the mmWave sensor, and the control circuit controls the projection module to provide the image beam according to the sensing result of the mmWave sensor.

Abstract: A method of forming a semiconductor device, comprising: forming a first conductive layer on an active device of a substrate; forming a dielectric layer on the first conductive layer; forming a through hole passing through the dielectric layer to expose a portion of the first conductive layer; conformally depositing a glue layer in the through hole to cover the portion of the first conductive layer comprising: forming a plurality of isolated lattices in an amorphous region at which the isolated lattices are uniformly distributed and extend from a top surface of the glue layer and terminate prior to reach a bottom of the glue layer, wherein the glue layer has a predetermined thickness; depositing a conductive material on the glue layer within the through hole, thereby forming a contact via; and forming a second conductive layer on the contact via over the first conductive layer.

Abstract: The present disclosure provides a method and apparatus for deconvolving feature data using convolution hardware. The method includes: reading a feature map and deconvolution kernel into on-chip memory, and padding zeroes to the feature map; determining convolution kernels based on the deconvolution kernel; removing a row and/or column of each convolution kernel whose elements all are invalid weights, to obtain an optimized convolution kernel, and removing a corresponding row and/or column in the zero-padded feature map to obtain an corresponding optimized feature map; convolving each optimized convolution kernel with corresponding optimized feature map using the multiply-add array, to obtain convolutional outputs; and interleaving and synthesizing the convolutional outputs to obtain an interleaving synthetic output including at least a deconvolutional output corresponding to the feature map and deconvolution kernel.

Abstract: An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.

Abstract: A semiconductor structure is provided. At least one first well region is disposed in a semiconductor substrate and has a first conductivity type. At least one gate of a transistor is disposed over the first well region and extends in a first direction. At least one second well region and at least one third well region are disposed on opposite sides of the first well region and extend in the first direction. The second and third well regions have a second conductivity type. A first shielding structure is disposed on at least one end of the gate and partially overlaps the first well region in a vertical projection direction. The first shielding structure is separated from the end of the gate. A bulk ring is disposed in the semiconductor substrate and surrounds the gate, the second well region, the third well region, and the first shielding structure.

Abstract: An image sensor with high quantum efficiency is provided. In some embodiments, a semiconductor substrate includes a non-porous semiconductor layer along a front side of the semiconductor substrate. A periodic structure is along a back side of the semiconductor substrate. A high absorption layer lines the periodic structure on the back side of the semiconductor substrate. The high absorption layer is a semiconductor material with an energy bandgap less than that of the non-porous semiconductor layer. A photodetector is in the semiconductor substrate and the high absorption layer. A method for manufacturing the image sensor is also provided.

Abstract: A chip package structure is provided. The chip package structure includes a first chip structure including a substrate and an interconnect layer over the substrate. The chip package structure includes a second chip structure over the interconnect layer. The chip package structure includes a first conductive bump connected between the interconnect layer and the second chip structure. The chip package structure includes a conductive pillar over the interconnect layer, wherein a first thickness of the conductive pillar is substantially equal to a sum of a second thickness of the second chip structure and a third thickness of the first conductive bump. The chip package structure includes a molding layer over the interconnect layer and surrounding the second chip structure, the first conductive bump, and the conductive pillar. The chip package structure includes a second conductive bump over a first surface of the conductive pillar.

Abstract: Disclosed are a storage device and method, an electronic device, and a storage medium. The device includes: a first splitting logical module for splitting a first access command into at least two second access commands based on an access address of the first access command; and at least two storage array modules, each of which is configured to perform a corresponding access operation based on one of the at least two second access commands of the first splitting logical module. According to the embodiments, the first access command with relatively long burst is split into second access commands with smaller granularity, and the at least two storage array modules are parallel accessed, whereby the at least two storage array modules can respond in parallel, effectively reducing response time of the first access command and access time of each master when parallel access of masters exists, then improving access efficiency.

Abstract: An electrostatic discharge (ESD) protection circuit including a detection circuit, a voltage-divider element, and a discharge element is provided. The detection circuit is coupled between a first power line and a second power line. In response to an ESD event, the detection circuit enables a turn-on signal. The voltage-divider element is coupled between the first power line and a third power line and receives the turn-on signal. The discharge element is coupled between the second and third power lines. In response to the turn-on signal being enabled, the first discharge element discharges an ESD current.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a gate disposed on the semiconductor substrate. The semiconductor device structure also includes a source doped region and a drain doped region on two opposite sides of the gate. The semiconductor device structure further includes a source protective circuit and a drain protective circuit. From a side perspective view, a first drain conductive element of the source protective circuit partially overlaps a first source conductive element of the drain protective circuit.

Abstract: A chip package structure is provided. The chip package structure includes a first chip structure including a substrate and an interconnect layer over the substrate. The chip package structure includes a second chip structure over the interconnect layer. The chip package structure includes a first conductive bump connected between the interconnect layer and the second chip structure. The chip package structure includes a conductive pillar over the interconnect layer. The chip package structure includes a molding layer over the interconnect layer and surrounding the second chip structure, the first conductive bump, and the conductive pillar. The chip package structure includes a second conductive bump over a first surface of the conductive pillar. The first surface faces away from the first chip structure.

Abstract: An ESD protection circuit includes a buffer circuit, a driving circuit, and a power-clamping circuit. The buffer circuit includes first and second transistors having a first conductivity type coupled in a cascade configuration between a first node and a first power supply node. A bonding pad is coupled to the first node. The drive circuit determines a state of at least one of the first and second transistors according to a control voltage. The drive circuit includes a third transistor having a second conductivity type, which is coupled between a second power supply node and a gate of the first transistor and is controlled by the control signal. The power-clamping circuit is coupled to the bonding pad and a gate of the third transistor at a second node. The control voltage is generated at the second node and determined by a voltage at the bonding pad.

Abstract: A backlight module includes a light guide plate, a light source, and an optical film. The light guide plate has a light incident surface and a light exiting surface opposite to the light incident surface, in which the light exiting surface has a normal line. The light source is adjacent to the light incident surface. The optical film is disposed to the light exiting surface and includes plural parallel prisms and plural microstructures. An extending direction of each of the prisms is perpendicular to the normal line, and each of the prisms faces the light exiting surface of the light guide plate. Each of the microstructures is located on a surface of the optical film which faces away from the light guide plate. Each of the microstructures has a pyramid structure with plural facets. The prisms are located between the microstructures and the light exiting surface.

Abstract: The present invention provides a lactic acid bacteria composition, which comprises: a Lactobacillus plantarum PL-02 strain, a Lactobacillus acidophilusTYCA06 strain, a Lactobacillus casei CS-773 strain, and a physiologically acceptable excipient, diluent, or carrier. All of the strains are deposited at the China General Microbiological Culture Collection Center.