Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.

Abstract: Embodiments of the present invention facilitate product defect detection. A computer-implemented method comprises: receiving, by a device operatively coupled to one or more processors, a template image of a normal product; generating, by the device, one or more geometric training parameters for transforming the template image; and transforming, by the device, the template image using the one or more geometric training parameters to generate a transformed image for training a data model, wherein the trained data model being used for aligning the template image and an image under inspection of a product.

Abstract: An electronic device is provided. The electronic device includes a driving substrate, a plurality of light-emitting units, and a protective layer. The light-emitting units are electrically connected to the driving substrate. The protective layer covers the light-emitting units, and the protective layer has a Young's modulus less than or equal to 20 MPa.

Abstract: A method of controlling chemical concentration in electrolyte includes measuring the chemical concentration in the electrolyte in a tank, wherein an end of an exhaust pipe is connected to a top of the tank; determining, by a valve moved along a top surface of the tank, a vapor flux through the exhaust pipe based on the measured chemical concentration; rotating, by using a motor connected to a ball screw connected to the valve, the ball screw to move a gate of the valve based on the determined vapor flux; electroplating, using the electrolyte provided by the tank, wafers respectively in a plurality of electroplating cells that are connected to the tank; and recycling the electrolyte to the tank.

Abstract: The invention provides a photoelectric sensor including a substrate and multiple pixel structures. The pixel structures are disposed on the substrate and arranged in an array. Each of the pixel structures includes a transistor and a photodiode. The photodiode includes a first electrode, a photosensitive layer, and a second electrode. The first electrode and the transistor are laterally arranged side by side. A first part of the photosensitive layer is disposed on the first electrode, and a second part of the photosensitive layer extends from the first part to above the transistor. The second electrode is disposed on the photosensitive layer, and is located above the first electrode and the transistor.

Abstract: Disclosed herein are compositions comprising a compound of Formula (I) and methods for treating or prophylaxis of porcine reproductive and respiratory syndrome (PRRS) therewith (I).

Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.

Abstract: A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a recess along a bottom portion. The recess has a recessed surface. The cap is positioned within the recess. The cap includes an annular wall secured to the polishing head and a floor joined to the annular wall at a joint. The floor extends across the annular wall, and the floor has an upper surface and a lower surface. The upper surface is spaced from the recessed surface to form a chamber therebetween. A deformation resistance of a portion of the floor proximate the joint is weakened to allow the portion of the floor proximate the joint to deflect relative to the polishing head by a change of pressure in the chamber.

Abstract: A method for annealing a wafer includes loading the wafer to a fork of a delivering robot in an annealing apparatus, wherein the wafer is in contact with a vibration-detecting sensor on the fork; rotating the fork between a heating plate and a cooling plate of the annealing apparatus; outputting, by the vibration-detecting sensor, a first signal in response to a motion of the fork of the delivering robot when the wafer is loaded on the fork; and providing, by a circuitry of the annealing apparatus, a response in response to the first signal.

Abstract: An electrostatic discharge (ESD) protection circuit including a detection circuit, a voltage-divider element, and a discharge element is provided. The detection circuit is coupled between a first power line and a second power line. In response to an ESD event, the detection circuit enables a turn-on signal. The voltage-divider element is coupled between the first power line and a third power line and receives the turn-on signal. The discharge element is coupled between the second and third power lines. In response to the turn-on signal being enabled, the first discharge element discharges an ESD current.

Abstract: A wheel hub motor includes a shaft, a stator unit and a rotating unit. The stator unit includes a coreless stator set. The rotating unit includes a rotating seat set sleeved on the shaft, a bearing set, and two rotor sets fixedly mounted to the rotating seat set. The rotating seat set defines a bearing mounting space adjacent to the shaft and receiving the bearing set therein, and a rotor space radially spaced apart from the bearing mounting space and receiving the rotor sets therein. The coreless stator set is disposed between the rotor sets such that, when being energized to generate a magnetic field, the rotor sets rotate about the shaft so as to drive the rotating seat set and the bearing set to rotate.

Abstract: A stirring device is adapted to be used for a water storage system. The stirring device includes a tube unit and a stirring unit. The tube unit includes a rigid tube member, and a flexible tube member adapted for interconnecting the rigid tube member and an inlet of the water storage system. The stirring unit includes a center rod extending rotatably into the rigid tube member along an longitudinal direction of the rigid tube member, a support subunit positioning the center rod within the rigid tube member, a driver fan subunit mounted to the center rod and adapted to be driven by water for actuating rotation of the center rod, and a stirring member mounted co-rotatably to the center rod and adapted for stirring sediments in the water.

Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.

Abstract: A method of controlling chemical concentration in electrolyte includes measuring a chemical concentration in an electrolyte, wherein the electrolyte is contained in a tank; and increasing a vapor flux through an exhaust pipe connected to the tank when the measured chemical concentration is lower than a control lower limit value.

Abstract: A polyester is formed by reacting a plurality of monomers. The monomers include 7 to 20 parts by mole of (a) aliphatic triol monomer, 40 to 80 parts by mole of (b) first diol monomer, 12 to 40 parts by mole of (c) second diol monomer, and 100 parts by mole of (d) aliphatic diacid monomer or aliphatic anhydride monomer. The (b) first diol monomer has a chemical structure of wherein each R1 is the same. The (c) second diol monomer has a chemical structure of wherein R6 is different from R7.

Abstract: A semiconductor device includes a substrate having a channel region; a gate stack over the channel region; a seal spacer covering a sidewall of the gate stack, the seal spacer including silicon nitride; a gate spacer covering a sidewall of the seal spacer, the gate spacer including silicon oxide, the gate spacer having a first vertical portion and a first horizontal portion; and a first dielectric layer covering a sidewall of the gate spacer, the first dielectric layer including silicon nitride.

Abstract: A voltage tracking circuit is provided and includes first and second P-type transistors and a voltage reducing circuit. The drain of the first P-type transistor is coupled to a first voltage terminal. The voltage reducing circuit is coupled between the first voltage terminal and the gate of the first P-type transistor. The voltage reducing circuit reduces a first voltage at the first voltage terminal by a modulation voltage to generate a control voltage and provides the control voltage to the gate of the first P-type transistor. The gate of the second P-type transistor is coupled to the first voltage terminal, and the drain thereof is coupled to a second voltage terminal. The source of the first P-type transistor and the source of the second P-type transistor are coupled to the output terminal of the voltage tracking circuit. The output voltage is generated at the output terminal.

Abstract: A circuit board includes a composite structure layer, at least one conductive structure, a thermally conductive substrate, and a thermal interface material layer. The composite structure layer has a cavity and includes a first structure layer, a second structure layer, and a connecting structure layer. The first structure layer includes at least one first conductive member, and the second structure layer includes at least one second conductive member. The cavity penetrates the first structure layer and the connecting structure layer to expose the second conductive member. The conductive structure at least penetrates the connecting structure layer and is electrically connected to the first conductive member and the second conductive member. The thermal interface material layer is disposed between the composite structure layer and the thermally conductive substrate, and the second structure layer is connected to the thermally conductive substrate through the thermal interface material layer.

Abstract: An antenna includes a ground layer, two polarization signal feeding terminals disposed on the ground layer, two polarization structures, four coupling metals and four radiating metals. The first polarization structure includes a first extending portion electrically connected to the first polarization signal feeding terminal and extends from a first channel to a second channel in a first direction over the ground layer. The second polarization structure includes a second extending portion electrically connected to the second polarization signal feeding terminal and extends from a third channel to a fourth channel in second direction over the ground layer, wherein the first extending portion crosses the second extending portion in a non-contact manner to define four regions. The four coupling metals are disposed on the first through the fourth regions, respectively. The four radiating metals are disposed on the first through the fourth channels, respectively.