Patents by Inventor Chang Huang

Chang Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Protection circuit
    Patent number: 11527884
    Abstract: A protection circuit including a detection circuit, a current discharge element, a first transistor, and a second transistor is provided. The detection circuit is coupled between a first pad and a second pad to detect ESD events. In response to an ESD event, the detection circuit sets the detection signal to a predetermined level. The current discharge element is coupled between the first and second pads. In response to the detection signal being at the predetermined level, the current discharge element is turned on so that the ESD current passes through the current discharge element. The first transistor is coupled between a core circuit and the second pad. The second transistor is coupled between the first transistor and the second pad. In response to the detection signal being at the predetermined level, the second transistor is turned on to turn off the first transistor.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: December 13, 2022
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chih-Hsuan Lin, Shao-Chang Huang, Yeh-Ning Jou, Hwa-Chyi Chiou, Ching-Ho Li
  • Methods for treating sarcopenia and maintaining or increasing muscle mass and muscle strength in elder subjects
    Patent number: 11524038
    Abstract: Disclosed herein is a composition including Lactobacillus plantarum TWK10 deposited at the China General Microbiological Culture Collection Center (CGMCC) under accession number CGMCC 13008 for use in treating sarcopenia and for use in maintaining and/or increasing muscle mass and/or strength in an elderly subject.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: December 13, 2022
    Assignee: SYNBIO TECH INC.
    Inventors: Chia-Chia Lee, Han-Yin Hsu, Chi-Chang Huang, Yi-Ju Hsu, Mon-Chien Lee
  • METHOD OF MANUFACTURING CIRCUIT BOARD
    Publication number: 20220377874
    Abstract: A method of manufacturing a circuit board is provided. The method includes forming an open substrate, in which the open substrate includes a substrate body having a top surface and a bottom surface; an opening in the substrate body, in which the opening has a first sidewall and a second sidewall opposite to the first sidewall; and at least one first fixing portion and at least one second fixing portion extending from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. A heat dissipation block is inserted in the opening to clamp the heat dissipation block between the first fixing portion and the second fixing portion, in which the heat dissipation block includes the heat dissipation block comprises a ceramic or a composite material.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 24, 2022
    Inventors: Chin-Sheng WANG, Pei-Chang HUANG
  • Light guide plate, backlight module and display device
    Patent number: 11500144
    Abstract: A light guide plate includes a main body, first stripe structures and second stripe structures. The main body has an optical surface, a light-incident surface and an opposite light-incident surface. The main body has a hole passing through the optical surface, and the optical surface has a first region and a second region which are separated by an imaginary line. The imaginary line intersects the hole. The hole has a first side near the opposite light-incident surface and a second side near the light-incident surface. A portion of each of the first stripe structures is disposed in the first region. The second stripe structures are disposed in the second region. An extending direction of at least one portion of each first stripe structure is vertical to the light-incident surface, and a portion of the second stripe structures extends to the first side of the hole near the opposite light-incident surface.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: November 15, 2022
    Assignees: Radiant Opto-Electronics (Suzhou) Co., Ltd., Radiant Opto-Electronics Corporation
    Inventors: Chia-Yin Chang, Po-Chang Huang, Kun-Cheng Lin
  • METHOD OF FORMING DEEP TRENCH ISOLATION IN RADIATION SENSING SUBSTRATE AND IMAGE SENSOR DEVICE
    Publication number: 20220359607
    Abstract: A method of forming a deep trench isolation in a radiation sensing substrate includes: forming a trench in the radiation sensing substrate; forming a corrosion resistive layer in the trench, in which the corrosion resistive layer includes titanium carbon nitride having a chemical formula of TiCxN(2-x), and x is in a range of 0.1 to 0.9; and filling a reflective material in the trench and over the corrosion resistive layer.
    Type: Application
    Filed: July 25, 2022
    Publication date: November 10, 2022
    Inventors: Chi-Ming LU, Chih-Hui HUANG, Jung-Chih TSAO, Yao-Hsiang LIANG, Chih-Chang HUANG, Ching-Ho HSU
  • Window blind assembly having transmission assist structure
    Patent number: 11492846
    Abstract: A window blind assembly includes a frame, an input shaft rotatably disposed in the frame, a blind unit, a winding unit for placing the blind unit in a retracted state when the input shaft is rotated in a first rotational direction and for shifting the blind unit to an expanded state when the input shaft is rotated in a second rotational direction, a control unit operable to drive rotation of the input shaft in the first and second rotational directions, a force-assisting unit having a spring capable of exerting a spring force on the control unit to resist the weight of the blind unit acting thereon, and a brake unit connected to the input shaft and generating a frictional force to resist rotation of the input shaft in the second rotational direction.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: November 8, 2022
    Assignee: TAICANG KINGFU PLASTIC MANUFACTURE CO., LTD.
    Inventor: Szu-Chang Huang
  • CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    Publication number: 20220352083
    Abstract: A chip package structure is provided. The chip package structure includes a first chip structure including a substrate and an interconnect layer over the substrate. The chip package structure includes a second chip structure over the interconnect layer. The chip package structure includes a first conductive bump connected between the interconnect layer and the second chip structure. The chip package structure includes a conductive pillar over the interconnect layer. The chip package structure includes a molding layer over the interconnect layer and surrounding the second chip structure, the first conductive bump, and the conductive pillar. The chip package structure includes a second conductive bump over a first surface of the conductive pillar. The first surface faces away from the first chip structure.
    Type: Application
    Filed: April 29, 2021
    Publication date: November 3, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Heh-Chang HUANG, Fu-Jen LI, Pei-Haw TSAO, Shyue-Ter LEU
  • LACTIC ACID BACTERIA COMPOSITION FOR REDUCING FAT AND PROMOTING EXERCISE PERFORMANCE AND USE THEREOF
    Publication number: 20220347238
    Abstract: The present invention provides a lactic acid bacteria composition, which comprises: a Lactobacillus plantarum PL-02 strain, a Lactobacillus acidophilusTYCA06 strain, a Lactobacillus casei CS-773 strain, and a physiologically acceptable excipient, diluent, or carrier.
    Type: Application
    Filed: July 19, 2021
    Publication date: November 3, 2022
    Inventors: Chi-Chang HUANG, Mon-Chien LEE, Yi-Ju HSU, Hsieh-Hsun HO, Yi-Wei KUO, Wen-Yang LIN, Jia-Hung LIN, Chi-Huei LIN
  • ELECTRONIC DEVICE, ELECTRONIC SYSTEM AND CONTROL METHOD
    Publication number: 20220343875
    Abstract: An electronic device, an electronic system, and a control method are provided. The electronic device includes a display, a memory, and a processor. The memory stores an audiovisual module and a control module. The processor receives initial image information from an external electronic device through a bridge device. The processor is coupled to the display and the memory. The processor executes the audiovisual module to transform the initial image information with a first image format into transformed image information with a second image format, which is compatible to the display. The processor controls the display to display according to the transformed image information. The processor executes the control module to receive a control signal for operating the transformed image information, and provide the control signal to the external electronic device through the bridge device.
    Type: Application
    Filed: September 24, 2021
    Publication date: October 27, 2022
    Applicant: ITE Tech. Inc.
    Inventors: Chia-Yu Wu, Kuan-Chang Huang, Jiun-Shiue Huang, Lee-Chun Guo, Chao-Hsun Huang, Chuan-Hou Hsu, Yao-Te Fang
  • SEMICONDUCTOR PACKAGE, INTEGRATED OPTICAL COMMUNICATION SYSTEM
    Publication number: 20220336309
    Abstract: A semiconductor package includes a substrate, a stacked structure, an encapsulation material, a lid structure, and a coupler. The stacked structure is disposed over and bonded to the substrate. The encapsulation material partially encapsulates the stacked structure. The lid structure is disposed on the substrate, wherein the lid structure surrounds the stacked structure and covers a top surface of the stacked structure. The coupler is bonded to the stacked structure, wherein a portion of the coupler penetrates through and extends out of the lid structure.
    Type: Application
    Filed: July 4, 2022
    Publication date: October 20, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sung-Hui Huang, Shang-Yun Hou, Tien-Yu Huang, Heh-Chang Huang, Kuan-Yu Huang, Shu-Chia Hsu, Yu-Shun Lin
  • Semiconductor device structure comprising source and drain protective circuits against electrostatic discharge (ESD)
    Patent number: 11476207
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a gate disposed on the semiconductor substrate. The semiconductor device structure also includes a source doped region and a drain doped region on two opposite sides of the gate. The semiconductor device structure further includes a source protective circuit and a drain protective circuit. From a side perspective view, a first drain conductive element of the source protective circuit partially overlaps a first source conductive element of the drain protective circuit.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: October 18, 2022
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Jian-Hsing Lee, Shao-Chang Huang, Chih-Hsuan Lin, Yu-Kai Wang, Karuna Nidhi, Hwa-Chyi Chiou
  • INTERCONNECT STRUCTURE FOR INSERTION LOSS REDUCTION IN SIGNAL TRANSMISSION AND METHOD THEREOF
    Publication number: 20220319865
    Abstract: An interconnect structure for insertion loss reduction in signal transmission and a method thereof are disclosed. In an embodiment, an interconnect is formed on a substrate by chemical etching process, and when the interconnect is protected by photoresist in chemical etching process, the etching direction of etching solution is not oriented, so undercut areas are respectively formed on both sides of a bottom of the interconnect at contact of the interconnect and the substrate because of etching solution residue after the etching process. An included angle formed in the undercut area between the interconnect and the substrate is defined as an etch angle, and a length of the portion, exposing in the undercut area, of the substrate is defined as an etch length. Controlling sizes of the etch angle and the etch length can reduce an insertion loss in signal transmission.
    Type: Application
    Filed: August 31, 2021
    Publication date: October 6, 2022
    Inventors: Cheng EN HO, Shun Cheng CHANG, Jun Chou YU, Cheng Yu LEE, Chien Chang HUANG
  • Cooling mechanism between linear motor rotor and platform coupled thereto
    Patent number: 11462970
    Abstract: The present invention provides a cooling mechanism between a linear motor rotor and a platform coupled thereto, characterized essentially in that a cooling portion is provided between the rotor and the platform, and further in that heat transfer is blocked between the cooling portion and the platform, thereby preventing heat received by the cooling portion during heat dissipation from being transferred to the platform, so as to ensure the precision of the platform.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: October 4, 2022
    Assignee: HIWIN MIKROSYSTEM CORP.
    Inventors: Min-Chang Huang, Cheng-Te Chi, Chao-Chin Teng
  • Method and apparatus for adapting parameters of neural network
    Patent number: 11461632
    Abstract: Disclosed are a method and an apparatus for adapting parameters of a neural network. The method includes selecting one or more dimensions for a weight parameter of each of at least one layer of the neural network, determining a dimension value and a corresponding target value in each dimension of the weight parameter, and padding the weight parameter in a case where the dimension value in at least one dimension of the weight parameter is less than the corresponding target value, the dimension value in each dimension of the weight parameter after the padding being equal to the corresponding target value.
    Type: Grant
    Filed: April 23, 2018
    Date of Patent: October 4, 2022
    Assignee: Nanjing Horizon Robotics Technology Co., Ltd.
    Inventors: Kun Ling, Liang Chen, Jianjun Li, Delin Li, Chang Huang
  • THERMAL CONDUCTIVE FILLER AND PREPARATION METHOD THEREOF
    Publication number: 20220289940
    Abstract: A method to prepare a thermal conductive filler, particularly a thermal conductive filler for preparation of a thermal conductive material with reduced viscosity, comprising the step of dry mixing a platelet boron nitride with a fumed silica or a fumed metal oxide with a primary particle size of 1-200 nm. A thermal conductive filler, a thermal conductive material and an electronic device are also provided.
    Type: Application
    Filed: August 24, 2020
    Publication date: September 15, 2022
    Applicant: EVONIK OPERATIONS GMBH
    Inventors: Shuangquan HU, Yuan-Chang HUANG
  • Method of making colloidal selenium nanoparticles
    Patent number: 11439979
    Abstract: Provided is a method of making colloidal selenium nanoparticles. The method includes the steps as follows: Step (A): providing a reducing agent and an aqueous solution containing a selenium precursor; Step (B): mixing the aqueous solution containing the selenium precursor and the reducing agent to form a mixture solution in a reaction vessel and heating the mixture solution to undergo a reduction reaction and produce a composition containing selenium nanoparticles, residues and a gas, and guiding the gas out of the reaction vessel, wherein an amount of the residues is less than 20% by volume of the mixture solution; and Step (C): dispersing the selenium nanoparticles with a medium to obtain the colloidal selenium nanoparticles. The method has advantages of simplicity, safety, time-effectiveness, cost-effectiveness, high yield and eco-friendliness.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: September 13, 2022
    Assignee: TRIPOD NANO TECHNOLOGY CORPORATION
    Inventors: Chung-Jung Hung, Chun-Lun Chiu, Chia-Chi Chang, Hsin-Chang Huang, Teng-Chieh Hsu, Meng-Hsiu Chih, Jim-Min Fang
  • Circuit board having heat-dissipation block and method of manufacturing the same
    Patent number: 11445596
    Abstract: A circuit board includes an open substrate and a heat dissipation block. The open substrate includes a substrate body, an opening and at least one first fixing portion and at least one second fixing portion. The substrate body has a top surface and a bottom surface. The opening is in the substrate body and has a first sidewall and a second sidewall opposite to the first sidewall. The first fixing portion and the second fixing portion extends from the substrate body toward the opening, in which the first fixing portion and the second fixing portion are respectively protruded from the first sidewall and the second sidewall. The heat dissipation block is directly clamped between the first fixing portion and the second fixing portion.
    Type: Grant
    Filed: January 20, 2021
    Date of Patent: September 13, 2022
    Assignee: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Pei-Chang Huang
  • PROTECTION CIRCUIT
    Publication number: 20220285932
    Abstract: A protection circuit including a detection circuit, a current discharge element, a first transistor, and a second transistor is provided. The detection circuit is coupled between a first pad and a second pad to detect ESD events. In response to an ESD event, the detection circuit sets the detection signal to a predetermined level. The current discharge element is coupled between the first and second pads. In response to the detection signal being at the predetermined level, the current discharge element is turned on so that the ESD current passes through the current discharge element. The first transistor is coupled between a core circuit and the second pad. The second transistor is coupled between the first transistor and the second pad. In response to the detection signal being at the predetermined level, the second transistor is turned on to turn off the first transistor.
    Type: Application
    Filed: March 8, 2021
    Publication date: September 8, 2022
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chih-Hsuan LIN, Shao-Chang HUANG, Yeh-Ning JOU, Hwa-Chyi CHIOU, Ching-Ho LI
  • Apparatus for performing convolution operations in a convolutional neural network
    Patent number: 11429836
    Abstract: Disclosed is an apparatus for performing a convolution operation in a convolutional neural network. The apparatus may comprise a selector for selecting one or more nonzero elements of a weight parameter, a selector for selecting a data item(s) corresponding to selected nonzero elements in input feature data, and a calculator unit for performing an operation. The apparatus may realize the convolution operation in a sparsified convolutional neural network efficiently through the hardware.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: August 30, 2022
    Assignee: NANJING HORIZON ROBOTICS TECHNOLOGY CO., LTD.
    Inventors: Chang Huang, Liang Chen, Heng Luo, Kun Ling, Honghe Tan
  • WIND TURBINE WITH A FLOW DEFLECTION UNIT
    Publication number: 20220260052
    Abstract: A wind turbine includes an axle unit having a tubular hub which is rotatably sleeved around an inner tube, a blade unit rotatable by a wind power in an operational direction and including a plurality of blades which are connected with the hub, and each of which has a wind hole formed at a root end thereof adjacent to the hub axis, and a flow deflection unit including a deflection plate which is disposed corresponding with the wind holes and connected with the inner tube. The deflection plate extends and is curved along the operational direction to collect and deflect wind flow toward the blades so as to generate a larger torque of the blades to enhance the rotating efficiency.
    Type: Application
    Filed: February 15, 2022
    Publication date: August 18, 2022
    Inventor: Kuo-Chang HUANG