Patents by Inventor Chen Chu

Chen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240241420
    Abstract: A display device includes a driving substrate, a display medium layer and a material layer. The display medium layer is disposed on the driving substrate. The material layer is disposed on a side of the display medium layer, and extends to the driving substrate. The material layer is a material layer with conductivity properties.
    Type: Application
    Filed: December 28, 2023
    Publication date: July 18, 2024
    Applicant: E Ink Holdings Inc.
    Inventors: Ling-Chiang Chu, Wei-Sung Cheng, Ming-Huan Yang, Chen Chu Tsai, Yen-Ze Huang, Jen-Shiun Huang
  • Publication number: 20240197015
    Abstract: An end cap assembly for a strap is provided. The end cap assembly includes an end closure and slider. The end closure has a base, a pair of spaced apart arms extending from the base, and a locking element connected to at least one of the pair of spaced apart arms. The base and pair of spaced apart arms define a holder for receiving the strap. The slider has a body defining a cavity from a first to a second end of the body, the cavity sized to receive the strap. The slider is moveable between an unlocked and a locked position. In the unlocked position, the slider body is slideable along a length of the strap. In the locked position, a first end of the slider is adjacent to the base of the end closure and the locking element of the end closure is engaged with the slider.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 20, 2024
    Inventors: Warren Christopher Howren CHENG, Rosanna Yuet-Yu FUNG, I-Ting HO, Yuxiang ZHANG, Ting Chen CHU
  • Patent number: 12002709
    Abstract: The present disclosure provides an interconnect structure, including a first metal line, a second metal line spaced away from the first metal line, a conductive contact over the first metal line, including a first portion, a second portion over the first portion, wherein a bottom width of the second portion is greater than a top width of the first portion, wherein a shortest distance between the second portion and the second metal line is in a range from 50 Angstrom to 200 Angstrom, and a third portion over the second portion, wherein a bottom width of the third portion is greater than a top width of the second portion, the entire first portion and the entire second portion are under a coverage of a vertical projection area of the third portion, a first layer, and a second layer over the first layer.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Hsiang-Wei Liu, Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang
  • Publication number: 20240171159
    Abstract: A level shifter can achieve a level shift by a wide margin. The level shifter includes a latch circuit, a protection circuit, and an input circuit. The latch circuit is coupled between a high-voltage terminal and the protection circuit. The protection circuit including a first protection transistor pair and a second protection transistor pair is set between the latch circuit and the input circuit, and is configured to prevent an excessive voltage drop between the input circuit and a pair of output terminals, wherein the pair of output terminals is set between the first and the second protection transistor pairs and used for outputting a pair of output signals. The input circuit includes an input transistor pair coupled between the second protection transistor pair and a low-voltage terminal and configured to operate according to a pair of input signals.
    Type: Application
    Filed: February 2, 2024
    Publication date: May 23, 2024
    Inventors: CHIEN-HUI TSAI, Hung-Chen Chu, Yung-Tai Chen
  • Publication number: 20240167204
    Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: Ying-Chi LIN, Wei-Hung CHEN, Li-Chen CHU, Rih-Sheng CHIANG
  • Publication number: 20240158968
    Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.
    Type: Application
    Filed: January 25, 2024
    Publication date: May 16, 2024
    Inventors: Ying-Chi LIN, Wei-Hung CHEN, Li-Chen CHU, Rih-Sheng CHIANG
  • Patent number: 11979130
    Abstract: A transmitter circuit is provided. The transmitter circuit has a first transmission node and a second transmission node and includes a first resistor, a second resistor, a third resistor, a fourth resistor, and a driving circuit. The driving circuit includes a first transistor group, a second transistor group, a third transistor group, and a fourth transistor group. The first resistor is coupled between a first output terminal and the first transmission node. The second resistor is coupled between a second output terminal and the second transmission node. The third resistor is coupled between a third output terminal and the first transmission node. The fourth resistor is coupled between a fourth output terminal and the second transmission node. The first, second, third, and fourth transistor groups are coupled to a first and a second reference voltages and electrically connected to the first, second, third, and fourth output terminals, respectively.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: May 7, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Hung-Chen Chu, Chien-Hui Tsai, Yung-Tai Chen
  • Patent number: 11966614
    Abstract: A system, method, and machine-readable storage medium for restoring a data object for a specified active time period are provided. In some embodiments, the method includes receiving, by a storage device from a client, a request specifying an active time period for a data object to remain stored on an accessible tier. The method also includes determining, by the storage device, that the active time period has elapsed. The method further includes responsive to a determination that the active time period has elapsed, sending, by the storage device, a request to a server storing the data object to move the data object from the accessible tier to an archive tier. Data objects that are stored on the accessible tier are accessible by the client, and data objects that are stored on the archive tier are inaccessible by the client.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: April 23, 2024
    Assignee: NetApp, Inc.
    Inventors: Alvis Yung, Song Guen Yoon, Raymond Yu Shun Mak, Chia-Chen Chu, Dheeraj Sangamkar, Robin Mahony
  • Patent number: 11952690
    Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.
    Type: Grant
    Filed: December 1, 2021
    Date of Patent: April 9, 2024
    Assignee: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventors: Ying-Chi Lin, Wei-Hung Chen, Li-Chen Chu, Rih-Sheng Chiang
  • Publication number: 20240085803
    Abstract: Photolithography overlay errors are a source of patterning defects, which contribute to low wafer yield. An interconnect formation process that employs a patterning photolithography/etch process with self-aligned interconnects is disclosed herein. The interconnection formation process, among other things, improves a photolithography overlay (OVL) margin since alignment is accomplished on a wider pattern. In addition, the patterning photolithography/etch process supports multi-metal gap fill and low-k dielectric formation with voids.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu
  • Patent number: 11929747
    Abstract: A level shifter can achieve a level shift by a wide margin. The level shifter includes a latch circuit, a clamping circuit, a protection circuit, and an input circuit. The latch circuit is coupled between a high-voltage terminal and a pair of output terminals for outputting a pair of output signals. The clamping circuit is coupled between a medium-voltage terminal and the pair of output terminals and limits the minimum voltage of the pair of output signals to the medium voltage. The protection circuit is set between the latch circuit and the input circuit, and prevents an excessive voltage drop between the input circuit and the pair of output terminals. The input circuit includes an input transistor pair coupled between the protection circuit and a low-voltage terminal having a low voltage. The input transistor pair receives a pair of input signals and operates accordingly.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: March 12, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Chien-Hui Tsai, Hung-Chen Chu, Yung-Tai Chen
  • Patent number: 11875773
    Abstract: A fan control system applied to N fans inside a computer system is disclosed, comprising: a main microphone, a control circuitry, a wave generation circuitry and a number N of fan controllers. The control circuitry calculates a basic frequency value according to a temperature inside the computer system, and continuously updates a parameter by any known optimization algorithm according to a main audio signal from the main microphone. The wave generation circuitry generates N square waves according to the basic frequency value and the parameter. The N fan controllers respectively form and transmit N modulation signals to the N fans according to the N square waves and N tachometric signals from the N fans. The parameter is one of a frequency variation and a set of phase differences, and the N square waves have the same frequency.
    Type: Grant
    Filed: May 5, 2022
    Date of Patent: January 16, 2024
    Assignee: BRITISH CAYMAN ISLANDS INTELLIGO TECHNOLOGY INC.
    Inventors: Ting-Yao Chen, Chen-Chu Hsu, Tsung-Liang Chen
  • Patent number: 11861165
    Abstract: A system, method, and machine-readable storage medium for analyzing a state of a data object are provided. In some embodiments, the method includes receiving, at a storage device, a metadata request for the data object from a client. The data object is composed of a plurality of segments. The method also includes selecting a subset of the plurality of segments and obtaining a segment state for each segment of the subset. Each segment state indicates whether the respective segment is accessible via a backing store. The method further includes determining a most restrictive state of the one or more segment states and sending state information to the client in response to the metadata request, the state information being derived from the most restrictive state.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: January 2, 2024
    Assignee: NETAPP, INC.
    Inventors: Raymond Yu Shun Mak, Aditya Kalyanakrishnan, Song Guen Yoon, Emalayan Vairavanathan, Dheeraj Sangamkar, Chia-Chen Chu
  • Patent number: 11860550
    Abstract: Photolithography overlay errors are a source of patterning defects, which contribute to low wafer yield. An interconnect formation process that employs a patterning photolithography/etch process with self-aligned interconnects is disclosed herein. The interconnection formation process, among other things, improves a photolithography overlay (OVL) margin since alignment is accomplished on a wider pattern. In addition, the patterning photolithography/etch process supports multi-metal gap fill and low-k dielectric formation with voids.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: January 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu
  • Patent number: 11850833
    Abstract: A flexible display panel can be bent around an axis, and includes a flexible substrate and an accommodating structure. The accommodating structure is disposed on the flexible substrate and includes a plurality of polygonal microcups connected to each other, where the polygonal microcups are arranged regularly, and the axis is not substantially parallel to any sidewall of each polygonal microcup.
    Type: Grant
    Filed: August 26, 2021
    Date of Patent: December 26, 2023
    Assignee: E Ink Holdings Inc.
    Inventors: Yi-Sheng Lin, Chen-Chu Tsai, Chia-Chun Yeh
  • Patent number: 11856387
    Abstract: A video conferencing system is provided, which includes at least one camera device, a microphone array device, a sound output device, and a processor. The processor is configured to: receive multiple image signals converted by an image shot by the at least one camera device, and receive multiple voice signals converted from multiple voices captured from the microphone array device; and select at least one sound source signal corresponding to multiple personnel positions from the multiple sound signals according to the image signal and the multiple voice signals, so as to transmit at least one sound source signal corresponding to the multiple personnel positions to the sound output device, where the sound output device converts at least one sound source signal into sound for play. In addition, a video conferencing method is also disclosed herein.
    Type: Grant
    Filed: January 20, 2022
    Date of Patent: December 26, 2023
    Assignee: AVer Information Inc.
    Inventors: Ching-Yuan Pan, Fu-En Tsai, Chen-Chu Chang
  • Publication number: 20230369376
    Abstract: A circuit that includes: a photodiode configured to absorb photons and to generate photo-carriers from the absorbed photons; a first MOSFET transistor that includes: a first channel terminal coupled to a first terminal of the photodiode and configured to collect a portion of the photo-carriers generated by the photodiode; a second channel terminal; and a gate terminal coupled to a first control voltage source; a first readout circuit configured to output a first readout voltage; a second readout circuit configured to output a second readout voltage; and a current-steering circuit configured to steer the photo-carriers generated by the photodiode to one or both of the first readout circuit and the second readout circuit.
    Type: Application
    Filed: July 19, 2023
    Publication date: November 16, 2023
    Inventors: Yun-Chung Na, Szu-Lin Cheng, Shu-Lu Chen, Han-Din Liu, Hui-Wen Chen, Che-Fu Liang, Yuan-Fu Lyu, Chien-Lung Chen, Chung-Chih Lin, Kuan-Chen Chu
  • Publication number: 20230369096
    Abstract: A semiconductor device includes a conductive line and a conductive via contacting the conductive line. A first dielectric material contacts a first sidewall surface of the conductive via. A second dielectric material contacts a second sidewall surface of the conductive via. The first dielectric material includes a first material composition, and the second dielectric material includes a second material composition different than the first material composition.
    Type: Application
    Filed: July 24, 2023
    Publication date: November 16, 2023
    Inventors: Tai-I YANG, Wei-Chen CHU, Yung-Chih WANG, Chia-Tien WU, Hsin-Ping CHEN, Shau-Lin SHUE
  • Publication number: 20230309296
    Abstract: A semiconductor device and a method of operating the same are provided. The semiconductor device includes a transistor and a fuse structure electrically connected to the transistor. The fuse structure includes a first fuse element, a second fuse element, and a fuse medium. The second fuse element at least partially overlaps the first fuse element. The fuse medium connects the first fuse element and the second fuse element. The fuse medium includes an electrically conductive material.
    Type: Application
    Filed: June 1, 2023
    Publication date: September 28, 2023
    Inventors: HSIANG-WEI LIU, WEI-CHEN CHU, CHIA-TIEN WU
  • Patent number: 11764106
    Abstract: A semiconductor device includes a conductive line and a conductive via contacting the conductive line. A first dielectric material contacts a first sidewall surface of the conductive via. A second dielectric material contacts a second sidewall surface of the conductive via. The first dielectric material includes a first material composition, and the second dielectric material includes a second material composition different than the first material composition.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Hsin-Ping Chen, Shau-Lin Shue