Abstract: A chip-on-board type photoelectric device exemplarily includes: a package substrate, provided with a chip mounting region, a first electrode and a second electrode, the first and second electrodes being arranged spaced from each other at a periphery of the chip mounting region; first photoelectric chips, arranged in the chip mounting region to form inwardly concave strip-shaped patterns as mutually spaced first color temperature regions, and electrically connected between the first and second electrodes to form at least one first photoelectric chip string; and second photoelectric chips, arranged in the chip mounting region to form second color temperature regions. A light-emitting color temperature of each the second color temperature region is higher than that of each the first color temperature region. The second photoelectric chips are electrically connected between the first and second electrodes to form second photoelectric chip strings. A good uniformity of light mixing can be achieved.

Abstract: A flexible display panel can be bent around an axis, and includes a flexible substrate and an accommodating structure. The accommodating structure is disposed on the flexible substrate and includes a plurality of polygonal microcups connected to each other, where the polygonal microcups are arranged regularly, and the axis is not substantially parallel to any sidewall of each polygonal microcup.

Abstract: A display device includes a first substrate, a red sub-pixel, a green sub-pixel, a blue sub-pixel, a plurality of photosensitive devices, and a second substrate. The red sub-pixel, the green sub-pixel, and the blue sub-pixel are located on a first side of the first substrate. The photosensitive devices are located on the first side of the first substrate. Each of the photosensitive devices overlaps at least one of the red sub-pixel, the green sub-pixel, and the blue sub-pixel. Each of the photosensitive devices includes an active element and a photosensitive element. The active element is located on the first substrate. The photosensitive element is electrically connected to the active element. The second substrate overlaps the first substrate.

Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.

Abstract: A water-cooling thermal dissipating method controls at least one of a fan, a pump, and a throttle valve to cool a heat generating element inside an electronic device through a cooling liquid. The method includes steps of: (a) performing a self-condition inspection, (b) detecting whether a working temperature of the cooling liquid is greater than a first predetermined temperature, and detecting whether a working temperature of the heat generating element is greater than a second predetermined temperature, (c) outputting a first warning signal if the working temperature of the cooling liquid is greater than the first predetermined temperature and a liquid level of the cooling liquid is not lower than a threshold liquid level, and outputting a second warning signal if the working temperature of the heat generating element is greater than the second predetermined temperature, and (d) displaying the first warning signal and the second warning signal.

Abstract: A waveguide structure includes a first surface having a first width, a second surface having a second width, the second surface being opposite to the first surface, and a sidewall surface connecting the first surface and the second surface. The first width is greater than the second width.

Abstract: A display apparatus including a display panel and a display driver is provided. The display driver is coupled to the display panel. The display driver is configured to drive the display panel by at least one of a plurality of gray levels to display an image frame in a first state. The display driver is configured to drive the display panel by a predetermined gray level to display a standby frame in a second state. The display driver determines the predetermined gray level of the standby frame according to the gray levels of the image frame. In addition, a driving method of a display apparatus is also provided.

Abstract: A semiconductor device package includes a lower-density substrate and a higher-density substrate. The higher-density substrate is attached to the lower-density substrate. The higher-density substrate has a first interconnection layer and a second interconnection layer disposed over the first interconnection layer. A thickness of the first interconnection layer is different from a thickness of the second interconnection layer.

Abstract: A chip-on-board type photoelectric device exemplarily includes: a package substrate, provided with a chip mounting region, a first electrode and a second electrode, the first and second electrodes being arranged spaced from each other at a periphery of the chip mounting region; first photoelectric chips, arranged in the chip mounting region to form inwardly concave strip-shaped patterns as mutually spaced first color temperature regions, and electrically connected between the first and second electrodes to form at least one first photoelectric chip string; and second photoelectric chips, arranged in the chip mounting region to form second color temperature regions. A light-emitting color temperature of each the second color temperature region is higher than that of each the first color temperature region. The second photoelectric chips are electrically connected between the first and second electrodes to form second photoelectric chip strings. A good uniformity of light mixing can be achieved.

Abstract: A speech enhancement apparatus is disclosed and comprises an adaptive noise cancellation circuit, a blending circuit, a noise suppressor and a control module. The ANC circuit filters a reference signal to generate a noise estimate and subtracts a noise estimate from a primary signal to generate a signal estimate based on a control signal. The blending circuit blends the primary signal and the signal estimate to produce a blended signal. The noise suppressor suppresses noise over the blended signal using a first trained model to generate an enhanced signal and a main spectral representation from a main microphone and M auxiliary spectral representations from M auxiliary microphones using (M+1) second trained models to generate a main score and M auxiliary scores. The ANC circuit, the noise suppressor and the trained models are well combined to maximize the performance of the speech enhancement apparatus.

Abstract: A system, method, and machine-readable storage medium for analyzing a state of a data object are provided. In some embodiments, the method includes receiving, at a storage device, a metadata request for the data object from a client. The data object is composed of a plurality of segments. The method also includes selecting a subset of the plurality of segments and obtaining a segment state for each segment of the subset. Each segment state indicates whether the respective segment is accessible via a backing store. The method further includes determining a most restrictive state of the one or more segment states and sending state information to the client in response to the metadata request, the state information being derived from the most restrictive state.

Abstract: An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.

Abstract: A fingerprint sensing module includes a first substrate, an active device, a photosensitive element layer, a collimation structure layer, a second substrate, a plurality of micro lenses, and a spacer pattern. The active device is disposed on the first substrate. The photosensitive element layer is disposed on the first substrate and is electrically connected to the active device. The collimation structure layer is disposed on the photosensitive element layer. The second substrate is disposed on the collimation structure layer. The micro lenses are disposed on a surface of the collimation structure layer facing away from the photosensitive element layer, and overlap the photosensitive element layer. The micro lenses are divided into a plurality of microlens groups, and the microlens groups are respectively located in a plurality of sensing pixel areas of the fingerprint sensing module. The spacer pattern extends between the microlens groups.

Abstract: A fingerprint sensing module, including a photosensitive element layer and a color filter layer, is provided. The photosensitive element layer has multiple photosensitive regions, and includes a substrate and multiple photosensitive pixels. The photosensitive pixels have multiple photosensitive patterns overlapping the photosensitive regions. The photosensitive pixels include multiple first photosensitive pixels overlapping multiple first photosensitive regions and multiple second photosensitive pixels overlapping multiple second photosensitive regions. A percentage value of a number of the second photosensitive pixels to a number of the photosensitive pixels is less than 30%. An orthographic projection area of each of the first photosensitive regions is different from an orthographic projection area of each of the second photosensitive regions.

Abstract: A system, method, and machine-readable storage medium for analyzing a state of a data object are provided. In some embodiments, the method includes receiving, at a storage device, a metadata request for the data object from a client. The data object is composed of a plurality of segments. The method also includes selecting a subset of the plurality of segments and obtaining a segment state for each segment of the subset. Each segment state indicates whether the respective segment is accessible via a backing store. The method further includes determining a most restrictive state of the one or more segment states and sending state information to the client in response to the metadata request, the state information being derived from the most restrictive state.

Abstract: The present application reveals a system for computing and a method for arranging nodes thereof, which is applied for a remote host connected with a plurality of computing nodes divided to a plurality of first nodes and second nodes due to a first computing mode and a second computing mode. After the remote host receives a job, the remote host evaluates the computing nodes in accordance with the job and a corresponding priority weight parameter to generate a job beginning data to set the first nodes or the second nodes and to proceed the job. While setting the first or the second nodes, the remote host provides the corresponding system image to the corresponding nodes; while the first or the second nodes are full in resource arrangement, the empty nodes will be converted to the supplement nodes with the corresponding system image from the remote host.

Abstract: The present disclosure provides an interconnect structure, including a first metal line, a second metal line spaced away from the first metal line, a conductive contact over the first metal line, including a first portion, a second portion over the first portion, wherein a bottom width of the second portion is greater than a top width of the first portion, wherein a shortest distance between the second portion and the second metal line is in a range from 50 Angstrom to 200 Angstrom, and a third portion over the second portion, wherein a bottom width of the third portion is greater than a top width of the second portion, the entire first portion and the entire second portion are under a coverage of a. vertical projection area of the third portion, a first layer, and a second layer over the first layer.