Patents by Inventor Chen Lin

Chen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11962328
    Abstract: A decoding method, a memory storage device and a memory control circuit unit are disclosed. The method includes: activating a decoding circuit which supports a plurality of decoding modes each corresponding to a threshold value, wherein a distribution of the threshold value corresponds to error correction abilities of the decoding modes; reading first data from a rewritable non-volatile memory module; performing, by the decoding circuit, a first decoding operation on the first data; obtaining a decoding parameter according to an execution result of the first decoding operation; and performing, by the decoding circuit, a second decoding operation on the first data based on a first decoding mode among the decoding modes according to a relative numerical relationship between the decoding parameter and the threshold value.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: April 16, 2024
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Shih-Jia Zeng, Yi-Fang Chang, Chun-Wei Tsao, Chen-An Hsu, Wei Lin
  • Publication number: 20240120236
    Abstract: A method includes etching a gate stack in a wafer to form a trench, depositing a silicon nitride liner extending into the trench, and depositing a silicon oxide layer. The process of depositing the silicon oxide layer includes performing a treatment process on the wafer using a process gas including nitrogen and hydrogen, and performing a soaking process on the wafer using a silicon precursor.
    Type: Application
    Filed: April 25, 2023
    Publication date: April 11, 2024
    Inventors: Tai-Jung Kuo, Po-Cheng Shih, Wan Chen Hsieh, Zhen-Cheng Wu, Chia-Hui Lin, Tze-Liang Lee
  • Publication number: 20240119909
    Abstract: A modulating device is provided. The modulating device includes multiple modulating elements, multiple pixel circuits, and a compensation circuit. The pixel circuits are electrically connected to the modulating elements correspondingly. The compensation circuit includes a driving unit, a voltage source, and a current source. The driving unit provides a driving signal to the pixel circuits. The voltage source is electrically connected to the driving unit. The voltage source provides a constant voltage to the pixel circuits. The current source is electrically connected to the driving unit. The current source provides a constant current to the pixel circuits.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 11, 2024
    Applicant: Innolux Corporation
    Inventors: Kung-Chen Kuo, Yi-Hung Lin, Po-Syun Chen
  • Publication number: 20240118329
    Abstract: An apparatus is provided. The apparatus includes a laser generation device configured to emit a laser signal to a semiconductor fabrication component. The apparatus includes a reflection detection device configured to receive a reflection signal comprising light, of the laser signal, reflected by a surface of the semiconductor fabrication component. The reflection detection device includes an optical filter. The optical filter is configured to block light, of the reflection signal, that has a wavelength outside a defined range of wavelengths. The optical filter is configured to provide filtered light, from the reflection signal, that has a wavelength within the defined range of wavelengths. The reflection detection device includes a light sensor configured to generate an electrical signal based upon the filtered light. The apparatus includes a computer configured to determine, based upon the electrical signal, measures of electrostatic field strength at the surface of the semiconductor fabrication component.
    Type: Application
    Filed: May 11, 2023
    Publication date: April 11, 2024
    Inventors: Ming Da YANG, Yi-Chen LI, Chun-Hsuan LIN
  • Publication number: 20240117451
    Abstract: Positive reference spiked in collected sample for use in qualitatively and quantitatively detecting viral RNA.
    Type: Application
    Filed: March 10, 2021
    Publication date: April 11, 2024
    Inventors: Shuwei YANG, Liancheng HUANG, Feifei FENG, Longwen SU, Kun LIN, Can TANG, Chen LIANG, Yuanmei WANG, Yanqing CAI, Yilin PANG, Chuan SHEN, Zhixue YU
  • Publication number: 20240117316
    Abstract: The present disclosure provides a method for preparing mesenchymal stem cell-derived extracellular vesicle, the mesenchymal stem cell-derived extracellular vesicle prepared by the method, and use of the mesenchymal stem cell-derived extracellular vesicle for reducing adipogenesis and treating osteoarthritis. The mesenchymal stem cell-derived extracellular vesicle of the present disclosure achieves the effect of reducing adipogenesis and treating osteoarthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Yu-Chen Tsai, Ming-Hsi Chuang, Po-Cheng Lin
  • Publication number: 20240120854
    Abstract: A triboelectric nanogenerating device is configured for providing an electric power to an electronic device and the triboelectric nanogenerating device includes at least one scaly triboelectric membrane configured for providing the electric power to the electronic device by frictional electrification. The at least one scaly triboelectric membrane includes a keratin and a polyvinyl alcohol, the at least one scaly triboelectric membrane has a first triboelectric surface, and the first triboelectric surface of the at least one scaly triboelectric membrane includes a plurality of scaly layers. Each of the scaly layers is arranged in order and extends along an orienting direction. A distal end of each of the scaly layers has a plurality of saw-tooth structures.
    Type: Application
    Filed: February 6, 2023
    Publication date: April 11, 2024
    Inventors: Zong-Hong Lin, Ming-Zheng Huang, Hsuan-Yu Yeh, An-Rong Chen, Yao-Hsuan Tseng
  • Publication number: 20240117314
    Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Inventors: Ruei-Yue Liang, Chia-Hsin Lee, Kai-Ling Zhang, Po-Cheng Lin, Ming-Hsi Chuang, Yu-Chen Tsai, Peggy Leh Jiunn Wong
  • Publication number: 20240121718
    Abstract: Some of the present implementations provide a method for a user equipment (UE) for receiving a power saving signal. The method receives, from a base station, a power saving signal comprising a minimum applicable K0 (K0min) that indicates a minimum scheduling offset restriction between a physical downlink control channel (PDCCH) and a physical downlink shared channel (PDSCH). The method determines an application delay based on a predefined value. The method then applies the minimum scheduling offset restriction after the application delay.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 11, 2024
    Inventors: Yu-Hsin Cheng, Chie-Ming Chou, Wan-Chen Lin, Tsung-Hua Tsai
  • Publication number: 20240121729
    Abstract: Examples of transmit power controls are described herein. In some examples, an electronic device includes an imaging capturing device to capture a video stream. In some examples, the electronic device includes video processing circuitry. In some examples, the video processing circuitry may measure background motion in the video stream. In some examples, the video processing circuitry may detect human proximity based on the measured background motion. In some examples, the video processing circuitry may control transmit power in response to the human proximity detection.
    Type: Application
    Filed: March 1, 2021
    Publication date: April 11, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Isaac Lagnado, I-Chen Lin
  • Publication number: 20240121722
    Abstract: An example device is to monitor communications throughput rates and select modulation and coding protocols in order to minimize specific absorption rates experienced by users of the devices by minimizing or reducing transmission power settings.
    Type: Application
    Filed: March 12, 2021
    Publication date: April 11, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: I-Chen Lin, Chung-Chun Chen, Cheng-Fang Lin, Hung-Wen Cheng, Isaac Lagnado, Leo Joseph Gerten
  • Patent number: 11954875
    Abstract: A method for determining a height of a plant, an electronic device, and a storage medium are disclosed. In the method, a target image is obtained by mapping an obtained color image with an obtained depth image. The electronic device processes the color image by using a pre-trained mobilenet-ssd network, obtains a detection box appearance of the plant, and extracts target contours of the plant to be detected from the detection box. The electronic device determines a depth value of each of pixel points in the target contour according to the target image. Target depth values are obtained by performing a de-noising on depth values of the pixel points, and a height of the plant to be detected is determined according to the target depth value. The method improves accuracy of height determination of a plant.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: April 9, 2024
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Tzu-Chen Lin, Chih-Te Lu, Chin-Pin Kuo
  • Patent number: 11956541
    Abstract: A control method of a driving mechanism is provided, including: the driving mechanism provides a first electrical signal from a control assembly to the driving mechanism to move the movable portion into an initial position relative to the fixed portion, wherein the control assembly includes a control unit and a position sensing unit; the status signal of an inertia sensing unit is read; the control unit sends the status signal to the control unit to calculate a target position; the control unit provides a second electrical signal to the driving assembly according to the target position for driving the driving assembly; a position signal is sent from the position sensing unit to the control unit; the control unit provides a third electric signal to the driving assembly to drive the driving assembly according the position signal.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: April 9, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chen-Hsien Fan, Sung-Mao Tsai, Yueh-Lin Lee, Yu-Chiao Lo, Mao-Kuo Hsu, Ching-Chieh Huan, Yi-Chun Cheng
  • Patent number: 11956919
    Abstract: A cold plate is provided and includes: a housing disposed with a chamber; a base combined with the housing to form a working space separated from the chamber but connected with the chamber through an interconnecting structure to allow a working medium to flow within the chamber and the working space; a heat transfer structure disposed on the inner side of the base; and a pump disposed within the working space to drive the working medium in the working space. As such, the cold plate can provide better heat dissipation performance.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: April 9, 2024
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chien-An Chen, Chien-Yu Chen, Tian-Li Ye, Jen-Hao Lin, Wei-Shen Lee
  • Patent number: 11956972
    Abstract: A semiconductor memory device includes a substrate having a memory area and a logic circuit area thereon, a first interlayer dielectric layer on the substrate, and a second interlayer dielectric layer on the substrate. An embedded memory cell structure is disposed within the memory area between the first interlayer dielectric layer and the second interlayer dielectric layer. The second interlayer dielectric layer includes a first portion covering the embedded memory cell structure within the memory area and a second portion covering the logic circuit area. A top surface of the first portion is coplanar with a top surface of the second portion.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Si-Han Tsai, Ching-Hua Hsu, Chen-Yi Weng, Po-Kai Hsu
  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240112928
    Abstract: A trimming method is provided. The trimming method includes the following steps. A first wafer including a substrate and a device layer over a first side of the substrate is provided. The first wafer is bonded to a second wafer with the first side of the substrate facing toward the second wafer. An edge trimming process is performed to remove a trimmed portion of the substrate from a second side opposite to the first side vertically downward toward the first side in a first direction along a perimeter of the substrate, wherein the edge trimming process results in the substrate having a flange pattern laterally protruding from the device layer and laterally surrounding an untrimmed portion of the substrate along a second direction perpendicular to the first direction.
    Type: Application
    Filed: January 10, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: An-Hsuan Lee, Chen-Hao Wu, Chun-Hung Liao, Huang-Lin Chao
  • Publication number: 20240113166
    Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ging Lin, Chun-Liang Lai, Yun-Chen Wu, Ya-Yi Tsai, Shu-Yuan Ku, Shun-Hui Yang
  • Publication number: 20240113056
    Abstract: A semiconductor package including a first interposer comprising a first substrate, first optical components over the first substrate, a first dielectric layer over the first optical components, and first conductive connectors embedded in the first dielectric layer, a photonic package bonded to a first side of the first interposer, where a first bond between the first interposer and the photonic package includes a dielectric-to-dielectric bond between a second dielectric layer on the photonic package and the first dielectric layer, and a second bond between the first interposer and the photonic package includes a metal-to-metal bond between a second conductive connector on the photonic package and a first one of the first conductive connectors and a first die bonded to the first side of the first interposer.
    Type: Application
    Filed: March 3, 2023
    Publication date: April 4, 2024
    Inventors: Hsing-Kuo Hsia, Chen-Hua Yu, Chih-Wei Tseng, Jui Lin Chao
  • Publication number: 20240113262
    Abstract: A light-emitting device includes: a semiconductor stack, including a first semiconductor layer, an active region and a second semiconductor layer; a first contact electrode and a second contact electrode formed on the semiconductor stack, wherein the first contact electrode includes a first contact part formed on the first semiconductor layer and the second contact electrode includes a second contact part formed on the second semiconductor layer; an insulating stack formed on the semiconductor stack, including an opening on the second contact part; a first electrode pad and a second electrode pad formed on the insulating stack, wherein the second electrode pad filled in the opening and connecting the second contact part; wherein the second electrode pad includes an upper surface, and the upper surface includes a platform area and a depression area on the second contact part; wherein the platform area has a maximum height relative to other areas of the upper surface; wherein an area of a projection of the plat
    Type: Application
    Filed: September 1, 2023
    Publication date: April 4, 2024
    Inventors: Hsin-Ying WANG, Hui-Chun YEH, Jhih-Yong YANG, Chen OU, Cheng-Lin LU