Abstract: A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

Abstract: A method of manufacturing a semiconductor device includes bonding a first semiconductor die and a second semiconductor die to a first substrate, forming a conductive layer over the first semiconductor die, the second semiconductor die, and the first substrate, applying an encapsulant over the conductive layer, and removing a portion of the encapsulant, wherein the removing the portion of the encapsulant exposes the conductive layer.

Abstract: A method includes forming a conductive pad over an interconnect structure of a wafer, forming a capping layer over the conductive pad, forming a dielectric layer covering the capping layer, and etching the dielectric layer to form an opening in the dielectric layer. The capping layer is exposed to the opening. A wet-cleaning process is then performed on the wafer. During the wet-cleaning process, a top surface of the capping layer is exposed to a chemical solution used for performing the wet-cleaning process. The method further includes depositing a conductive diffusion barrier extending into the opening, and depositing a conductive material over the conductive diffusion barrier.

Abstract: A semiconductor apparatus and methods of processing a semiconductor workpiece are provided. The semiconductor apparatus for pre-wetting a semiconductor workpiece includes a process chamber, a workpiece holder disposed within the process chamber to hold the semiconductor workpiece, a pre-wetting fluid tank disposed outside the process chamber and containing a pre-wetting fluid, and a conduit coupled to the pre-wetting fluid tank and extending into the process chamber. The conduit delivers the pre-wetting fluid from the pre-wetting fluid tank out through an outlet of the conduit to wet a major surface of the semiconductor workpiece comprising a plurality of recess portions.

Abstract: A plating apparatus includes a workpiece holder, a plating bath, and a clamp ring. The plating bath is underneath the workpiece holder. The clamp ring is connected to the workpiece holder. The clamp ring includes channels communicating an inner surface of the clamp ring and an outer surface of the clamp ring.

Abstract: A roller wheel module includes a roller wheel, an elastic member, and an adjustment assembly. The roller wheel includes a ratchet structure and has a configuration surface. The configuration surface is divided into a blank region and a ratchet region. The ratchet structure is disposed on the configuration surface and is located in the ratchet region. The elastic member is disposed next to the roller wheel and has a first end and a second end opposite to each other. The first end of the elastic member is connected to the adjustment assembly, and the adjustment assembly drives the second end of the elastic member to move between the blank region and the ratchet region. The roller wheel module allows the user to switch between a ratchet rotating mode and a smooth rolling mode according to requirements, and allows the user to quickly scrolling and have a better touch feel.

Abstract: A method of manufacturing a composite catalyst is provided. The method includes the following steps. A catalyst composition including an inorganic support and a metallic nanoparticle attached to a surface of the inorganic support is provided. The catalyst composition, an organic material, and an acidic solvent are mixed to obtain a first mixed solution. An oxidant and the first mixed solution are mixed to obtain a second mixed solution. A drying process is performed on the second mixed solution to remove a solvent in the second mixed solution and to obtain a solid composite catalyst precursor. A calcination process is performed on the composite catalyst precursor to form a carbon-decorated composite catalyst.

Abstract: A fixing structure for a foot ring of a chair includes the foot ring having a hub with a central hole formed with internal threads on an inner surface thereof; and a bush being a cylindrical body having a tapered outer surface with external threads formed thereon. The bush has a shaft hole penetrating along a longitudinal axis of the bush, a groove penetrating through a wall of the bush, and at least one pad provided on an inner surface of the shaft hole of the bush. The bush is assembled with the hub by screwing the external threads of the bush with the internal threads of the hub. A supporting post penetrates through the shaft hole of the bush. When the bush rotates toward a first direction, the shaft hole is reduced to clamp and fix the supporting post, and when the bush rotates toward a second direction, the shaft hole is enlarged to release the clamping and fixing of the supporting post.

Abstract: A fixing structure for a foot ring of a chair includes a hub with a central hole formed with internal threads on an inner surface thereof; and a bush being a cylindrical body having a tapered outer surface with external threads. The bush has a shaft hole penetrating along a longitudinal axis of the bush, a groove penetrating through a wall of the bush, and at least one pad provided on an inner surface of the shaft hole. The bush is assembled with the hub by screwing the external threads of the bush with the internal threads of the hub. A supporting post penetrates through the shaft hole. When the bush rotates toward a first direction, the shaft hole is reduced to clamp and fix the supporting post, and when the bush rotates toward a second direction, the shaft hole is enlarged to release the supporting post.

Abstract: A roller wheel module includes a roller wheel, an elastic member, and an adjustment assembly. The roller wheel includes a ratchet structure and has a configuration surface. The configuration surface is divided into a blank region and a ratchet region. The ratchet structure is disposed on the configuration surface and is located in the ratchet region. The elastic member is disposed next to the roller wheel and has a first end and a second end opposite to each other. The first end of the elastic member is connected to the adjustment assembly, and the adjustment assembly drives the second end of the elastic member to move between the blank region and the ratchet region. The roller wheel module allows the user to switch between a ratchet rotating mode and a smooth rolling mode according to requirements, and allows the user to quickly scrolling and have a better touch feel.

Abstract: A method of manufacturing a semiconductor device includes bonding a first semiconductor die and a second semiconductor die to a first substrate, forming a conductive layer over the first semiconductor die, the second semiconductor die, and the first substrate, applying an encapsulant over the conductive layer, and removing a portion of the encapsulant, wherein the removing the portion of the encapsulant exposes the conductive layer.

Abstract: The present disclosure discloses a display device, which includes a casing, a plurality of proximity sensors, a communication module, a display screen, and a processing module. The proximity sensors are disposed with respect to the side walls of the casing, and the proximity sensors generate a position signal when other display device is close to the casing. The communication module is disposed in the casing, and the communication module is used for communicating with the other display device. The processing module electrically connects to the proximity sensors and the communication module. The processing module controls the display screen to show a particular frame according to the position signal, and the other display screen of the other display device to show the other particular frame via the communication module, wherein the particular frame is capable of being combined with the other particular frame to be an entire frame.

Abstract: A fingerprint identification module includes a keycap unit and a fingerprint identification chip. The keycap unit has an accommodating space and a first surface corresponding to the accommodating space. The fingerprint identification chip has a second surface. The fingerprint identification chip is disposed in the accommodating space, and at least a portion of the second surface of the fingerprint identification chip abuts against the first surface of the keycap unit.

Abstract: The present disclosure discloses a portable electronic device, comprising a first display panel, a second display panel and a keyboard. The second display panel is pivotally connected to the first display panel. The second display panel comprises a display screen and at least one guide magnet arranged below the display screen. The keyboard is detachably arranged above the display screen of the second display panel. The keyboard comprises at least one magnetic element. The keyboard can be controlled to move relative to the display screen along a moving direction by means of the magnetic attraction force between the at least one magnetic element and the at least one guide magnet, wherein the moving direction is perpendicular to a side edge of the second display panel pivotally connected to the first display panel.

Abstract: The present disclosure discloses a portable electronic device, comprising a first display panel, a second display panel and a keyboard. The second display panel is pivotally connected to the first display panel. The second display panel comprises a display screen and at least one guide magnet arranged below the display screen. The keyboard is detachably arranged above the display screen of the second display panel. The keyboard comprises at least one magnetic element. The keyboard can be controlled to move relative to the display screen along a moving direction by means of the magnetic attraction force between the at least one magnetic element and the at least one guide magnet, wherein the moving direction is perpendicular to a side edge of the second display panel pivotally connected to the first display panel.

Abstract: A method of manufacturing a semiconductor device includes bonding a first semiconductor die and a second semiconductor die to a first substrate, forming a conductive layer over the first semiconductor die, the second semiconductor die, and the first substrate, applying an encapsulant over the conductive layer, and removing a portion of the encapsulant, wherein the removing the portion of the encapsulant exposes the conductive layer.

Abstract: The application discloses a portable electronic device comprising a casing, a rotating shaft, a driving assembly, a flexible display and a supporting member. The housing has a long axis opening. The rotating shaft and the driving assembly are disposed in the housing, and the driving assembly is connected to the rotating shaft. The flexible display is wound around the rotating shaft. A first side of the flexible display is connected to the rotating shaft and a second side is located in the long axis opening. A first end of the supporting member is fixed to the driving assembly. When the second side of the flexible display moves outward from the long axis opening, the rotating shaft rotates and drives the driving assembly to drive a second end of the supporting member to move from the long axis opening toward the second side of the flexible display.

Abstract: The present disclosure discloses a display device, which includes a casing, a plurality of proximity sensors, a communication module, a display screen, and a processing module. The proximity sensors are disposed with respect to the side walls of the casing, and the proximity sensors generate a position signal when other display device is close to the casing. The communication module is disposed in the casing, and the communication module is used for communicating with the other display device. The processing module electrically connects to the proximity sensors and the communication module. The processing module controls the display screen to show a particular frame according to the position signal, and the other display screen of the other display device to show the other particular frame via the communication module, wherein the particular frame is capable of being combined with the other particular frame to be an entire frame.

Abstract: In accordance with an embodiment a method of manufacturing a semiconductor device includes bonding a first semiconductor die and a second semiconductor die to a first substrate, forming a conductive layer over the first semiconductor die, the second semiconductor die, and the first substrate, applying an encapsulant over the conductive layer, and removing a portion of the encapsulant, wherein the removing the portion of the encapsulant exposes the conductive layer.