Abstract: A luminous keyboard comprises a key assembly, a thin-film switch circuit board assembly, a base plate and a light guide plate. The key assembly is disposed on the thin-film switch circuit board assembly. The thin-film switch circuit board assembly is disposed on the base plate. The base plate is disposed on the light guide plate. The base plate and the light guide plate together form an aperture structure. The thin-film switch circuit board assembly includes a thin-film switch circuit board and a light-emitting unit. The thin-film switch circuit board forms a protrusion protruding toward the aperture structure. The light-emitting unit is disposed at the bottom surface of the protrusion and extends downward such that a lower end of the light-emitting unit is lower than a lower surface of the base plate so that the light-emitting unit emits light into the light guide plate directly.

Abstract: The application discloses a portable electronic device comprising a casing, a rotating shaft, a driving assembly, a flexible display and a supporting member. The housing has a long axis opening. The rotating shaft and the driving assembly are disposed in the housing, and the driving assembly is connected to the rotating shaft. The flexible display is wound around the rotating shaft. A first side of the flexible display is connected to the rotating shaft and a second side is located in the long axis opening. A first end of the supporting member is fixed to the driving assembly. When the second side of the flexible display moves outward from the long axis opening, the rotating shaft rotates and drives the driving assembly to drive a second end of the supporting member to move from the long axis opening toward the second side of the flexible display.

Abstract: A keypad module, including a bottom plate, a circuit film, a plurality of barricades, an elastic body, a scissor mechanism and a keycap. The circuit film is disposed on the bottom plate and includes a switch. The barricades are disposed upright on the circuit film and surrounds the switch. The elastic body is disposed on the switch. The scissor mechanism is fixed on the bottom plate and disposed at a position close to the switch on the circuit film. The keycap is fixed on the scissor mechanism and covers the switch, the elastic body, the scissor mechanism and the barricades.

Abstract: A luminous keyboard comprises a key assembly, a thin-film switch circuit board assembly, a base plate and a light guide plate. The key assembly is disposed on the thin-film switch circuit board assembly. The thin-film switch circuit board assembly is disposed on the base plate. The base plate is disposed on the light guide plate. The base plate and the light guide plate together form an aperture structure. The thin-film switch circuit board assembly includes a thin-film switch circuit board and a light-emitting unit. The thin-film switch circuit board forms a protrusion protruding toward the aperture structure. The light-emitting unit is disposed at the bottom surface of the protrusion and extends downward such that a lower end of the light-emitting unit is lower than a lower surface of the base plate so that the light-emitting unit emits light into the light guide plate directly.

Abstract: A fingerprint identification module includes a keycap unit and a fingerprint identification chip. The keycap unit has an accommodating space and a first surface corresponding to the accommodating space. The fingerprint identification chip has a second surface. The fingerprint identification chip is disposed in the accommodating space, and at least a portion of the second surface of the fingerprint identification chip abuts against the first surface of the keycap unit.

Abstract: A keypad module, including a bottom plate, a circuit film, a plurality of barricades, an elastic body, a scissor mechanism and a keycap. The circuit film is disposed on the bottom plate and includes a switch. The barricades are disposed upright on the circuit film and surrounds the switch. The elastic body is disposed on the switch. The scissor mechanism is fixed on the bottom plate and disposed at a position close to the switch on the circuit film. The keycap is fixed on the scissor mechanism and covers the switch, the elastic body, the scissor mechanism and the barricades.

Abstract: A luminous keyboard comprises a key assembly, a thin-film switch circuit board assembly, a base plate and a light guide plate. The key assembly is disposed on the thin-film switch circuit board assembly. The thin-film switch circuit board assembly is disposed on the base plate. The base plate is disposed on the light guide plate. The base plate and the light guide plate together form an aperture structure. The thin-film switch circuit board assembly includes a thin-film switch circuit board and a light-emitting unit. The thin-film switch circuit board forms a protrusion protruding toward the aperture structure. The light-emitting unit is disposed at the bottom surface of the protrusion and extends downward such that a lower end of the light-emitting unit is lower than a lower surface of the base plate so that the light-emitting unit emits light into the light guide plate directly.

Abstract: An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs each extend through the substrate and electrically connect to the electronic devices. A redistribution layer (RDL) formed on the second side of the substrate interconnects ones of the dummy TSVs with ones of the functional TSVs. Step heights of the RDL over the functional TSVs are less than a predetermined value, whereas step heights of the RDL over the dummy TSVs are greater than the predetermined value.

Abstract: A device includes a through substrate via (TSV) extending through a device substrate. The TSV includes a first conductive material having a sidewall, a protruding end of the TSV protruding from a second side of the device substrate. A liner covers the sidewall of the first conductive material from a below the top surface of the protruding end of the TSV to an opposite end of the TSV. A passivation layer is disposed over the second side of the device substrate and over a portion of the liner disposed on the protruding end of the TSV, the passivation layer having a stair-step surface extending away from the TSV. A conductive interface layer is disposed over the passivation layer, the sidewall of the first conductive material, and the top surface of the protruding end of the TSV. A second conductive material is disposed over the first conductive material.

Abstract: A luminous keyboard comprises a key assembly, a thin-film switch circuit board assembly, a base plate and a light guide plate. The key assembly is disposed on the thin-film switch circuit board assembly. The thin-film switch circuit board assembly is disposed on the base plate. The base plate is disposed on the light guide plate. The base plate and the light guide plate together form an aperture structure. The thin-film switch circuit board assembly includes a thin-film switch circuit board and a light-emitting unit. The thin-film switch circuit board forms a protrusion protruding toward the aperture structure. The light-emitting unit is disposed at the bottom surface of the protrusion and extends downward such that a lower end of the light-emitting unit is lower than a lower surface of the base plate so that the light-emitting unit emits light into the light guide plate directly.

Abstract: An support insole includes a middle medium sandwiched between flexible upper and lower layers, wherein upper layer has a forefoot region with a metatarse protrusion that projects upward from an upper surface of the upper layer to a certain height, a midfoot region with inner and outer arch sides, wherein the inner arch side has an inner arch protrusion that projects upwardly from the upper surface to a certain height and wherein the outer arch side has a plurality of outer arch protrusions that project upwardly from the upper surface to a certain height, a hindfoot region with a heel support protrusion that projects upwardly from the upper surface to a certain height, wherein the top face is dented inwardly so as to form a concave recess such that the support insole is ergonomically designed to provide comfort for a wearer.

Abstract: An insole includes upper and lower layers of soft and hard materials. The upper layer includes forefoot, midfoot and hindfoot regions, the hindfoot and midfoot regions have outer peripheral portions located at an elevation higher than an upper surface of the upper layer. The midfoot region has an inner arch side with an inner arch protrusion projecting upwardly from the upper surface of the upper layer to a certain height greater than an average height of the upper layer. The lower layer is attached to the midfoot and hindfoot regions of the upper layer, includes an integrally formed fan-shaped and a hook-shaped sections. The fan-shaped and hook-shaped sections are disposed in such a manner to extend towards front and rear ends of the upper layer. The hook-shaped section has left and right sides extending towards outer and inner arch sides corresponding to the hindfoot region of the upper layer.

Abstract: An support insole includes a middle medium sandwiched between flexible upper and lower layers, wherein upper layer has a forefoot region with a metatarse protrusion that projects upward from an upper surface of the upper layer to a certain height, a midfoot region with inner and outer arch sides, wherein the inner arch side has an inner arch protrusion that projects upwardly from the upper surface to a certain height and wherein the outer arch side has a plurality of outer arch protrusions that project upwardly from the upper surface to a certain height, a hindfoot region with a heel support protrusion that projects upwardly from the upper surface to a certain height, wherein the top face is dented inwardly so as to form a concave recess such that the support insole is ergonomically designed to provide comfort for a wearer.

Abstract: An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs each extend through the substrate and electrically connect to the electronic devices. A redistribution layer (RDL) formed on the second side of the substrate interconnects ones of the dummy TSVs with ones of the functional TSVs. Step heights of the RDL over the functional TSVs are less than a predetermined value, whereas step heights of the RDL over the dummy TSVs are greater than the predetermined value.

Abstract: An optical mouse is provided with a conversion unit, a control unit, an optical sensing unit, a light emitting unit, and a switch unit. The conversion unit is electrically connected to a working voltage source, the control unit, and the optical sensing unit. The conversion unit is configured to convert voltage to supply power to the control unit, the optical sensing unit, and the light emitting unit. The control unit is electrically connected to the optical sensing unit. The switch unit is electrically connected to the light unit. When the switch unit is in a turn-off state, the light emitting unit stops emitting light toward a trace surface. The optical sensing unit senses a darkness and transfers darkness data to the control unit. The control unit performs a configured function based on the darkness data.

Abstract: An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs each extend through the substrate and electrically connect to the electronic devices. A redistribution layer (RDL) formed on the second side of the substrate interconnects ones of the dummy TSVs with ones of the functional TSVs. Step heights of the RDL over the functional TSVs are less than a predetermined value, whereas step heights of the RDL over the dummy TSVs are greater than the predetermined value.

Abstract: A device includes a through substrate via (TSV) extending through a device substrate. The TSV includes a first conductive material having a sidewall, a protruding end of the TSV protruding from a second side of the device substrate. A liner covers the sidewall of the first conductive material from a below the top surface of the protruding end of the TSV to an opposite end of the TSV. A passivation layer is disposed over the second side of the device substrate and over a portion of the liner disposed on the protruding end of the TSV, the passivation layer having a stair-step surface extending away from the TSV. A conductive interface layer is disposed over the passivation layer, the sidewall of the first conductive material, and the top surface of the protruding end of the TSV. A second conductive material is disposed over the first conductive material.

Abstract: In accordance with an embodiment a method of manufacturing a semiconductor device includes bonding a first semiconductor die and a second semiconductor die to a first substrate, forming a conductive layer over the first semiconductor die, the second semiconductor die, and the first substrate, applying an encapsulant over the conductive layer, and removing a portion of the encapsulant, wherein the removing the portion of the encapsulant exposes the conductive layer.

Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.

Abstract: An optical mouse is provided with a conversion unit, a control unit, an optical sensing unit, a light emitting unit, and a switch unit. The conversion unit is electrically connected to a working voltage source, the control unit, and the optical sensing unit. The conversion unit is configured to convert voltage to supply power to the control unit, the optical sensing unit, and the light emitting unit. The control unit is electrically connected to the optical sensing unit. The switch unit is electrically connected to the light unit. When the switch unit is in a turn-off state, the light emitting unit stops emitting light toward a trace surface. The optical sensing unit senses a darkness and transfers darkness data to the control unit. The control unit performs a configured function based on the darkness data.