Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.

Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.

Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.

Abstract: A puncture resistant insole includes: a rigid plate shaped to contour a human foot and adapted to be inserted into a foot wear; a non-woven fabric layer enclosing adhesively the rigid plate from an exterior thereof; an antiseptic-deodorant fabric layer enclosing adhesively the non-woven fabric layer from an exterior thereof; and a polymer layer enclosing the antiseptic-deodorant fabric layer from an exterior thereof.

Abstract: A light-emitting keyboard includes a keycap, a frame and a solid-state lighting source. The keycap has a light-entrance portion formed on the periphery thereof, and a touch surface for pressing by user. The keycap is made of light-guiding material and defines a light-guiding path from the light entrance portion to the touch surface. The frame is arranged adjacent to the keycap and surrounds the periphery of the keycap. The frame is made of light-guiding material and forms at least one light-outputting surface. The at least one light-outputting surface is contiguous to the light-entrance portion. The solid-state lighting source is fixed to the frame and emits light from the light-outputting surface into the light-entrance portion by the light-guiding path, and exits from the touch surface of the keycap. The instant disclosure also provides an illuminating structure of the keyboard, and a keycap thereof.

Abstract: A toe protector includes a main body made from soft and flexible materials, formed with a big-toe hole, a second toe hole and a partition block located therebetween, the main body having a first peripheral wall of U-shaped cross section extending laterally from a first side of the big-toe hole such that after extension of a big toe through the big-toe hole, the first peripheral wall encloses the big toe, the one side of the big-toe hole and parts of a foot, the main body further having a second peripheral wall of C-shaped cross section extending from a second side of the second toe hole such that after extension of a second toe through the second toe hole, the second peripheral wall encloses the second side of the second toe hole to confine the partition block between the big-toe hole and the second toe hole.

Abstract: In accordance with an embodiment a first semiconductor die and a second semiconductor die are bonded to a first substrate. A protective cap is formed over and between the first semiconductor die and the second semiconductor die. An encapsulant is placed over the protective layer and portions of the encapsulant are removed in order to expose the protective cap or, alternatively, to expose the first semiconductor device and the second semiconductor device. The first substrate may then be bonded to a second substrate.

Abstract: An arch support insole includes a basic body made from soft flexible material having a top surface, a palm support portion and an arch support portion, wherein the palm support portion has a rear part, a front part with a width gradually increased from said rear part, an arched lateral side conforming to an arch of human foot, a topmost planar surface and a curved side surface gradually descending from the topmost planar surface. The topmost planar area is spaced apart from the top surface of the basic body at 7 mm˜9 mm. The arch support portion surrounds the rear part and the curved side surface of the palm support portion, has an upwardly curved top surface with a topmost point which is spaced from the top surface of the basic body at 1 mm˜4 mm.

Abstract: An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs each extend through the substrate and electrically connect to the electronic devices. A redistribution layer (RDL) formed on the second side of the substrate interconnects ones of the dummy TSVs with ones of the functional TSVs. Step heights of the RDL over the functional TSVs are less than a predetermined value, whereas step heights of the RDL over the dummy TSVs are greater than the predetermined value.

Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.

Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.

Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.

Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.

Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.

Abstract: A light-emitting keyboard includes a keycap, a frame and a solid-state lighting source. The keycap has a light-entrance portion formed on the periphery thereof, and a touch surface for pressing by user. The keycap is made of light-guiding material and defines a light-guiding path from the light entrance portion to the touch surface. The frame is arranged adjacent to the keycap and surrounds the periphery of the keycap. The frame is made of light-guiding material and forms at least one light-outputting surface. The at least one light-outputting surface is contiguous to the light-entrance portion. The solid-state lighting source is fixed to the frame and emits light from the light-outputting surface into the light-entrance portion by the light-guiding path, and exits from the touch surface of the keycap. The instant disclosure also provides an illuminating structure of the keyboard, and a keycap thereof.

Abstract: An arch support insole includes a basic body made from soft flexible material having a top surface, a heel support portion in form of crescent moon shape and projecting upward from the top surface and a palm support portion in front of the heel support portion. The heel support portion has two distal ends that gradually increase in thickness toward a center area thereof thereby forming a curved surface with an apex at the center area which is spaced from the top surface of the basic body at 5 mm˜9 mm and wherein the palm support portion has an upwardly curved top surface with a topmost point which is spaced from the top surface of the basic body at 1 mm˜6 mm.

Abstract: An arch support insole includes a basic body made from soft flexible material having a top surface, a palm support portion and an arch support portion, wherein the palm support portion has a rear part, a front part with a width gradually increased from said rear part, an arched lateral side conforming to an arch of human foot, a topmost planar surface and a curved side surface gradually descending from the topmost planar surface. The topmost planar area is spaced apart from the top surface of the basic body at 7 mm˜9 mm. The arch support portion surrounds the rear part and the curved side surface of the palm support portion, has an upwardly curved top surface with a topmost point which is spaced from the top surface of the basic body at 1 mm˜4 mm.

Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.

Abstract: A shoe insole includes a soft elastomer formed in a shape of an inner bottom surface of a shoe, wherein the soft elastomer includes a front metatarsal section, a mid foot section and a rear heel section, and wherein the rear heel section has a recessed area, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite sides of the recessed area; and a hard elastomer combined with the mid foot section and the rear heel section of the soft elastomer, wherein a rear heel section of the hard elastomer has a through-hole, and a portion of material of the soft elastomer is filled in the through-hole, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite outer sides of the rear heel section of the hard elastomer.

Abstract: A shoe insole includes a soft elastomer formed in a shape of an inner bottom surface of a shoe, wherein the soft elastomer includes a front metatarsal section, a mid foot section and a rear heel section, and wherein the rear heel section has a recessed area, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite sides of the recessed area; and a hard elastomer combined with the mid foot section and the rear heel section of the soft elastomer, wherein a rear heel section of the hard elastomer has a through-hole, and a portion of material of the soft elastomer is filled in the through-hole, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite outer sides of the rear heel section of the hard elastomer.