Patents by Inventor Chen Yu-Tsai

Chen Yu-Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9478480
    Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: October 25, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai, Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
  • Publication number: 20160181157
    Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
    Type: Application
    Filed: February 26, 2016
    Publication date: June 23, 2016
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai
  • Patent number: 9299676
    Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: March 29, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai
  • Publication number: 20150366292
    Abstract: A puncture resistant insole includes: a rigid plate shaped to contour a human foot and adapted to be inserted into a foot wear; a non-woven fabric layer enclosing adhesively the rigid plate from an exterior thereof; an antiseptic-deodorant fabric layer enclosing adhesively the non-woven fabric layer from an exterior thereof; and a polymer layer enclosing the antiseptic-deodorant fabric layer from an exterior thereof.
    Type: Application
    Filed: June 23, 2014
    Publication date: December 24, 2015
    Inventor: Chen-Yu Tsai
  • Patent number: 9184000
    Abstract: A light-emitting keyboard includes a keycap, a frame and a solid-state lighting source. The keycap has a light-entrance portion formed on the periphery thereof, and a touch surface for pressing by user. The keycap is made of light-guiding material and defines a light-guiding path from the light entrance portion to the touch surface. The frame is arranged adjacent to the keycap and surrounds the periphery of the keycap. The frame is made of light-guiding material and forms at least one light-outputting surface. The at least one light-outputting surface is contiguous to the light-entrance portion. The solid-state lighting source is fixed to the frame and emits light from the light-outputting surface into the light-entrance portion by the light-guiding path, and exits from the touch surface of the keycap. The instant disclosure also provides an illuminating structure of the keyboard, and a keycap thereof.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: November 10, 2015
    Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATION
    Inventors: Ming-Fu Yen, Chien-Hsin Lee, Chin-Fa Wu, Yuan-Chieh Cheng, Chen-Yu Tsai
  • Publication number: 20150297385
    Abstract: A toe protector includes a main body made from soft and flexible materials, formed with a big-toe hole, a second toe hole and a partition block located therebetween, the main body having a first peripheral wall of U-shaped cross section extending laterally from a first side of the big-toe hole such that after extension of a big toe through the big-toe hole, the first peripheral wall encloses the big toe, the one side of the big-toe hole and parts of a foot, the main body further having a second peripheral wall of C-shaped cross section extending from a second side of the second toe hole such that after extension of a second toe through the second toe hole, the second peripheral wall encloses the second side of the second toe hole to confine the partition block between the big-toe hole and the second toe hole.
    Type: Application
    Filed: April 21, 2014
    Publication date: October 22, 2015
    Applicant: Fusco Industrial Corporation
    Inventor: Chen-Yu Tsai
  • Publication number: 20150287697
    Abstract: In accordance with an embodiment a first semiconductor die and a second semiconductor die are bonded to a first substrate. A protective cap is formed over and between the first semiconductor die and the second semiconductor die. An encapsulant is placed over the protective layer and portions of the encapsulant are removed in order to expose the protective cap or, alternatively, to expose the first semiconductor device and the second semiconductor device. The first substrate may then be bonded to a second substrate.
    Type: Application
    Filed: April 2, 2014
    Publication date: October 8, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chen-Yu Tsai, Tsung-Shang Wei, Yu-Sheng Lin, Wen-Chih Chiou, Shin-Puu Jeng
  • Patent number: 9060563
    Abstract: An arch support insole includes a basic body made from soft flexible material having a top surface, a palm support portion and an arch support portion, wherein the palm support portion has a rear part, a front part with a width gradually increased from said rear part, an arched lateral side conforming to an arch of human foot, a topmost planar surface and a curved side surface gradually descending from the topmost planar surface. The topmost planar area is spaced apart from the top surface of the basic body at 7 mm˜9 mm. The arch support portion surrounds the rear part and the curved side surface of the palm support portion, has an upwardly curved top surface with a topmost point which is spaced from the top surface of the basic body at 1 mm˜4 mm.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: June 23, 2015
    Assignee: Fusco Industrial Corporation
    Inventor: Chen-Yu Tsai
  • Publication number: 20150137382
    Abstract: An apparatus comprising a substrate with multiple electronic devices. An interconnect structure formed on a first side of the substrate interconnects the electronic devices. Dummy TSVs each extend through the substrate and form an alignment mark on a second side of the substrate. Functional TSVs each extend through the substrate and electrically connect to the electronic devices. A redistribution layer (RDL) formed on the second side of the substrate interconnects ones of the dummy TSVs with ones of the functional TSVs. Step heights of the RDL over the functional TSVs are less than a predetermined value, whereas step heights of the RDL over the dummy TSVs are greater than the predetermined value.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 21, 2015
    Inventors: Ku-Feng Yang, Ming-Tsu Chung, Hong-Ye Shih, Jiung Wu, Chen-Yu Tsai, Hsin-Yu Chen, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Publication number: 20150137361
    Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
    Type: Application
    Filed: January 29, 2015
    Publication date: May 21, 2015
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai
  • Publication number: 20150069580
    Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.
    Type: Application
    Filed: November 14, 2014
    Publication date: March 12, 2015
    Inventors: Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai, Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
  • Patent number: 8952506
    Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: February 10, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai
  • Patent number: 8900994
    Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
    Type: Grant
    Filed: June 9, 2011
    Date of Patent: December 2, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai
  • Patent number: 8896136
    Abstract: In accordance with an embodiment, a structure comprises a substrate having a first area and a second area; a through substrate via (TSV) in the substrate penetrating the first area of the substrate; an isolation layer over the second area of the substrate, the isolation layer having a recess; and a conductive material in the recess of the isolation layer, the isolation layer being disposed between the conductive material and the substrate in the recess.
    Type: Grant
    Filed: June 30, 2010
    Date of Patent: November 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yu Tsai, Shih-Hui Wang, Chien-Ming Chiu, Chia-Ho Chen, Fang Wen Tsai, Weng-Jin Wu, Jing-Cheng Lin, Wen-Chih Chiou, Shin-Puu Jeng, Chen-Hua Yu
  • Publication number: 20140307413
    Abstract: A light-emitting keyboard includes a keycap, a frame and a solid-state lighting source. The keycap has a light-entrance portion formed on the periphery thereof, and a touch surface for pressing by user. The keycap is made of light-guiding material and defines a light-guiding path from the light entrance portion to the touch surface. The frame is arranged adjacent to the keycap and surrounds the periphery of the keycap. The frame is made of light-guiding material and forms at least one light-outputting surface. The at least one light-outputting surface is contiguous to the light-entrance portion. The solid-state lighting source is fixed to the frame and emits light from the light-outputting surface into the light-entrance portion by the light-guiding path, and exits from the touch surface of the keycap. The instant disclosure also provides an illuminating structure of the keyboard, and a keycap thereof.
    Type: Application
    Filed: July 11, 2013
    Publication date: October 16, 2014
    Inventors: MING-FU YEN, CHIEN-HSIN LEE, CHIN-FA WU, YUAN-CHIEH CHENG, CHEN-YU TSAI
  • Publication number: 20140259757
    Abstract: An arch support insole includes a basic body made from soft flexible material having a top surface, a heel support portion in form of crescent moon shape and projecting upward from the top surface and a palm support portion in front of the heel support portion. The heel support portion has two distal ends that gradually increase in thickness toward a center area thereof thereby forming a curved surface with an apex at the center area which is spaced from the top surface of the basic body at 5 mm˜9 mm and wherein the palm support portion has an upwardly curved top surface with a topmost point which is spaced from the top surface of the basic body at 1 mm˜6 mm.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: FUSCO INDUSTRIAL CORPORATION
    Inventor: Chen-Yu Tsai
  • Publication number: 20140259755
    Abstract: An arch support insole includes a basic body made from soft flexible material having a top surface, a palm support portion and an arch support portion, wherein the palm support portion has a rear part, a front part with a width gradually increased from said rear part, an arched lateral side conforming to an arch of human foot, a topmost planar surface and a curved side surface gradually descending from the topmost planar surface. The topmost planar area is spaced apart from the top surface of the basic body at 7 mm˜9 mm. The arch support portion surrounds the rear part and the curved side surface of the palm support portion, has an upwardly curved top surface with a topmost point which is spaced from the top surface of the basic body at 1 mm˜4 mm.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Inventor: Chen-Yu Tsai
  • Publication number: 20140203439
    Abstract: A system and method for manufacturing a through silicon via is disclosed. An embodiment comprises forming a through silicon via with a liner protruding from a substrate. A passivation layer is formed over the substrate and the through silicon via, and the passivation layer and liner are recessed from the sidewalls of the through silicon via. Conductive material may then be formed in contact with both the sidewalls and a top surface of the through silicon via.
    Type: Application
    Filed: March 20, 2014
    Publication date: July 24, 2014
    Inventors: Chen-Hua Yu, Shin-Puu Jeng, Wen-Chih Chiou, Fang Wen Tsai, Chen-Yu Tsai
  • Patent number: 8776399
    Abstract: A shoe insole includes a soft elastomer formed in a shape of an inner bottom surface of a shoe, wherein the soft elastomer includes a front metatarsal section, a mid foot section and a rear heel section, and wherein the rear heel section has a recessed area, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite sides of the recessed area; and a hard elastomer combined with the mid foot section and the rear heel section of the soft elastomer, wherein a rear heel section of the hard elastomer has a through-hole, and a portion of material of the soft elastomer is filled in the through-hole, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite outer sides of the rear heel section of the hard elastomer.
    Type: Grant
    Filed: January 24, 2012
    Date of Patent: July 15, 2014
    Assignee: Fusco Industrial Corporation
    Inventor: Chen-Yu Tsai
  • Publication number: 20130185957
    Abstract: A shoe insole includes a soft elastomer formed in a shape of an inner bottom surface of a shoe, wherein the soft elastomer includes a front metatarsal section, a mid foot section and a rear heel section, and wherein the rear heel section has a recessed area, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite sides of the recessed area; and a hard elastomer combined with the mid foot section and the rear heel section of the soft elastomer, wherein a rear heel section of the hard elastomer has a through-hole, and a portion of material of the soft elastomer is filled in the through-hole, and an inner arch concave surface and an outer arch concave surface are respectively defined in two opposite outer sides of the rear heel section of the hard elastomer.
    Type: Application
    Filed: January 24, 2012
    Publication date: July 25, 2013
    Applicant: Fusco Industrial Corporation
    Inventor: Chen-Yu Tsai