Patents by Inventor Cheng Chuang

Cheng Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9531853
    Abstract: An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided.
    Type: Grant
    Filed: November 1, 2013
    Date of Patent: December 27, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Ying-Yen Cheng, Chih-Wei Tu
  • Patent number: 9531932
    Abstract: A camera module is provided. The camera module includes a camera device and a support ring. The camera device includes a substrate, an image sensor device on the substrate, and a holder for covering the image sensor device, wherein the holder includes a side portion placed around the image sensor device. The support ring is fixed to and laterally extends from the side portion of the holder, and is attached onto a wall portion of the chassis. A portable device with the camera module is also disclosed.
    Type: Grant
    Filed: October 30, 2015
    Date of Patent: December 27, 2016
    Assignee: HTC Corporation
    Inventors: Hsin-Chih Liu, Yu-Jing Liao, Ying-Yen Cheng, Yin-Chou Chen, I-Cheng Chuang, Chia-Huan Chang
  • Publication number: 20160323976
    Abstract: A wireless composite device includes an antenna, an AC-to-DC driving circuit, an LED circuit board and a router. The AC-to-DC driving circuit converts an inputted AC into an outputted DC through a transmission signal of an antenna and supplies the outputted DC to drive the parallelly installed LED circuit board and router, so as to control the power conversion and supply of the AC-to-DC driving circuit through the wireless communication. In addition, different electronic devices are combined to save installation cost and space. Further, a multifunctional lamp including an antenna with a Bluetooth module, an LED driving circuit, at least one LED lamp and a router is disclosed. The LED driving circuit performs an AC-to-DC conversion through the Bluetooth communication and drives the LED lamp and the router, so that the lamp provides an illumination function and the router provides a network connection function.
    Type: Application
    Filed: May 29, 2015
    Publication date: November 3, 2016
    Inventors: CHIH-HSIEN WU, WEI CHANG, KAI-CHENG CHUANG, YI-SHU CHEN
  • Patent number: 9485824
    Abstract: Disclosed is a purely resistive dimming circuit for driving LEDs to emit light and support an LED dimming function. The LEDs are divided into a first string and a second string connected in series with each other. The purely resistive dimming circuit is respectively and electrically coupled to an anode terminal of the first string and an anode terminal of the second string by a driving resistor and a current limiting resistor which are connected in series with each other. The resistance of the driving resistor restricts the LEDs to emit light at different stages to enhance the working efficiency of circuits, while using the property of the current limiting resistor to limit the overvoltage current, so as to achieve a constant power operating effect.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: November 1, 2016
    Assignee: Unity Opto Technology Co., Ltd.
    Inventors: Chih-Hsien Wu, Wei Chang, Kai-Cheng Chuang, Szu-Chien Chen
  • Publication number: 20160307859
    Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof. The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.
    Type: Application
    Filed: June 27, 2016
    Publication date: October 20, 2016
    Inventors: Chung-Hsin Lin, Ping-Heng Wu, Chao-Wen Lay, Hung-Mo Wu, Ying-Cheng Chuang
  • Publication number: 20160301175
    Abstract: A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.
    Type: Application
    Filed: July 21, 2015
    Publication date: October 13, 2016
    Applicant: SECURITAG ASSEMBLY GROUP CO., LTD.
    Inventors: Tung -Sheng Chen, Shih- Ching Chen, Chih- Cheng Chuang
  • Patent number: 9461381
    Abstract: Electronic card connectors for receiving and electrically connecting with at least one electronic card are described. The electronic card connector includes a base having a plurality through holes, a frame, and a plurality of terminals which are adapted to pass through the through holes. The frame is configured to be assembled with the base to form a receiving recess. At least one of the plurality of terminals may include a plurality of metal pins. When the at least one electronic card is inserted into the receiving recess, one of the plurality of metal pins is electrically connected to the other one of the plurality of metal pins via a sensor unit.
    Type: Grant
    Filed: March 10, 2015
    Date of Patent: October 4, 2016
    Assignee: HTC CORPORATION
    Inventors: I-Cheng Chuang, Chih-Wei Tu
  • Publication number: 20160268711
    Abstract: An electronic card connector comprising a base, a frame and a plurality of terminals is provided. The base has a plurality of through holes. The frame cooperates with the base to form a receiving recess. The terminals can pass through the through holes and at least one of the terminals has a plurality of metal pins. One of the metal pins is adapted to be electrically connected with another of the metal pins via a sensor unit when the electronic card is inserted into the receiving recess.
    Type: Application
    Filed: March 10, 2015
    Publication date: September 15, 2016
    Applicant: HTC CORPORATION
    Inventors: I-Cheng CHUANG, Chih-Wei TU
  • Publication number: 20160255683
    Abstract: A linear dimming LED driver circuit capable of adjusting color temperature used in a lamp of a down light or a tube light to drive a plurality of LED strings to emit light and the LED strings are formed by yellow-light and ultra blue LEDs. The circuit uses a switch to switch the conduction of the LED strings to change the color temperature of the light emission of the lamp, so that the control module will adjust the light emitting brightness of the lamp for better dimming range and work performance of the whole circuit if a driving voltage is in a mono sinusoidal voltage section greater than or equal to 129 volts and smaller than or equal to 135 volts.
    Type: Application
    Filed: March 23, 2015
    Publication date: September 1, 2016
    Inventors: CHIH-HSIEN WU, SEN-YUH TSAI, KAI-CHENG CHUANG
  • Publication number: 20160238747
    Abstract: A panel assembly includes a transparent cover, a display module, a decorative layer, and a Fresnel lens structure. The transparent cover has a lower surface. The display module is disposed under the lower surface. The decorative layer is disposed on the lower surface. The Fresnel lens structure is located above the display module. Besides, an electronic device includes a frame, a housing, and the above panel assembly, and the housing and the panel assembly are installed in the frame.
    Type: Application
    Filed: February 13, 2015
    Publication date: August 18, 2016
    Inventors: Po-Chin Huang, Shih-Po Chien, Yu-Jing Liao, I-Cheng Chuang
  • Patent number: 9418949
    Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof. The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: August 16, 2016
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Chung-Hsin Lin, Ping-Heng Wu, Chao-Wen Lay, Hung-Mo Wu, Ying-Cheng Chuang
  • Patent number: 9418523
    Abstract: An intelligent wireless doorbell alarm system driven and set by a wireless communication protocol includes at least one doorbell switch, plural lamps and an electronic device. The doorbell switch has a wireless signal module for generating a startup signal after the being triggered. The lamps are electrically coupled to one another. Each lamp has a wireless transmission module and a driving module and is electrically coupled to the doorbell switch for receiving the startup signal. The electronic device is electrically coupled to the lamps and has a setup module for setting the lamps.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: August 16, 2016
    Assignee: Unity Opto Technology Co., Ltd.
    Inventors: Chih-Hsien Wu, Wei Chang, Kai-Cheng Chuang, Yi-Shu Chen
  • Patent number: 9411364
    Abstract: An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the rear casing together constitute an accommodation space. The display module is installed inside the accommodation space and stacked over the front cover. The host module is installed inside the accommodation space and stacked over the display module. The battery module is installed inside the accommodation space, stacked over the display module, and arranged side by side with the host module. The expansion module is installed inside the accommodation space and stacked over the battery module. The expansion module includes an expansion circuit board stacked over the battery module and a plurality of card connectors mounted on the expansion circuit board.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: August 9, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Chien-Hung Chen, Cheng-Te Chen
  • Publication number: 20160212870
    Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface.
    Type: Application
    Filed: March 31, 2016
    Publication date: July 21, 2016
    Inventors: Chih-Kai Wai Mun Hu, Yu-Jing Liao, I-Cheng Chuang
  • Publication number: 20160165682
    Abstract: An LED driving circuit of a multi-stage switch bulb lamp includes a power modulation module having a first switch, a second switch, a first transistor, a second transistor, a first resistor, a second resistor, a third resistor and a fourth resistor. The first and second switches are respectively and serially connected to the first and second transistors, the first transistor is electrically connected to the second resistor, the other end of the second resistor is serially connected to the third resistor to form a reference voltage node and has a reference voltage, the first and second transistors are electrically connected to the reference voltage node, the other end of the third resistor is serially connected to the fourth resistor, and the second transistor is electrically connected to the third resistor. The first and second switches may be turned on/off to adjust the reference voltage value and change the power.
    Type: Application
    Filed: February 13, 2015
    Publication date: June 9, 2016
    Inventors: CHIH-HSIEN WU, WEI CHANG, HUAN-YING LU, KAI-CHENG CHUANG, SHAO-WEI CHIU
  • Patent number: 9354738
    Abstract: A touch panel assembly includes a touch panel and a flexible circuit board. The touch panel includes a sensing array having sensing units, first connection lines, second connection lines, at least one input element, and pads. The first and second connection lines are outside the sensing array and electrically connected to the sensing units respectively. The input element is outside the sensing array and close to a side of the touch panel. The pads are in a bonding region of the touch panel and electrically connected to the first and second connection lines respectively. The bonding region is close to the side of the touch panel and is arranged along with the input element in parallel to the side of the touch panel. The flexible circuit board has a connecting portion extended and attached to the bonding region. Terminals of the connecting portion are electrically connected to the pads respectively.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: May 31, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Shih-Po Chien, Yi-Ting Liu, Chia-Hsiung Peng, Chi-Jer Wang
  • Patent number: 9346198
    Abstract: A molded casing suitable for a handheld electronic device is provided. The handheld electronic device includes a body and the molded casing, and at least one part of the body is covered with the molded casing. The molded casing is in a uniform thickness and has a continuous mosaic surface. The mosaic surface is composed of a plurality of non-coplanar polygons, wherein an intersection line is formed between any two adjacent polygons. An end of any one of the intersection lines is connected to an end of another intersection line or an edge of the mosaic surface, and an equivalence radius of a vertex angle at each intersection line is less than or equal to 0.1 millimeter. A mold assembly and a forming method for fabricating the molded case are also provided.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: May 24, 2016
    Assignee: HTC Corporation
    Inventors: Chih-Kai Hu, Yu-Jing Liao, I-Cheng Chuang
  • Patent number: 9335801
    Abstract: A frame to be assembled to a housing of an electronic device is provided. The frame includes a first material portion and a second material portion. The first material portion has a first thermal conductivity coefficient, and the second material portion has a second thermal conductivity coefficient. The first material portion is connected to the second material portion, and the first thermal conductivity coefficient is greater than the second thermal conductivity coefficient. A stiffness of the second material portion is greater than a stiffness of the first material portion. A heat generating element of the electronic device dissipates heat by the first material portion, and the heat generating element is disposed to be corresponding to the first material portion. An electronic device having said frame is also provided.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: May 10, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Yu-Jing Liao, Hsin-Chih Liu, Hung-Wen Lin
  • Patent number: 9313389
    Abstract: A camera assembly, including at least one holder, at least one camera module, and a buffer material, is provided. The holder includes at least one accommodating recess. The camera module is disposed in the accommodating recess, and a gap exists between the camera module and a sidewall of the accommodating recess. The buffer material is filled in the gap to position the camera module in the accommodating recess of the holder. Further, an electronic device including a housing and the camera assembly aforementioned is provided.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: April 12, 2016
    Assignee: HTC Corporation
    Inventors: I-Cheng Chuang, Hung-Wen Lin
  • Patent number: 9299511
    Abstract: A key assembly and electronic device is provided. The key assembly is disposed at a housing of the electronic device. The key assembly includes a circuit board, a shaft, a limiting portion, a contact element and an elastic element. The circuit board disposed in the housing has a first contact and a second contact. The shaft penetrates through the housing and the circuit board and having a first end and a second end. The limiting portion is located at the second end of the shaft. The contact element is located between the housing and the circuit board. The elastic element is coupled between the shaft and the circuit board. When the shaft drives the contact element to move toward the circuit board for the contact element to contact the second contact, the second contact is electrically connected to the first contact through the contact element to generate an electrical signal.
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: March 29, 2016
    Assignee: HTC Corporation
    Inventors: Han-Wen Yeh, I-Cheng Chuang