Abstract: A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.

Abstract: An electronic apparatus including a housing, a motherboard, a battery and a display module is provided. The housing has at least an opening and an accommodating space. The motherboard is disposed in the accommodating space. The battery is disposed in the accommodating space and stacked over the motherboard. The motherboard is located between the housing and the battery. The display module is disposed in the accommodating space and stacked over the battery. The battery is located between the motherboard and the display module. At least one edge of the battery in a width direction of the battery is closer to a corresponding side of the housing than a corresponding edge of the motherboard in a width direction of the motherboard.

Abstract: A network communication protocol translation system and method are provided. The SDN controller receives a first packet from the SDN switch. The first packet records the name of the source protocol of the source apparatus and the name of the destination protocol of the destination apparatus. The source protocol and the destination protocol are different. The SDN controller forwards the first packet to the cross proxy. The cross proxy translates the first packet that conforms to the source protocol into the second packet that conforms to the destination protocol and transmits the second packet to the destination apparatus. The cross proxy receives the third packet from the destination apparatus, translates the third packet that conforms to the destination protocol into the fourth packet that conforms to the source protocol, and transmits the fourth packet to the source apparatus.

Abstract: A database transformation server and a database transformation method thereof are provided. The database transformation server receives a plurality of rational data schema information and a rational database log. The database transformation server analyzes the rational data schema information for generating a rational table relation information, and analyzes the rational database log for generating rational table statistics information corresponding to rational data tables. The database transformation server transforms the rational data schema information into at least one piece of non-rational data schema information according to the rational table relation information, and adjusts the at least one piece of non-rational data schema information according to the rational table statistics information.

Abstract: An optical sensing module capable of providing a multi-directional optical sensing function teaches that the optical sensing module can be fixed on a circuit board via a bridging medium. The optical sensing module includes a supporter, a photosensitive component and a connecting component. The supporter includes a base and several lateral portions. The lateral portions are bent from edges of the base to form an accommodating space. The photosensitive component is disposed inside the accommodating space to receive an optical signal passing into an opening of the accommodating space. The connecting component is disposed on the supporter and includes a conductive terminal. The supporter is connected with the bridging material via the conductive terminal to stand on the circuit board by one of a plurality of sensing directions.

Abstract: A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.

Abstract: A parser is used for parsing a header in a packet. The parser includes a plurality of horizontal field selectors, a plurality of comparators, and a content addressable memory (CAM) based device. Each of the horizontal field selectors is configured to select a first bit group. The comparators are coupled to the horizontal field selectors, respectively. Each of the comparators is configured to compare a first bit group selected by a corresponding horizontal field selector with a designated value to generate a comparison result. The CAM based device is configured to receive a plurality of comparison results generated from the comparators, and use the comparison results as a first input search data.

Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

Abstract: A pressure sensing module and a pressure sensing touch control system are provided. The pressure sensing module includes a sensing layer formed on a surface of a substrate. The sensing layer includes at least one pressure sensing unit including four resistors with the same resistance values. The four resistors form a Wheatstone bridge. Pattern shapes of two of the four resistors have the same extending directions, and the two of the four resistors are not disposed adjacent to each other. The pressure sensing touch control system includes a touch control sensing unit. The touch control sensing unit is disposed between the four resistors to achieve pressure sensing and position sensing of pressing action. In the present disclosure, a bridge circuit is disposed on a single surface to prevent the sensing for pressing with a finger from being affected by temperature and other noise.

Abstract: A driving device of automatically adjusting a frame rate for an active matrix electrophoretic display and a driving method thereof are provided. The driving method has a phase signal generation step for generating a plurality of phase signals, a phase signal processing step for processing an Nth phase signal and an (N+1)th phase signal, an union step, and an output step for outputting a driving voltage selecting signal, a latch signal and a gate driver control signal. Thus, the power consumption can be reduced by analyzing to maintain or reduce the frame rate of the active matrix electrophoretic display.

Abstract: A micro dimming module for driving at least one LED and supporting a TRIAC dimmer to linearly adjust the illumination of the LED comprises a light board, a rectifier and a controller. The light board is a circuit board with a diameter less than or equal to 3 cm or a side length less than or equal to 3 cm, and the rectifier is built without a RC circuit. Namely, the TRIAC dimmer is capable of remaining in a stable working condition without requiring the RC circuit to supply a holding current, so that the lighting application has the advantages of minimizing volume and accomplishing high adaptability and applicability.

Abstract: A scanning device includes an upper cover, and a separation module detachably and changeably assembled in the upper cover. A middle of a bottom surface of the upper cover is recessed in an upward direction to form an assembling groove. The separation module includes a fastening holder, a separation roller assembly received in the fastening holder, a torsion limiter and a sealing cover. The torsion limiter is engaged with the separation holder. The sealing cover is mounted under the fastening holder. Different separation modules detachably and changeably assembled in the assembling groove are capable of being equipped with different torsion limiters. When the scanning device scans papers of which grams are different, torsion values of the scanning device are capable of being adjusted by virtue of changing the different separation modules equipped with the different torsion limiters.

Abstract: An electronic module includes a substrate, a metallic shielding cover, an electronic component and a piezoelectric element. The metallic shielding cover is disposed on the substrate and forms an accommodating chamber together with the substrate, wherein the metallic shielding cover has an opening, and the accommodating chamber is communicated with outside via the opening. The electronic component is disposed on the substrate and accommodated in the accommodating chamber. The piezoelectric element is adhered to the metallic shielding cover, wherein the piezoelectric element after being enabled is configured to bring a local portion of the metallic shielding cover for vibrating to change the volume of the accommodating chamber. In addition, a heat dissipation module is also disclosed.

Abstract: A magnetic element includes a first magnetic core, a second magnetic core and a plurality of conducting wires. The first magnetic core includes a first coiling body, a first protruding portion and a second protruding portion. The second magnetic core includes a second coiling body, a third protruding portion and a fourth protruding portion. A soldering surface of the first protruding portion is parallel and next to a soldering surface of the fourth soldering surface. Since an extension direction of the first magnetic core is extended from the soldering surface of the first protruding portion, an extension direction of the second magnetic core is extended from the soldering surface of the second protruding portion, and the plurality of conducting wires can be coiled on the first and the second coiling bodies respectively, the transformer can provide more space for coiling than the prior art.

Abstract: Disclosed is a BGA package with protective circuitry layouts to prevent cracks of the bottom circuit in the specific area of the substrate leading to package failure and to enhance packaging yield of BGA packages. A chip is disposed on the upper surface of the substrate. A chip projective area is defined inside the bottom surface of the substrate and is established by vertically projecting the edges of the chip on the upper surface to the bottom surface of the substrate. At least an external contact pad vulnerable to thermal stress is located within the chip projective area. A protective area and a wiring area are respectively defined in the chip projective area at two opposing sides of the external contact pad. A plurality of protective mini-pads are arranged in a dotted-line layout and disposed in the projective area to partially surround the external contact pad to avoid thermal stress concentrated on the protective area and to further prevent circuitry cracks in the package structure.

Abstract: A flicker-free dimming circuit for non-point light source has a TRIAC module, an input module, a conversion module and an output module. The TRIAC module adjusts the voltage phase of an external power supply for the input module to export an input voltage, and the conversion module in a boost circuit structure is provided with a conversion coil and a converter to receive and raise the voltage value of the input voltage to a voltage value of an operating voltage and then supplies the operating voltage to the output module. The output module adopts a fly-back circuit structure and induces the operating voltage to form a driving voltage in a constant value and then outputs the driving voltage to a lamp with a relatively wide light source area. In this way, the panel lamp can meet high safety standards and enhance its product adaptability and competiveness.

Abstract: A manufacturing method of a package structure includes at least the following steps. At least one first die is disposed over a carrier. The first die is encapsulated using a first encapsulant. The first encapsulant exposes part of the first die. A redistribution layer (RDL) is formed over the first encapsulant. The RDL has a first surface and a second surface opposite to the first surface. The first surface faces the first encapsulant. The first encapsulant and the first die are separated from the carrier. A plurality of second dies are disposed on the second surface of the RDL. The second dies are encapsulated using the second encapsulant. A plurality of conductive terminals are formed on the first surface of the RDL.

Abstract: A manufacturing method of a package structure includes at least the following steps. At least one first die is disposed over a carrier. The first die is encapsulated using a first encapsulant. The first encapsulant exposes part of the first die. A redistribution layer (RDL) is formed over the first encapsulant. The RDL has a first surface and a second surface opposite to the first surface. The first surface faces the first encapsulant. The first encapsulant and the first die are separated from the carrier. A plurality of second dies are disposed on the second surface of the RDL. The second dies are encapsulated using the second encapsulant. A plurality of conductive terminals are formed on the first surface of the RDL.

Abstract: A protection circuit includes a pre-charge rectifying circuit, a pre-charge resistor, a varistor, a switch, a main rectifying circuit, a bulk capacitor, and a control circuit. The pre-charge rectifying circuit is connected with an AC power source. The pre-charge resistor and the varistor are connected between the pre-charge rectifying circuit and the switch. The switch is further connected with a first node. The main rectifying circuit is connected between the AC power source and the first node. The bulk capacitor and the control circuit are connected between the first node and a ground terminal. The control circuit generates a first control signal to control the switch. The control circuit further generates a control signal set to control the main rectifying circuit.