Abstract: A section procedure tracking method comprises following steps: storing a plurality of process objects from a plurality of machines; calculating a plurality of basic process values according to a tension information, a length information, a speed information and a timing information of the process objects in a basic sequence; calculating an average basic value according to the basic process values; calculating a plurality of extra process values according to the tension information, the length information, the speed information and the timing information of the process objects in an extra sequence; calculating an average extra value according to the extra process values; selecting one of the average basic value and the average extra value having the smaller value; and selecting a search path corresponding to the smaller one of the average basic value and the average extra value as a process search order.

Abstract: A portable electronic device, including a first unit, a second unit and a hinge structure, is disclosed. The first unit includes a first display portion, a first back portion and a first receiving groove disposed on the first back portion. The second unit includes a second display portion and a second back portion selectively stacked with the first back portion. The hinge structure is disposed in the first receiving groove of the first unit and includes a fixing element disposed in the first receiving groove, a sliding element slidably disposed on the fixing element and a rotary element disposed on an outer side of the sliding element, wherein the second unit is pivoted to the rotary element via the second back portion. In this way, the hinge structure will not protrude outside the first and second units when the portable electronic device is in the folded status.

Abstract: An apparatus of coupled inductors includes a first coil and a second coil arranged in a way that an inter-coil capacitance between the first coil and the second coil can keep electromotive forces induced by a first inductance of the first coil and a second inductance of the second coil about the same. As the current bypasses an unbalanced parasitic capacitor, a compensation capacitor disposed between the two coils can compensate the inter-coil capacitance of the parasitic capacitor. The apparatus of coupled inductors implemented with a specific coil arrangement or disposed with the compensation capacitor can keep the EMFs induced over the two inductances equal in amplitude, which prevents both the differential-mode and common-mode interference from being converted, improving the characteristics of mode conversion and is suitable to be utilized in a PoE system or the like.

Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

Abstract: Disclosed are a light-emitting device for digital control of color temperature modulation and its application. The light-emitting device is electrically connected to a wall switch and includes a DIP switch, first LEDs, second LEDs and a control module. The control module is electrically connected to the above components and contains a truth table. The truth table includes at least a first mode, second mode, third mode and a memory and automatically switch mode, and a digital switching is accomplished by correlating the DIP switch to the truth table. In the memory and automatically switch mode, the first to third mode color temperatures are sequentially switched and controlled by turning on or off the wall switch according to the truth table information. The light-emitting device may be applied to light fixtures or mirror products to improve the convenience of use.

Abstract: A touch display module having a pressure detection mechanism is provided. The touch display module includes a 3-D (three-dimensional) sensor and a 3-D controller. The 3-D sensor includes touch units and at least one pressure sensing unit. The 3-D controller includes a driver and a driving pulse processor. The driver provides a pressure scan pulse to the pressure sensing unit and a touch scan pulse to the touch units in combination with the driving pulse processor. The present disclosure further provides a driving method corresponding to the touch display module having the pressure detection mechanism including steps of: providing pressure scan pulses to the pressure sensing unit by the driver in combination with the driving pulse processor and providing touch scan pulses to the touch units in combination of the driving pulse processor by the driver.

Abstract: An optical sensor package module and a manufacturing method thereof are provided. The optical sensor package module includes a substrate, a sensor chip and a shielding assembly. The sensor chip is disposed on the substrate and includes an array of pixels located at a top side thereof for receiving light. The shielding assembly surrounds the sensor chip for limiting influx of light onto the sensor chip, and the shielding assembly has a first aperture to expose at least a first subset of the pixels that is configured to receive corresponding light.

Abstract: An electronic device including a housing, a display component and an electronic component is provided. The housing includes a transparent cover and a middle frame, and the transparent cover is assembled to the middle frame. The display component is disposed in the housing. The electronic component is disposed in the housing, wherein the transparent cover has a flat portion and a connecting portion. The connecting portion curvingly extends from a side of the flat portion and includes at least one bonding surface, and a thickness of the flat portion is different from a thickness of the connecting portion.

Abstract: An apparatus of coupled inductors includes a first coil and a second coil arranged in a way that an inter-coil capacitance between the first coil and the second coil can keep electromotive forces induced by a first inductance of the first coil and a second inductance of the second coil about the same. As the current bypasses an unbalanced parasitic capacitor, a compensation capacitor disposed between the two coils can compensate the inter-coil capacitance of the parasitic capacitor. The apparatus of coupled inductors implemented with a specific coil arrangement or disposed with the compensation capacitor can keep the EMFs induced over the two inductances equal in amplitude, which prevents both the differential-mode and common-mode interference from being converted, improving the characteristics of mode conversion and is suitable to be utilized in a PoE system or the like.

Abstract: A touch panel assembly includes a touch panel, a flexible circuit board, an input element and a light emitting element. The touch panel includes sensing series and pads. The pads are disposed on bonding regions of the touch panel and electrically connected to the sensing series. The flexible circuit board includes bonding portions and a light guide portion. Each bonding portion is disposed at the bonding region and includes terminals electrically connecting the pads. The light guide portion includes a connecting portion connecting the corresponding bonding portion and an extending portion connecting the connecting portion and extended away from the touch panel. The input element is located right above the extending portion. The light emitting element is disposed at a light incident side of the light guide portion.

Abstract: A system and a method for treating salt-containing glycerin wastewater are provided, wherein the system for treating the salt-containing glycerin wastewater includes a mixing tank, a filtering device, a distillation column, and a water supply device. The mixing tank is adapted to mix salt-containing glycerin wastewater with a concentrated hydrochloric acid to obtain a mixture. The filtering device communicates with the mixing tank and filters the mixture to obtain an acidic filtrate and a precipitated salt. The distillation column communicates with the filtering device and receives the acidic filtrate from the filtering device. The water supply device supplies water to the acidic filtrate. The system and method for treating the salt-containing glycerin wastewater can effectively recycle hydrochloric acid.

Abstract: A thin fan-out multi-chip stacked package structure including a plurality of stacked chips is provided. The electrodes of the stacked chips and the active surface of the top chip are exposed. A dummy spacer and an alignment structure are disposed over the active surface. Each bonding wire has a bonding thread bonded to a chip electrode and an integrally-connected vertical wire segment. A flat encapsulant encapsulates the chip stacked structure and the bonding wires. Polished cross-sectional surfaces of the bonding wires and a surface of the alignment structure are exposed by the flat surface of the encapsulant. A redistribution layer structure is formed on the flat surface. A passivation layer covers the flat surface and exposes the polished cross-sectional surfaces and the alignment structure. Fan-out circuits are formed on the passivation layer and are connected to the polished cross-sectional surfaces of the bonding wires and the alignment structure.

Abstract: A panel assembly includes a transparent cover, a display module, a decorative layer, and a Fresnel lens structure. The transparent cover has a lower surface. The display module is disposed under the lower surface. The decorative layer is disposed on the lower surface. The Fresnel lens structure is located above the display module. Besides, an electronic device includes a frame, a housing, and the above panel assembly, and the housing and the panel assembly are installed in the frame.

Abstract: A textile machine adjustment method is provided. An operating speed of a textile machine within an operating range is set by a processor according to the basic information of the fabric. A motion image of the fabric and the vibration characteristics of the yarns are recorded by a video camera. The operating speed of the textile machine is adjusted at least once, and the vibration characteristics of the yarns is analyzed after each adjustment of the operating speed. Multiple correlation factor functions and the relative weights of the multiple factors related to the operating speed of the textile machine are recorded. The relative weights of the multiple factors are adjusted according to a yield quality of the fabric. When an expected value is met, the fabric continues to be produced at the current operating speed; otherwise, the relative weights of multiple factors are adjusted to correct the operating speed.

Abstract: A crimping apparatus comprising a press module connected with a pressing mold, a translation module, and a pressure control module is disclosed. The press module generates an action force on the pressing mold through a fluid. The translation module is coupled to the press module for driving the press module to move toward a flexible printed circuit having two isolated circuit layers such that one circuit layer is pressed to crimp to the other circuit layer, wherein the pressure control module adjusts the pressure within the press module to maintain a constant force on the pressing mold whereby the pressing mold can generate a constant stress acting on the flexible printed circuit during the crimping process. In addition, the crimping apparatus can be adapted in a roll-to-roll process for crimping two isolated circuit layers of each flexible printed circuit unit arranged on the roll.

Abstract: A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.

Abstract: A receptacle connector adapted to be fixed to a casing of an electronic device and electrically connected to a circuit board for enabling the receptacle connector to be adapted to connect with a plug connector is provided. The receptacle connector includes an insulating body and a plurality of conductive terminals. The insulating body has a tunnel, and the tunnel extends from the outer side of the insulating body to the inner side of the insulating body, wherein a side of the tunnel is exposed at a top portion of the insulating body, and the insulating body is adapted to be fixed to the casing to cover the side of the tunnel, so that the tunnel is adapted to form a plug hole with the casing. The conductive terminals are disposed through the insulating body. A receptacle connector and an electronic device are also provided.

Abstract: A composite magnetic component is provided. The composite magnetic component includes a magnetic flux-guiding unit, a first coil structure and a second coil structure. The first coil structure and the second coil structure are wound around a first winding portion and a second winding portion of the magnetic flux-guiding unit, respectively. A first magnetic flux results from the first coil structure and the magnetic flux-guiding unit. A second magnetic flux results from the second coil structure and the magnetic flux-guiding unit. The first magnetic flux is orthogonal to the second magnetic flux within the magnetic flux-guiding unit.

Abstract: A thin fan-out multi-chip stacked package structure including a plurality of stacked chips is provided. The electrodes of the stacked chips and the active surface of the top chip are exposed. A dummy spacer and an alignment structure are disposed over the active surface. Each bonding wire has a bonding thread bonded to a chip electrode and an integrally-connected vertical wire segment. A flat encapsulant encapsulates the chip stacked structure and the bonding wires. Polished cross-sectional surfaces of the bonding wires and a surface of the alignment structure are exposed by the flat surface of the encapsulant. A redistribution layer structure is formed on the flat surface. A passivation layer covers the flat surface and exposes the polished cross-sectional surfaces and the alignment structure. Fan-out circuits are formed on the passivation layer and are connected to the polished cross-sectional surfaces of the bonding wires and the alignment structure.