Patents by Inventor Cheng Hu

Cheng Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10471164
    Abstract: One or more aspects of the present disclosure are directed to aqueous solutions that can be used to make substrates such as an article that can inhibit or limit one or more sources of odor. In an aspect, the aqueous solution can include one or more components, where one of the components is an inhibiting agent that can function to inhibit or limit the sources of odor in an article such as a textile.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: November 12, 2019
    Assignee: Nike, Inc.
    Inventor: Cheng Hu
  • Patent number: 10446914
    Abstract: An antenna structure includes a dielectric substrate and a metal element. The metal element is disposed on the dielectric substrate, and includes a transmission element and a radiation element. A first triangular hollow region and a second triangular hollow region are formed on the radiation element.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: October 15, 2019
    Assignee: WISTRON CORP.
    Inventor: Pei-Cheng Hu
  • Patent number: 10446447
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a shallow trench isolation (STI) around the fin-shaped structure; forming a liner on the fin-shaped structure; and removing the liner and part of the fin-shaped structure so that a sidewall of the fin-shaped structure comprises a curve. Moreover, the method includes forming an epitaxial layer around the sidewall of the fin-shaped structure while a top surface of the fin-shaped structure is exposed.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: October 15, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yi-Fan Li, I-Cheng Hu, Chun-Jen Chen, Tien-I Wu, Yu-Shu Lin, Chun-Yuan Wu
  • Patent number: 10435395
    Abstract: Crystalline form S1 of lifitegrast characterized by a powder X-ray diffraction pattern with peaks at about 10.7±0.2, 16.2±0.2, 19.9±0.2, 22.1±0.2, 24.7±0.2, and 25.9±0.2 degrees two-theta, crystalline form S2 of lifitegrast characterized by a powder X-ray diffraction pattern with peaks at about 16.4±0.2, 24.9±0.2, and 26.2±0.2 degrees two-theta, and processes of making thereof are provided.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: October 8, 2019
    Assignee: SCINOPHARM TAIWAN, LTD.
    Inventors: Wen-Wei Lin, Tsung-Cheng Hu, YuanChang Huang, Ming-Chih Wu
  • Publication number: 20190300512
    Abstract: Crystalline form S1 of lifitegrast characterized by a powder X-ray diffraction pattern with peaks at about 10.7±0.2, 16.2±0.2, 19.9±0.2, 22.1±0.2, 24.7±0.2, and 25.9±0.2 degrees two-theta, crystalline form S2 of lifitegrast characterized by a powder X-ray diffraction pattern with peaks at about 16.4±0.2, 24.9±0.2, and 26.2±0.2 degrees two-theta, and processes of making thereof are provided.
    Type: Application
    Filed: March 8, 2019
    Publication date: October 3, 2019
    Inventors: Wen-Wei Lin, Tsung-Cheng Hu, YuanChang Huang, Ming-Chih Wu
  • Publication number: 20190300537
    Abstract: The present disclosure relates generally to methods and compositions for preventing or arresting cell death and/or inflammation.
    Type: Application
    Filed: June 7, 2019
    Publication date: October 3, 2019
    Applicant: Denali Therapeutics Inc.
    Inventors: Anthony A. Estrada, Jianwen A. Feng, Brian Fox, Cheng Hu, Maksim Osipov, Zachary K. Sweeney, Javier de Vicente Fidalgo, Arun Thottumkara
  • Publication number: 20190248544
    Abstract: A collapsible storage box contains: a bottom plate, a first long plate, a second long plate, and two foldable short plates. Each foldable short plate includes a first connection sheet and a second connection sheet. A front end of the bottom plate retains with multiple first L-shaped hooks on a bottom of the first long plate, multiple first rotary shafts on a rear end of the bottom plate rotatably connect with multiple first retainers on a bottom of the second long plate respectively, a first side of the bottom plate retains with a first flexible hook on a bottom of the first connection sheet of each foldable short plate, and a second side of the bottom plate retains with a second flexible hook on a bottom of the second connection sheet of each foldable short plate. Thereby, the collapsible storage box is expanded and retracted quickly and easily.
    Type: Application
    Filed: February 9, 2018
    Publication date: August 15, 2019
    Inventor: Wei Cheng HU
  • Patent number: 10338888
    Abstract: An electronic component footprint setup system in collaboration with a circuit layout system and a method thereof are provided in the present disclosure. The electronic component footprint setup system in collaboration with a circuit layout system provides a user operating the circuit layout system with an interface on which parameters of an electronic component footprint to be created are configured; the parameters of the electronic component footprint are transformed for conforming to electronic component footprint specifications used in the circuit layout system; characteristic values of the electronic component footprint are calculated according to electronic component footprint specifications and electronic component footprint setup regulations; the electronic component footprint is created in the circuit layout system according to the characteristic values.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: July 2, 2019
    Assignee: Footprintku Inc.
    Inventors: Cheng-Ta Lu, Yu-Cheng Hu, Guan-Yu Shih, Kun-You Lin, Mong-Fong Horng
  • Publication number: 20190175606
    Abstract: The present invention provides compounds of Formula (I) as described herein, and salts thereof, and therapeutic uses of these compounds for treatment of disorders associated with Raf kinase activity. The invention further provides pharmaceutical compositions comprising these compounds, and compositions comprising these compounds and a therapeutic co-agent.
    Type: Application
    Filed: February 12, 2019
    Publication date: June 13, 2019
    Inventors: Robert John AVERSA, Paul Andrew BARSANTI, Matthew T. BURGER, Michael Patrick DILLON, Alan DIPESA, Cheng HU, Yan LOU, Gisele A. NISHIGUCHI, Yue PAN, Valery Rostislavovich POLYAKOV, Savithri RAMURTHY, Alice C. RICO, Lina Quattrocchio SETTI, Aaron SMITH, Sharadha SUBRAMANIAN, Benjamin R. TAFT, Huw Roland TANNER, Lifeng WAN, Naeem YUSUFF
  • Patent number: 10280279
    Abstract: The present invention provides a conductive polymer composition, a conductive polymer sheet, an electrical device, and their preparation methods. The conductive polymer composition of the present invention includes a polymer and a conductive powder at a volume ratio of 35:65 to 65:35. The polymer includes at least one semicrystalline polymer selected from polyolefin, a copolymer of at least one olefin and at least one non-olefinic monomer copolymerizable therewith, and a thermoformable fluorine-containing polymer. The stated conductive powder includes at least one powder of a transition metal carbide, a transition metal carbon silicide, a transition metal carbon aluminide, and a transition metal carbon stannide. And the stated size distribution of the conductive powder satisfies: 20>D100/D50>6, where D50 denotes a corresponding particle size when a cumulative particle-size distribution percent in the conductive powder reaches 50%, and D100 denotes a maximum particle size.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: May 7, 2019
    Assignees: LITTELFUSE ELECTRONICS (SHANGHAI) CO., LTD, LITTELFUSE, INC.
    Inventors: Yingsong Fu, Jianhua Chen, Mingjun Jin, Zhiyong Zhou, Wei Zheng, Cheng Hu
  • Publication number: 20190123028
    Abstract: A package includes package includes a first package component including a first plurality of electrical connectors at a top surface of the first package component, and a second plurality of electrical connectors longer than the first plurality of electrical connectors at the top surface of the first package component. A first device die is over the first package component and bonded to the first plurality of electrical connectors. A second package component is overlying the first package component and the first device die. The second package component includes a third plurality of electrical connectors at a bottom surface of the second package component. The third plurality of electrical connectors is bonded to the second plurality of electrical connectors. A fourth plurality of electrical connectors is at a bottom surface of the second package. The second and the fourth plurality of electrical connectors comprise non-solder metallic materials.
    Type: Application
    Filed: December 17, 2018
    Publication date: April 25, 2019
    Inventors: Chen-Hua Yu, Chen-Shien Chen, Shou-Cheng Hu
  • Patent number: 10245267
    Abstract: The present invention provides compounds of Formula (I) as described herein, and salts thereof, and therapeutic uses of these compounds for treatment of disorders associated with Raf kinase activity. The invention further provides pharmaceutical compositions comprising these compounds, and compositions comprising these compounds and a therapeutic co-agent.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: April 2, 2019
    Assignee: Novartis AG
    Inventors: Robert John Aversa, Paul Andrew Barsanti, Matthew T. Burger, Michael Patrick Dillon, Alan Dipesa, Cheng Hu, Yan Lou, Gisele A. Nishiguchi, Yue Pan, Valery Rostislavovich Polyakov, Savithri Ramurthy, Alice C. Rico, Lina Quattrocchio Setti, Aaron Smith, Sharadha Subramanian, Benjamin R. Taft, Huw Roland Tanner, Lifeng Wan, Naeem Yusuff
  • Publication number: 20190064876
    Abstract: This application discloses a data processing apparatus. In an embodiment, the apparatus includes a box that accommodates a data processing module and a moving component disposed on the box, and the moving component includes a rolling member. In an embodiment, the box is used for accommodating the data processing module used for performing data processing, and the moving component is disposed on the box. By rolling of the rolling member in the moving component, the data processing apparatus may be moved. When data processing services need to be executed in different scenarios, the data processing apparatus can be moved to different scenarios by using the rolling member, which is very convenient.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 28, 2019
    Applicant: Siemens Ltd., China
    Inventors: Hai LIU, Xue Feng ZHU, Hai Gang BIE, Hai Bo SHENG, Xi TAO, Cheng HU, Peng Wei TIAN
  • Publication number: 20190050200
    Abstract: An electronic component footprint setup system in collaboration with a circuit layout system and a method thereof are provided in the present disclosure. The electronic component footprint setup system in collaboration with a circuit layout system provides a user operating the circuit layout system with an interface on which parameters of an electronic component footprint to be created are configured; the parameters of the electronic component footprint are transformed for conforming to electronic component footprint specifications used in the circuit layout system; characteristic values of the electronic component footprint are calculated according to electronic component footprint specifications and electronic component footprint setup regulations; the electronic component footprint is created in the circuit layout system according to the characteristic values.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 14, 2019
    Applicant: FootPrintKu Inc.
    Inventors: Cheng-Ta Lu, Yu-Cheng Hu, Guan-Yu Shih, Kun-You Lin, Mong-Fong Horng
  • Publication number: 20190020098
    Abstract: An antenna structure includes a dielectric substrate and a metal element. The metal element is disposed on the dielectric substrate, and includes a transmission element and a radiation element. A first triangular hollow region and a second triangular hollow region are formed on the radiation element.
    Type: Application
    Filed: September 26, 2017
    Publication date: January 17, 2019
    Inventor: Pei-Cheng Hu
  • Patent number: 10160726
    Abstract: This invention is in the field of medicinal chemistry and relates to compounds, and pharmaceutical compositions thereof, that inhibit bacterial gyrase. The compounds are useful as inhibitors of bacterial gyrase activity and bacterial infections, and have the structure of Formula (I) as further described herein. The invention further provides pharmaceutical compositions comprising a compound of Formula (I) and methods of using the compounds and compositions to treat bacterial infections.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: December 25, 2018
    Assignee: Novartis AG
    Inventors: Javier de Vicente Fidalgo, Haiying He, Cheng Hu, Zhigan Jiang, Xiaolin Li, Peichao Lu, Wosenu Mergo, Daniel Mutnick, Folkert Reck, Alexey Rivkin, Colin Keith Skepper, Xiaojing Michael Wang, Jianhua Xia, Yongjin Xu
  • Patent number: 10138211
    Abstract: In certain aspects, the invention provides crystalline forms of olaparib (4-[(3-[(4-cyclopropylcarbonyl)piperazin-4-yl]carbonyl)-4-fluorophenyl]methyl(2H)phthalazin-1-one). In related aspects, the invention provides processes for preparing the crystalline forms of olaparib. The processes include: forming a solution comprising crude olaparib and an organic solvent; adding an anti-solvent to the solution to form a slurry comprising a precipitate; isolating the precipitate; and drying the precipitate to obtain a crystalline form I of olaparib or a crystalline form II of olaparib.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: November 27, 2018
    Assignee: SCINOPHARM TAIWAN, LTD.
    Inventors: Wen-Wei Lin, Tsung-Cheng Hu, Yuan-Chang Huang
  • Patent number: 10128366
    Abstract: A semiconductor device includes a semiconductor substrate, a gate structure formed over the semiconductor substrate, and an epitaxial structure formed partially within the semiconductor substrate. The gate structure includes a gate dielectric layer formed over the semiconductor substrate, a gate electrode formed over the gate dielectric layer, and a spacer formed on side surfaces of the gate dielectric layer and the gate electrode. A laterally extending portion of the epitaxial structure extends laterally at an area below a top surface of the semiconductor substrate in a direction toward an area below the gate structure. A lateral end of the laterally extending portion is below the spacer.
    Type: Grant
    Filed: February 6, 2018
    Date of Patent: November 13, 2018
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Yu-Ying Lin, Kuan Hsuan Ku, I-Cheng Hu, Chueh-Yang Liu, Shui-Yen Lu, Yu Shu Lin, Chun Yao Yang, Yu-Ren Wang, Neng-Hui Yang
  • Publication number: 20180323302
    Abstract: A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a shallow trench isolation (STI) around the fin-shaped structure; forming a liner on the fin-shaped structure; and removing the liner and part of the fin-shaped structure so that a sidewall of the fin-shaped structure comprises a curve. Moreover, the method includes forming an epitaxial layer around the sidewall of the fin-shaped structure while a top surface of the fin-shaped structure is exposed.
    Type: Application
    Filed: July 16, 2018
    Publication date: November 8, 2018
    Inventors: Yi-Fan Li, I-Cheng Hu, Chun-Jen Chen, Tien-I Wu, Yu-Shu Lin, Chun-Yuan Wu
  • Publication number: 20180308824
    Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.
    Type: Application
    Filed: June 25, 2018
    Publication date: October 25, 2018
    Inventors: Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu