Patents by Inventor CHENG PING

CHENG PING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11975421
    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: May 7, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng, Rong-Long Hung
  • Patent number: 11979479
    Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.
    Type: Grant
    Filed: January 16, 2023
    Date of Patent: May 7, 2024
    Assignees: Chung Yuan Christian University, KGI Securities Co. Ltd.
    Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
  • Publication number: 20240139337
    Abstract: The present disclosure relates to a method for treating a cancer and/or cancer metastasis in a subject comprising administering to the subject irinotecan loaded in a mesoporous silica nanoparticle. The present disclosure also provides a conjugate comprising an agent loaded in a mesoporous silica nanoparticle (MSN) defining at least one pore and having at least one functional group on a sidewall of the at least one pore.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 2, 2024
    Inventors: Cheng-Hsun WU, SI-HAN WU, YI-PING CHEN, RONG-LIN ZHANG, CHUNG-YUAN MOU, Yu-Tse LEE
  • Patent number: 11973040
    Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes providing a substrate for an interposer, and forming a conductive interconnect structure in and on the substrate for connecting a group of selected IC dies. The method includes forming warpage-reducing trenches in non-routing regions of the interposer, wherein the warpage-reducing trenches are sized and positioned based on a warpage characteristic to reduce the warpage of the chip package structure. The method also includes depositing a warpage-relief material in the warpage-reducing trenches according to the warpage characteristic to reduce the warpage of the chip package structure, and bonding the group of selected IC dies to the interposer to form a chip package structure.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Yang Hsieh, Chien-Chang Lee, Chia-Ping Lai, Wen-Chung Lu, Cheng-Kang Huang, Mei-Shih Kuo, Alice Huang
  • Publication number: 20240137431
    Abstract: A packet sorting and reassembly circuit module, including a header parser, an information processing circuit, at least one state tracking and reassembly circuit, and an output arbiter, is provided. The header parser is configured to analyze multiple first packet segments to obtain header information corresponding to a first network packet, wherein the first network packet is transmitted based on a transmission control protocol (TCP) communication protocol. The information processing circuit is configured to transmit the first packet segments and sideband information corresponding to the first packet segments to a first state tracking and reassembly circuit among the at least one state tracking and reassembly circuit according to the header information. The first state tracking and reassembly circuit is configured to reassemble and sort the first packet segments according to the sideband information. The output arbiter is configured to output the first packet segments according to a sorting result.
    Type: Application
    Filed: January 16, 2023
    Publication date: April 25, 2024
    Applicants: Chung Yuan Christian University, KGI Securities Co. Ltd.
    Inventors: Yu-Kuen Lai, Chao-Lin Wang, He-Ping Li, Cheng-Han Chuang, Kai-Po Chang
  • Publication number: 20240127788
    Abstract: In various examples, one or more text-to-speech machine learning models may be customized or adapted to accommodate new or additional speakers or speaker voices without requiring a full re-training of the models. For example, a base model may be trained on a set of one or more speakers and, after training or deployment, the model may be adapted to support one or more other speakers. To do this, one or more additional layers (e.g., adapter layers) may be added to the model, and the model may be re-trained or updated—e.g., by freezing parameters of the base model while updating parameters of the adapter layers—to generate an adapted model that can support the one or more original speakers of the base model in addition to the one or more additional speakers corresponding to the adapter layers.
    Type: Application
    Filed: October 13, 2022
    Publication date: April 18, 2024
    Inventors: Cheng-Ping HSIEH, Subhankar GHOSH, Boris GINSBURG
  • Publication number: 20240118728
    Abstract: A head-mounted device comprises a main body, a monitor-base, a monitor, and an adjusting component. The main body is mounted on a user's head. The monitor moves with the monitor-base. An eyes-monitor distance is defined between the user's eyes and the monitor. A visual range is defined by a range seen by the user's eyes through the monitor. The adjusting component is configured for pulling or pushing the monitor-base towards the user's eyes to prevent the eyes-monitor distance from increasing and to prevent the visual range from decreasing. When the user wears a pair of glasses between the user's eyes and the monitor, and the glasses block the monitor causing the eyes-monitor distance to be larger than a preset distance, the adjusting component pulls or pushes the monitor-base until the monitor contacts the glasses, to prevent the eyes-monitor distance from increasing. An augmented reality device is also disclosed.
    Type: Application
    Filed: December 15, 2023
    Publication date: April 11, 2024
    Inventors: Hai-Ping Tang, Cheng-Ching Chien
  • Publication number: 20240110977
    Abstract: A comparator testing circuit and a testing method are provided. The comparator testing circuit includes a switching circuit, a comparator, and a determination circuit. The switching circuit receives a first signal, a second signal, and a switching signal, and outputs one of the first signal and the second signal as a first input signal and the other of the first signal and the second signal as a second input signal according to the switching signal. The comparator compares the first input signal with the second input signal to generate an output signal. The determination circuit determines whether the comparator is abnormal based on the switching signal and the output signal to generate an exception flag.
    Type: Application
    Filed: September 25, 2023
    Publication date: April 4, 2024
    Applicant: Nuvoton Technology Corporation
    Inventors: Chih-Ping Lu, Cheng-Chih Wang
  • Publication number: 20240107228
    Abstract: Example embodiments relate to vehicle sensor modules with external audio receivers. An example sensor module may include sensors and can be coupled to a vehicle's roof with a first microphone positioned proximate to the front of the sensor module. The sensor module can also include a second microphone extending into a first side of the sensor module such that the second microphone is configured to detect audio originating from an environment located relative to a first side of the vehicle and a third microphone extending into a second side of the sensor module such that the third microphone is configured to detect audio originating from the environment located relative to a second side of the vehicle, wherein the second side is opposite of the first side.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Inventors: Cheng-Han Wu, Choon Ping Chng, Jun Hou, Miklos Szentkiralyi, Rutvik Acharya
  • Publication number: 20240095900
    Abstract: A defect detection method includes: obtaining an image of a first defective block output by the SPI machine; wherein the first defective block is a solder paste block that is not qualified for printing after being detected by the SPI machine; processing the image of the first defective block; detecting whether solder paste printing in the first defective block is qualified; and determining that the first defective block is a second defective block and determining a defect type of the first defective block when the solder paste printing of the first defective block is not qualified. A terminal device and a non-volatile storage medium therein, for performing the above-described method, are also disclosed.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 21, 2024
    Inventors: WAN-HSIN TARNG, CHENG-JU YANG, TSAI-PING CHU
  • Publication number: 20240078149
    Abstract: A method, computer system, and computer program product for data monitoring management are provided. A first invalid zero value candidate from a data stream is received. A memory location for the first invalid zero value candidate is received. At a first time an access connection to the memory location is established. At a second time subsequent to the first time the access connection to the memory location is checked. Based on the checking, a determination is made whether the first invalid zero value candidate contains an invalid zero value.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Bo Chen Zhu, Cheng Fang Wang, Ai Ping Feng, Xinzhe Wang, Yan Ting Li, Hong Yan Gu
  • Patent number: 11919126
    Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng
  • Patent number: 11920770
    Abstract: Example embodiments described herein involve a system for testing a light-emitting module. The light-emitting module may include a mounting platform configured to hold a light-emitting module for a camera. The mounting platform may also be configured to rotate. The system may further include a housing holding a plurality of photodiodes arranged in an array over at least a 90 degree arc of a hemisphere. The system may also include a controller configured to control the photodiodes and the rotation of the mounting platform.
    Type: Grant
    Filed: January 13, 2023
    Date of Patent: March 5, 2024
    Assignee: Waymo LLC
    Inventors: Choon Ping Chng, Cheng-Han Wu, Lucian Ion, Giulia Guidi
  • Publication number: 20240066313
    Abstract: An electronic device includes a light emitting layer, a light conversion layer and an adjustable structure. The light emitting layer has a plurality of light emitting units for emitting light. The light conversion layer converts the wavelength of the light emitted by at least one light emitting unit to provide converted light. The adjustable structure is controlled to adjust a light penetrating area to correspond to the affected part to be treated, wherein at least one of the light and the converted light passes through the light penetrating area to irradiate the affected part.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Inventors: Jih-Ping LIN, Chun-Kai LEE, Fang-Iy WU, Cheng-Hsu CHOU
  • Patent number: 11912761
    Abstract: The present invention is directed to antigen binding proteins and in particular to IL-1? antigen binding proteins. The present invention further provides compositions comprising the antigen binding proteins, use of the antigen binding proteins and methods for production.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: February 27, 2024
    Assignee: Agency for Science, Technology and Research
    Inventors: Cheng-I Wang, Angeline Goh, Siok Ping Yeo, Alessandra Rosa Mortellaro, Subhra Kumar Biswas, Florent Ginhoux, Pingyu Zhong
  • Publication number: 20240039065
    Abstract: A battery module including a battery frame, a plurality of locking structures, a plurality of battery units, and a plurality of lug structures is provided. The battery frame is provided with an accommodating space. The battery frame includes a first portion extending along a first direction and a second portion extending along a second direction. The first direction is different from the second direction. The locking structures are disposed on the battery frame. At least one of the plurality of locking structures is disposed on an outer side of each of the first portion and the second portion. The battery units are disposed in the accommodating space. Each of the lug structures includes a lock portion configured to detachably engage with one of the locking structures.
    Type: Application
    Filed: February 21, 2023
    Publication date: February 1, 2024
    Inventors: Po-Ching HUANG, Hui Wen CHIU, Chun-Wen WANG, Pao-Long FAN, Cheng-Ping TSAI, Ting-Jui HU, Chao Chan TAN, Ming-Hung YAO, Chien-Chih SHIH, Jui-Liang HO, Ching-Kai YU, Chih-Wei LAI
  • Patent number: 11850702
    Abstract: In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ping Chen, Ren-Dou Lee, Sheng-Tai Peng, Tsung-Lung Lai, Tzi-Yi Shieh, Chien-Wei Chang
  • Publication number: 20230234184
    Abstract: A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.
    Type: Application
    Filed: April 3, 2023
    Publication date: July 27, 2023
    Inventors: Cheng-Ping CHEN, Shih-Chung CHEN, Sheng-Tai PENG, Hung-Lin CHEN
  • Publication number: 20230221172
    Abstract: A transmission device is provided and includes a transmission structure and a circuit board, where the circuit board is disposed on an input end of the transmission structure, and a sensing element and a data processing element communicatively connected to the sensing element are integrated on the circuit board to perform signal measurement operations.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 13, 2023
    Inventors: Li-Te HUANG, Cheng-Ping YANG, Chih-Hsuang HUANG
  • Publication number: 20230174772
    Abstract: A component (A1) thereof includes an epoxy resin having at least one of a naphthalene skeleton or a biphenyl skeleton. A component (A2) thereof includes a phenolic resin having at least one of the naphthalene skeleton or the biphenyl skeleton. A component (B) thereof includes a high molecular weight substance having structures expressed by at least formulae (b2) and (b3) out of formulae (b1), (b2), and (b3) and having a weight average molecular weight equal to or greater than 200,000 and equal to or less than 850,000. A component (C1) thereof includes a first filler obtained by subjecting a first inorganic filler to surface treatment using a first silane coupling agent expressed by formula (c1). A component (C2) thereof includes a second filler obtained by subjecting a second inorganic filler to surface treatment using a second silane coupling agent expressed by formula (c2).
    Type: Application
    Filed: March 25, 2021
    Publication date: June 8, 2023
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Cheng Ping LIN, Toshiyuki MAKITA, Naohito FUKUYA