Abstract: A method for producing an outer shell includes steps of a) stacking a second plate on a first plate, the second plate having an accommodation space that is recessed toward the first plate; b) disposing a filling material in the accommodation space; c) stacking a third plate on the second plate so as to cover the filling material and to form a composite structure; and d) stamping the composite structure such that a peripheral portion of the composite structure is bent, thereby forming an outer shell. In step b), a weight of the filling material is lower than that of the first plate, that of the second plate, and that of the third plate, or rigidity of the filling material is higher than that of the first plate, that of the second plate, and that of the third plate.

Abstract: A method for forming a two-color coating layer includes steps of: a) conducting a coating process by applying a coating layer on a workpiece having a stepped surface, so that the coating layer having a first color is formed on the stepped surface, the stepped surface having a lower region, an upper region, and a middle shoulder region; b) forming an ink layer that has a second color and that covers the coating layer; c) soft baking the ink layer; d) exposing to light a first area of the ink layer so that the first area undergoes a crosslinking reaction; e) developing the ink layer so that a second area of the ink layer is removed; and f) hard baking the ink layer, wherein the stepped surface has the second color formed on the lower and middle shoulder regions, and the first color formed on the upper region.

Abstract: A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

Abstract: A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.

Abstract: A method for combining heterogeneous metal parts includes steps of: a) disposing a first metal part and a second metal part in a lower mold cavity of a lower mold, the lower mold cavity having a lower portion and an upper portion, the lower mold including a channel that communicates with an external environment; b) combining an upper mold and the lower mold with an upper mold cavity of the upper mold facing the lower mold cavity, the upper mold cavity being defined by an inner base surface and an inner surrounding surface; and c) injecting a bonding adhesive into the channel so as to fill the lower portion of the lower mold cavity and a gap between the first metal part and the second metal part with the bonding adhesive.

Abstract: A method for combining heterogeneous metal parts includes steps of: a) disposing a first metal part in a mold cavity of a lower mold, the first metal part including a bottom portion, a vertical portion, and an extension portion; b) disposing a first upper mold on the upper surface of the extension portion of the first metal part; c) before or after step a), providing a bonding adhesive on the bottom portion of the first metal part; and d) after steps a), b), and c), pressing a second metal part downwardly to force a lower surface of second metal part to press against the bonding adhesive.

Abstract: A component (A1) thereof includes an epoxy resin having at least one of a naphthalene skeleton or a biphenyl skeleton. A component (A2) thereof includes a phenolic resin having at least one of the naphthalene skeleton or the biphenyl skeleton. A component (B) thereof includes a high molecular weight substance having structures expressed by at least formulae (b2) and (b3) out of formulae (b1), (b2), and (b3) and having a weight average molecular weight equal to or greater than 200,000 and equal to or less than 850,000. A component (C1) thereof includes a first filler obtained by subjecting a first inorganic filler to surface treatment using a first silane coupling agent expressed by formula (c1). A component (C2) thereof includes a second filler obtained by subjecting a second inorganic filler to surface treatment using a second silane coupling agent expressed by formula (c2).

Abstract: A method for molding a composite component, which includes step (a) of providing a forming mold and a preformed substrate, in which the forming mold includes a lower mold and an upper mold matched with each other; step (b) of disposing the preformed substrate into an accommodating space, and clamping the upper mold against the lower mold such that a mold cavity is formed between the preformed substrate and the upper mold; step (c) of injecting a polymer material into the mold cavity from a sprue of the upper mold under an injecting pressure, while pushing the preformed substrate by the polymer material which is formed by the injecting pressure, thereby forming a first deformed portion; and step (d) of further clamping the upper mold against the lower mold using a molding pressure, while pushing the polymer material and the first deformed portion, thereby obtaining a semi-finished product.

Abstract: A method for manufacturing a composite structure having first and second structural members includes the steps of: (A) placing a plate in a forming mold having a first molding member, and a second molding member with an injection hole; (B) moving the first molding member toward the second molding member to stamp and deform the plate; (C) injecting a molten substrate onto the plate via the injection hole to stamp and deform again the plate so as to form the first structural member; (D) removing an assembly of the first structural member and a solidified substrate from the first molding member; and (E) removing an excess part of the solidified substrate to form the second structural member.

Abstract: A method for coating a substrate includes the steps of: forming a conductive coating layer on a surface of a substrate so as to form a semi-product; submerging a conductive sheet and the semi-product into an electrophoresis medium that includes charged colloid particles; and applying a voltage on the conductive sheet or the semi-product to form an electric field among the conductive sheet, the semi-product, and the electrophoresis medium, so that the colloid particles move along the electric field toward the semi-product and an electrophoretic covering layer formed by the charged colloid particles is thus deposited on the electrophoretic covering layer.

Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.

Abstract: The disclosure provides a drug delivery composition, method of forming the same and method for treating inner ear disorders. The drug delivery composition includes a temperature sensitive hydrogel, a plurality of microbubbles and a drug. Every microbubble has a protein shell and an inert gas core. These microbubbles are dispersed in the temperature sensitive hydrogel. The drug is dispersed in the temperature sensitive hydrogel. Moreover, the drug delivery composition has a viscosity that can induce cavitation effect.

Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.

Abstract: Package structures and methods for forming the same are provided. The method includes forming a passivation layer having an opening and forming a first seed layer in the opening. The method further includes filling the opening with a conductive layer over the first seed layer and bonding an integrated circuit die to the conductive layer over a first side of the passivation layer. The method further includes removing a portion of the first seed layer to expose a top surface of the conductive layer and to partially expose a first sidewall of the passivation layer from a second side of the passivation layer and forming a second seed layer over the top surface of the conductive layer and over the first sidewall of the passivation layer.

Abstract: The present invention provides a surface treatment method for magnesium alloy object, the method comprising: providing a magnesium alloy object; preprocessing the magnesium alloy object; performing micro-arc oxidation (MAO) treatment on the magnesium alloy object to form a micro-arc oxidation layer; Sputtering at least one metal layer or at least one non-metal layer on a surface of the micro-arc oxidation layer, the metal layer or non-metal layer which is sputtered on the micro-arc oxidation layer has different angles by using surface roughness of the micro-arc oxidation layer when a light source is projected on the metal layer or non-metal layer; and Sputtering a paint layer on the metal layer or non-metal layer to make the surface metallic lustrous and corrosion-resistant. The present invention further provides a surface structure of a magnesium alloy object.

Abstract: A photosensitive device is provided. The photosensitive device includes a sensing stack, an anti-reflective layer, an optical filter, a first electrode, and a second electrode. The sensing stack includes a first semiconductor layer, an intrinsic semiconductor layer disposed on the first semiconductor layer, and a second semiconductor layer disposed on the intrinsic semiconductor layer. The anti-reflective layer is disposed on a side of the sensing stack. The optical filter is disposed on the anti-reflective layer and blocks input light with an incident angle greater than 50 degrees. The first electrode and the second electrode are disposed on the sensing stack.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.

Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.

Abstract: In various examples, one or more text-to-speech machine learning models may be customized or adapted to accommodate new or additional speakers or speaker voices without requiring a full re-training of the models. For example, a base model may be trained on a set of one or more speakers and, after training or deployment, the model may be adapted to support one or more other speakers. To do this, one or more additional layers (e.g., adapter layers) may be added to the model, and the model may be re-trained or updated—e.g., by freezing parameters of the base model while updating parameters of the adapter layers—to generate an adapted model that can support the one or more original speakers of the base model in addition to the one or more additional speakers corresponding to the adapter layers.