Patents by Inventor CHENG PING

CHENG PING has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11919126
    Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng
  • Publication number: 20240039065
    Abstract: A battery module including a battery frame, a plurality of locking structures, a plurality of battery units, and a plurality of lug structures is provided. The battery frame is provided with an accommodating space. The battery frame includes a first portion extending along a first direction and a second portion extending along a second direction. The first direction is different from the second direction. The locking structures are disposed on the battery frame. At least one of the plurality of locking structures is disposed on an outer side of each of the first portion and the second portion. The battery units are disposed in the accommodating space. Each of the lug structures includes a lock portion configured to detachably engage with one of the locking structures.
    Type: Application
    Filed: February 21, 2023
    Publication date: February 1, 2024
    Inventors: Po-Ching HUANG, Hui Wen CHIU, Chun-Wen WANG, Pao-Long FAN, Cheng-Ping TSAI, Ting-Jui HU, Chao Chan TAN, Ming-Hung YAO, Chien-Chih SHIH, Jui-Liang HO, Ching-Kai YU, Chih-Wei LAI
  • Patent number: 11850702
    Abstract: In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Ping Chen, Ren-Dou Lee, Sheng-Tai Peng, Tsung-Lung Lai, Tzi-Yi Shieh, Chien-Wei Chang
  • Publication number: 20230234184
    Abstract: A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.
    Type: Application
    Filed: April 3, 2023
    Publication date: July 27, 2023
    Inventors: Cheng-Ping CHEN, Shih-Chung CHEN, Sheng-Tai PENG, Hung-Lin CHEN
  • Publication number: 20230221172
    Abstract: A transmission device is provided and includes a transmission structure and a circuit board, where the circuit board is disposed on an input end of the transmission structure, and a sensing element and a data processing element communicatively connected to the sensing element are integrated on the circuit board to perform signal measurement operations.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 13, 2023
    Inventors: Li-Te HUANG, Cheng-Ping YANG, Chih-Hsuang HUANG
  • Publication number: 20230174772
    Abstract: A component (A1) thereof includes an epoxy resin having at least one of a naphthalene skeleton or a biphenyl skeleton. A component (A2) thereof includes a phenolic resin having at least one of the naphthalene skeleton or the biphenyl skeleton. A component (B) thereof includes a high molecular weight substance having structures expressed by at least formulae (b2) and (b3) out of formulae (b1), (b2), and (b3) and having a weight average molecular weight equal to or greater than 200,000 and equal to or less than 850,000. A component (C1) thereof includes a first filler obtained by subjecting a first inorganic filler to surface treatment using a first silane coupling agent expressed by formula (c1). A component (C2) thereof includes a second filler obtained by subjecting a second inorganic filler to surface treatment using a second silane coupling agent expressed by formula (c2).
    Type: Application
    Filed: March 25, 2021
    Publication date: June 8, 2023
    Applicant: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Cheng Ping LIN, Toshiyuki MAKITA, Naohito FUKUYA
  • Publication number: 20230160088
    Abstract: A method for coating a substrate includes the steps of: forming a conductive coating layer on a surface of a substrate so as to form a semi-product; submerging a conductive sheet and the semi-product into an electrophoresis medium that includes charged colloid particles; and applying a voltage on the conductive sheet or the semi-product to form an electric field among the conductive sheet, the semi-product, and the electrophoresis medium, so that the colloid particles move along the electric field toward the semi-product and an electrophoretic covering layer formed by the charged colloid particles is thus deposited on the electrophoretic covering layer.
    Type: Application
    Filed: May 17, 2022
    Publication date: May 25, 2023
    Inventors: Shun-Jie YANG, Hsiang-Jui WANG, Cheng-Ping HSIAO
  • Publication number: 20230133331
    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.
    Type: Application
    Filed: January 3, 2023
    Publication date: May 4, 2023
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng, Rong-Long Hung
  • Patent number: 11618126
    Abstract: A polishing pad conditioning apparatus includes a base, a fiber, and a polymer protruding from a surface of the base and encompassing the fiber.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: April 4, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng, Hung-Lin Chen
  • Publication number: 20230098830
    Abstract: Package structures and methods for forming the same are provided. The method includes forming a passivation layer having an opening and forming a first seed layer in the opening. The method further includes filling the opening with a conductive layer over the first seed layer and bonding an integrated circuit die to the conductive layer over a first side of the passivation layer. The method further includes removing a portion of the first seed layer to expose a top surface of the conductive layer and to partially expose a first sidewall of the passivation layer from a second side of the passivation layer and forming a second seed layer over the top surface of the conductive layer and over the first sidewall of the passivation layer.
    Type: Application
    Filed: December 8, 2022
    Publication date: March 30, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Da TSAI, Cheng-Ping LIN, Wei-Hung LIN, Chih-Wei LIN, Ming-Da CHENG, Ching-Hua HSIEH, Chung-Shi LIU
  • Patent number: 11588377
    Abstract: A fan motor suitable for use in an electronic device, such as a consumer electronic device, is disclosed. The fan motor includes a stator and a rotor. In order to minimize a varying torque applied to the rotor, the stator includes modifications. For example, the stator includes stator teeth, each with an arc defined by a radius of curvature that varies. The radius (from a reference point to the arc) can vary in accordance with a sinusoidal curve. Furthermore, the corners of each stator tooth may be rounded. The rounded corners of the stator teeth may include a uniform (or constant, non-varying) radius of curvature. These enhancement are designed to provide a more uniform torque by the stator to the rotor. As a result, the rotation of the rotor is subject to smaller fluctuations, and the fan motor undergoes less vibration and generates less acoustical noise.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: February 21, 2023
    Assignee: APPLE INC.
    Inventors: Jifang Tian, Cheng Ping Tan, Enoch Mylabathula
  • Publication number: 20230051164
    Abstract: A fitting for an upper brush in a double brush scrubbing chamber of a wafer cleaning system is disclosed. The fitting includes a base plate, a flanged pipe, and a threaded connector. The base plate includes a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate. The flanged pipe is inserted into the base plate such that the flange at the top end of a hollow tube rests on the stop surface and the hollow tube passes through the channel of the base plate. The threaded connector has a passage therethrough, and engages the threaded hole of the base plate to fix the flanged pipe in place. This structure is able to provide fluid while minimizing particle generation.
    Type: Application
    Filed: February 15, 2022
    Publication date: February 16, 2023
    Inventors: Cheng-Ping Chen, Ping-Shen Chou, Tsung-Lung Lai, Ching-Wen Cheng, Chun Yan Chen
  • Patent number: 11571782
    Abstract: The present disclosure provides a chemical mechanical polishing system having a unitary platen. The platen includes one or more recesses within the platen to house various components for the polishing/planarization process. In one embodiment, the platen includes a first recess and a second recess. The first recess is located under the second recess. An end point detector is placed in the first recess and a detector cover may be placed in the second recess. A sealing mean is provided in a space between the end point detector and the detector cover to prevent any external or foreign materials from coming in contact with the end point detector. A fastener used for fastening the detector cover to the platen also provides addition protection to prevent foreign materials from coming in contact with components received in the recesses.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: February 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tsung-Lung Lai, Cheng-Ping Chen, Shih-Chung Chen, Sheng-Tai Peng, Rong-Long Hung
  • Patent number: 11536349
    Abstract: A transmission mechanism includes first and second transmission, first and second shafts, a clutch, and a one-way bearing. In the first gear, power is output through the first driving transmission and the one-way bearing; and in the second gear, the power is output through the clutch, the second driving transmission and the one-way bearing.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: December 27, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Cheng-Ping Yang, Meng-Ru Wu, Ming-Hsien Yang, Peng-Yu Chen, Jui-Tang Tseng
  • Patent number: 11532564
    Abstract: Package structures and methods for forming the same are provided. The package structure includes an integrated circuit die and a package layer surrounding the integrated circuit die. The package structure also includes a redistribution structure over the package layer and electrically connected to the integrated circuit die. The redistribution structure includes a passivation layer and a conductive layer formed in the passivation layer. The integrated circuit die further includes a connector formed over the conductive layer and covered a top surface of the passivation layer. In addition, a bottom surface of the connector and a top surface of the connector are both wider than a neck portion of the connector.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: December 20, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Da Tsai, Cheng-Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
  • Publication number: 20220371287
    Abstract: A method for manufacturing a composite structure having first and second structural members includes the steps of: (A) placing a plate in a forming mold having a first molding member, and a second molding member with an injection hole; (B) moving the first molding member toward the second molding member to stamp and deform the plate; (C) injecting a molten substrate onto the plate via the injection hole to stamp and deform again the plate so as to form the first structural member; (D) removing an assembly of the first structural member and a solidified substrate from the first molding member; and (E) removing an excess part of the solidified substrate to form the second structural member.
    Type: Application
    Filed: August 12, 2021
    Publication date: November 24, 2022
    Inventors: Cheng-Ping HSIAO, Yi-Feng HUANG
  • Publication number: 20220273799
    Abstract: The disclosure provides a drug delivery composition, method of forming the same and method for treating inner ear disorders. The drug delivery composition includes a temperature sensitive hydrogel, a plurality of microbubbles and a drug. Every microbubble has a protein shell and an inert gas core. These microbubbles are dispersed in the temperature sensitive hydrogel. The drug is dispersed in the temperature sensitive hydrogel. Moreover, the drug delivery composition has a viscosity that can induce cavitation effect.
    Type: Application
    Filed: July 19, 2021
    Publication date: September 1, 2022
    Inventors: Ai-Ho LIAO, Chih-Hung WANG, Cheng-Ping SHIH
  • Publication number: 20220215288
    Abstract: A training system and a training method of reinforcement learning are disclosed. The training system includes a first computer device and a second computer device, and the computing power of the second computer device is better than that of the first computer device. The first computer device stores a reinforcement learning model; receives input data; and feeds the input data into the reinforcement learning model to generate a first output result. The second computer device stores a supervised learning model; receives the input data from the first computer device; feeds the input data into the supervised learning model to generate a second output result; and transmits the second output result to the first computer device. The first computer device further generates reward data according to the first output result and the second output result, and trains the reinforcement learning model according to the reward data.
    Type: Application
    Filed: January 25, 2021
    Publication date: July 7, 2022
    Inventors: Yen-I OUYANG, Chin-Feng LAI, Chieh-Lin CHUANG, Chi-Hsuan LEE, Cheng-Ping TSENG, Wei-Zhong HSU
  • Publication number: 20220196586
    Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.
    Type: Application
    Filed: December 23, 2020
    Publication date: June 23, 2022
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Cheng-Ping CHANG, Chien-Hui LI, Chien-Hsun WU, Tai-I YANG, Yung-Hsiang CHEN
  • Patent number: 11366182
    Abstract: A magnetoresistive device includes a magnetoresistor disposed over a substrate, a stress release structure covering a side surface of the magnetoresistor, an electrical connection structure disposed over the magnetoresistor, and a passivation layer disposed over the electrical connection structure and the stress release structure.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: June 21, 2022
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chien-Hsun Wu, Cheng-Ping Chang, Chien-Hui Li, Tai-I Yang, Yung-Hsiang Chen