Abstract: In some embodiments, the present disclosure relates to a chemical mechanical planarization (CMP) tool. The CMP tool includes a carrier and a malleable membrane coupled to the carrier and having a lower surface facing away from the carrier. The lower surface of the malleable membrane includes a first malleable material within a central region of the lower surface and a second malleable material within a peripheral region of the lower surface, which surrounds the central region. The first malleable material provides the central region of the lower surface with a first stiffness and the second malleable material provides the peripheral region of the lower surface with a second stiffness that is different than the first stiffness.

Abstract: A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.

Abstract: A process for chemical mechanical polishing a substrate containing tungsten and titanium is provided comprising: providing the substrate; providing a polishing composition, containing, as initial components: water; an oxidizing agent; a chitosan; a dicarboxylic acid, wherein the dicarboxylic acid is selected from the group consisting of propanedioic acid and 2-hydroxypropanedioic acid; a source of iron ions; a colloidal silica abrasive with a positive surface charge; and, optionally pH adjusting agent; providing a chemical mechanical polishing pad, having a polishing surface; creating dynamic contact at an interface between the polishing pad and the substrate; and dispensing the polishing composition onto the polishing surface at or near the interface between the polishing pad and the substrate; wherein some of the tungsten (W) and some of the titanium (Ti) is polished away from the substrate with a removal selectivity for the tungsten (W) relative to the titanium (Ti).

Abstract: A composite structure includes a passivated substrate, a sealing layer, a conductive layer, and a coating layer. The passivated substrate includes a substrate body made of a metallic material that is magnesium or magnesium alloy, and a porous passivation layer which is disposed on the substrate body, and which is made of an oxide of the metallic material. The sealing layer is disposed on the porous passivation layer, and is made of a sealing material. The conductive layer is disposed on the sealing layer, and is made of an electrically conductive material. The coating layer covers the conductive layer, and includes an electrophoretic material and/or a metal. A method of making the composite structure is also disclosed.

Abstract: In some embodiments, the present disclosure, in some embodiments, relates to a method of forming a CMP membrane. The method is performed by providing a malleable material within a cavity within a membrane mold. The cavity has a central region and a peripheral region surrounding the central region. The malleable material within the cavity is cured to form a membrane. Curing the malleable material is performed by heating the malleable material within the central region of the membrane mold to a first temperature and heating the malleable material within the peripheral region of the membrane mold to a second temperature that is greater than the first temperature.

Abstract: A liquid crystal display device includes a display module, a functional layer, and a heating module. The display module has a display surface. The functional layer is disposed at one side of the display surface of the display module. The heating module is disposed corresponding to the display module. The liquid crystal display device can solve the phenomenon of liquid crystal hysteresis caused by low-temperature environments.

Abstract: The present invention provides a surface treatment method for magnesium alloy object, the method comprising: providing a magnesium alloy object; preprocessing the magnesium alloy object; performing micro-arc oxidation (MAO) treatment on the magnesium alloy object to form a micro-arc oxidation layer; Sputtering at least one metal layer or at least one non-metal layer on a surface of the micro-arc oxidation layer, the metal layer or non-metal layer which is sputtered on the micro-arc oxidation layer has different angles by using surface roughness of the micro-arc oxidation layer when a light source is projected on the metal layer or non-metal layer; and Sputtering a paint layer on the metal layer or non-metal layer to make the surface metallic lustrous and corrosion-resistant. The present invention further provides a surface structure of a magnesium alloy object.

Abstract: An electronic device with a fan assembly is disclosed. The fan assembly includes an impeller and an insert separated from the impeller by a gap. The fan assembly increases airflow by rotationally driving the impeller. For a sufficient rotational speed of the impeller, the airflow reaches a level that provides a force that displaces the insert. The displacement may include movement and/or compression of the insert. As a result of the displacement, the gap between the impeller and the insert increases. The increased gap reduces the pressure and associated noise that is otherwise caused by the airflow. When the rotational speed of the impeller reduces or ceases, the insert returns to its initial position. In this manner, the fan assembly includes a self-adjusting gap that changes based on the airflow.

Abstract: A dual-shaft clutch varying speed device includes a drive unit, an input shaft, an output shaft, a housing, at least an odd-numbered clutch unit and at least an even-numbered clutch unit. The input shaft having an input gear is coupled with the drive unit. The output shaft, having an end thereof penetrate through the input shaft and the drive unit, has at least an odd-numbered output gear and at least an even-numbered output gear. The housing has a housing gear. The at least one odd-numbered clutch unit being furnished at the inner part of the housing has an odd-numbered clutch shaft and an odd-numbered clutch gear which is meshed with the odd-numbered output gear. The at least one odd-numbered clutch unit has an even-numbered clutch shaft and an even-numbered clutch gear which is meshed with the even-numbered output gear.

Abstract: The present invention provides a bi-metal assembling method. The method provides a machine-shaped aluminum piece and places the machine-shaped aluminum piece into a die-cast mold. The machine-shaped aluminum piece is encapsulated with a magnesium metal liquid and die cast is performed. The assembled bi-metal structure is coated for protection and CNC high-gross treatment and anodizing treatment is performed in the machine-shaped aluminum piece. The magnesium alloy piece is hooked with the machine-shaped aluminum piece for assembling. The bi-metal structure has smooth surface to reduce the time for polishing, surface shrinkage and generation of blowholes. The present invention also provides a bi-metal assembled structure.

Abstract: A high-gross manufacturing method for magnesium alloy object includes providing a magnesium alloy object; performing micro-arc oxidation or conversion coating treatment on the magnesium alloy object to form oxide film on a surface of the magnesium alloy object; spraying a paint layer on MAO-treated or conversion coating-treated surface of the magnesium alloy object to protect the magnesium alloy object; performing CNC high gross cutting to cut away part of paint layer and part of the oxide film to expose metallic main body; using specific conversion coating solution to passivate the magnesium alloy object; and spraying UV curable paint on the surface of the magnesium alloy object to provide corrosion protection. The present invention also provides a high-gross magnesium alloy structure.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: A fan motor suitable for use in an electronic device, such as a consumer electronic device, is disclosed. The fan motor includes a stator and a rotor. In order to minimize a varying torque applied to the rotor, the stator includes modifications. For example, the stator includes stator teeth, each with an arc defined by a radius of curvature that varies. The radius (from a reference point to the arc) can vary in accordance with a sinusoidal curve. Furthermore, the corners of each stator tooth may be rounded. The rounded corners of the stator teeth may include a uniform (or constant, non-varying) radius of curvature. These enhancement are designed to provide a more uniform torque by the stator to the rotor. As a result, the rotation of the rotor is subject to smaller fluctuations, and the fan motor undergoes less vibration and generates less acoustical noise.

Abstract: A transmission interface circuit includes a power supply port, a first power path, first data transmission path, second power path and controller. The first power port is coupled to the storage device to provide the storage device with power. The first data transmission path is coupled between the storage device and the electronic device to perform data transmission between the storage device and the electronic device. The second power port is coupled to the electronic device to provide the electronic device with power. The controller respectively control enables or disables the first power path, the second power path and the first data transmission path according to the information transmitted from the electronic device.

Abstract: A magnetoresistive device includes a magnetoresistor disposed over a substrate, a stress release structure covering a side surface of the magnetoresistor, an electrical connection structure disposed over the magnetoresistor, and a passivation layer disposed over the electrical connection structure and the stress release structure.

Abstract: An ultrasonic linear actuation device includes a mover and a plurality of stator sets. The mover includes at least one mover rack. The plurality of stator sets is located in correspondence with the mover. Each of the plurality of stator sets includes an actuating component and a plurality of stator racks. The actuating component is used for stimulating corresponding one of the plurality of stator sets to generate standing-wave oscillations in an oscillation direction, such that the plurality of stator racks of each of the plurality of stator sets can engage the at least one mover rack of the mover to allow the stator racks to mesh the corresponding mover rack and thus to displace the mover in a moving direction.

Abstract: A transmission mechanism includes first and second transmission, first and second shafts, a clutch, and a one-way bearing. In the first gear, power is output through the first driving transmission and the one-way bearing; and in the second gear, the power is output through the clutch, the second driving transmission and the one-way bearing.

Abstract: In an embodiment, a chemical mechanical planarization (CMP) system includes: a monolithic platen within a platen housing, wherein the monolithic platen is formed of a single piece of material, wherein the monolithic platen includes: a first portion within a first opening, and a second portion within a second opening, wherein the first portion has a different diameter than the second portion; and a polishing fluid delivery module above the monolithic platen, wherein the polishing fluid delivery module is configured to deliver slurry to the monolithic platen during performance of CMP.

Abstract: A method of delivering drugs to inner ear facilitated by microbubbles, including mixing a microbubble composition and a drug into a microbubble-drug mixture, applying the microbubble-drug mixture to middle ear cavity, and placing a mechanical oscillation wave source to ear canal or cranium located behind the ear. The mechanical waves generated by the mechanical oscillation wave source penetrate through tympanum or cranium, and induce the cavitation on the microbubbles in the middle ear cavity. Thus, the permeability of the round window membrane is increased, so that the drug penetrates into inner through the round window membrane. Therefore, the mechanical oscillation wave source induces the cavitation on the microbubbles in a non-invasive way.

Abstract: A white light emitting device includes a blue LED chip having a dominant emission wavelength of about 440-465 nm, and a phosphor layer configured to be excited by the dominant emission wavelength of the blue LED chip. The phosphor layer includes a first phosphor having a peak emission wavelength of about 480-519 nm, a second phosphor having a peak emission wavelength of about 520-560 nm, and a third phosphor having a peak emission wavelength of about 620-670 nm. The first phosphor and the second phosphor both have a garnet structure as represented by A3B5O12:Ce, A is selected from the group consisting of Y, Lu, and a combination of thereof, and B is selected from the group consisting of Al, Ga, and a combination of thereof.