Abstract: A FinFET structure includes a substrate, a plurality of stripes, a metal gate and an oxide material. The stripes are on the substrate. The metal gate is on a sidewall and a top surface of one of the stripes. The oxide material is between the metal gate and the stripes. An average roughness of an interface between the metal gate and the oxide material is in a range of from about 0.1 nm to about 0.2 nm.

Abstract: Provided are methods of preparing a biocompatible textured surface on a thermoplastic material comprising treating the material with a plasma and subsequently shrinking the substrate to induce formation of textures. The textured surfaces are useful in one aspect, to align cells such as stem cells.

Abstract: A button-type connector module and an electronic device using the button-type connector module are provided. The electronic device is adapted to the pluggable hot plug component. The electronic device includes a main body and a button-type connector module. The main body includes a motherboard. The button-type connector module is disposed in the main body. The button-type connector module includes a push button unit, a connector and a circuit board. The connector includes an accommodation recess. The hot plug component is plugged into or removed from the accommodation recess, when the connector moves relative to the main body to expose the accommodation recess. The circuit board is disposed between the push button unit and the connector. The push button unit and the connector are electrically connected to the motherboard of the main body via the circuit board.

Abstract: A semiconductor structure and a method for forming the same are provided. The method includes providing a substrate, forming a fin structure extruding from the substrate, forming shallow trench isolations over the substrate, and forming an oxide material over the fin structure. The method further includes forming a carbon-doped amorphous silicon layer or a carbon-doped poly silicon layer over the oxide material, wherein the forming a carbon-doped amorphous silicon layer or a carbon-doped poly silicon layer includes doping carbon in a range of from about 5E19/cm3 to about 1E22/cm3.

Abstract: A thin cooling fan (1) includes a fan shell (10), a motor (20), a plurality of blades (30), and a PCB (40). The fan shell (10) comprises a base plate (11) and a shell cover (12) which cover to each other to form an inner space (100). The base plate (11) has a first surface (111) facing toward the inner space (100) and a second surface (112) having a receiving space (101) and opposite to the first surface (111). The motor (20) is combined in the inner space (100). The blades (30) are disposed in the inner space (100) and rotated by the motor (20). The PCB (40) is disposed in the receiving space (101) and flush with the second surface (112). Thus, the whole thickness of the cooling fan (1) is reduced and the flow channel design in the inner space (100) is not affected.

Abstract: A device for enhancing electromagnetic susceptibility comprises a first bridge. The first bridge is near to a first trace of a differential pair routing and electrically connects an RF grounding with an analog grounding. The RF grounding and the analog grounding are separated. The differential pair routing transmits signals between an RF circuit and an analog circuit. The first trace of the differential pair routing is closer to an antenna coupled to the RF grounding than a second trace of the differential pair routing. The RF circuit is coupled to the RF grounding, and the analog circuit is coupled to the analog grounding.

Abstract: A wireless security device includes a nonconductive housing, a mother circuit board, a wireless expansion card, and a metal reflector. The mother circuit board and the wireless expansion card are disposed in the nonconductive housing. The mother circuit board includes a processor. The wireless expansion card includes a dielectric substrate, a ground plane, an inverted-F antenna, and an RF (radio frequency) module. The metal reflector is positioned between the mother circuit board and the wireless expansion card, and is close to the inverted-F antenna. The metal reflector is configured to reduce EMI (Electromagnetic Interference) from the mother circuit board so as to maintain performance of the inverted-F antenna.

Abstract: The present invention relates to an artificial leather and method for making the same. The artificial leather includes a polyester fiber substrate and a thermoplastic polyester elastomer (TPEE) resin layer. The polyester fiber substrate has a plurality of polyester fibers. The thermoplastic polyester elastomer (TPEE) resin layer is disposed adjacent to the polyester fiber substrate, and the material thereof is thermoplastic polyester elastomer (TPEE). Whereby, the material of the all layers of the artificial leather is polyester types, therefore, the whole artificial leather can be melted to recycle and reuse when disposing the artificial leather, so as to achieve the effect of environmental protection.

Abstract: A wireless security device includes a nonconductive housing, a mother circuit board, a wireless expansion card, and a metal reflector. The mother circuit board and the wireless expansion card are disposed in the nonconductive housing. The mother circuit board includes a processor. The wireless expansion card includes a dielectric substrate, a ground plane, an inverted-F antenna, and an RF (radio frequency) module. The metal reflector is positioned between the mother circuit board and the wireless expansion card, and is close to the inverted-F antenna. The metal reflector is configured to reduce EMI (Electromagnetic Interference) from the mother circuit board so as to maintain performance of the inverted-F antenna.

Abstract: A device for enhancing electromagnetic susceptibility comprises a first bridge. The first bridge is near to a first trace of a differential pair routing and electrically connects an RF grounding with an analog grounding. The RF grounding and the analog grounding are separated. The differential pair routing transmits signals between an RF circuit and an analog circuit. The first trace of the differential pair routing is closer to an antenna coupled to the RF grounding than a second trace of the differential pair routing. The RF circuit is coupled to the RF grounding, and the analog circuit is coupled to the analog grounding.

Abstract: A method of automatic task execution is adapted to be performed by an electronic apparatus that includes an image-capturing module and a processing module. The method includes the steps of: a) recording in the processing module a relationship between a visible physical attribute of an object and a corresponding task to be executed by the processing module; b) configuring the electronic apparatus for capturing an image containing a target using the image-capturing module; c) configuring the processing module to determine if the visible physical attribute of the object is found in the image captured by the image-capturing module; and d) when the visible physical attribute of the object is found in the image, configuring the processing module to execute the corresponding task automatically.

Abstract: Provided are methods of preparing a biocompatible textured surface on a thermoplastic material comprising treating the material with a plasma and subsequently shrinking the substrate to induce formation of textures. The textured surfaces are useful in one aspect, to align cells such as stem cells.

Abstract: An electronic apparatus with rotation function includes a loading side, a stationary portion and a rotation portion. The stationary portion is disposed at the loading side. The rotation portion is configured for connecting with a functional apparatus. The rotation portion is connected with the stationary portion in an unfixed way. The functional apparatus rotates relative to the stationary portion by the rotation portion.

Abstract: A reworking method for integrated circuit devices includes the following: providing a substrate having a first base layer and a first dielectric layer formed thereon, performing a first dry etching process to remove the first dielectric layer, performing a CMP process to remove the first base layer, and sequentially reforming a second base layer and a second dielectric layer on the substrate. When certain layers on the IC device have hailed an inspection or when quality defects are found, the defective layer is removed according to the provided reworking method.

Abstract: A separative extended gate field effect transistor based uric acid sensing device is provided, including: a substrate; a conductive layer including a silver paste layer on the substrate and a graphite-based paste layer on the silver paste layer; a conductive wire extended from the conductive layer; a titanium dioxide layer on the conductive layer; and a uric acid enzyme sensing film on the titanium dioxide layer.

Abstract: The invention provides a method for forming an extended gate field effect transistor (EGFET) based sensor, including: (a) providing a substrate; (b) forming a sensing film including titanium dioxide, ruthenium doped titanium dioxide or ruthenium oxide on the substrate; and (c) forming a conductive wire extended from the sensing film for external contact.

Abstract: The invention provides a multi-electrode measuring system including a front end device which is a sensing device including a multi-electrode sensing device having a plurality of electrodes; a multi-channel fixture coupled to the multi-electrode sensing device; and a reference electrode. A back-end device as a virtual instrumentation is an electronic device including a read out circuit device coupled to the multi-channel fixture and the reference electrode for receiving each original signal from each electrode of the multi-electrode sensing device and the reference electrode determining a sample solution; a data acquisition device coupled to the read out circuit device for digitizing each original signal to form a digital signal and for array sampling; and a signal processing device coupled to the data acquisition device for processing each signal.

Abstract: A method of automatic task execution is adapted to be performed by an electronic apparatus that includes an image-capturing module and a processing module. The method includes the steps of: a) recording in the processing module a relationship between a visible physical attribute of an object and a corresponding task to be executed by the processing module; b) configuring the electronic apparatus for capturing an image containing a target using the image-capturing module; c) configuring the processing module to determine if the visible physical attribute of the object is found in the image captured by the image-capturing module; and d) when the visible physical attribute of the object is found in the image, configuring the processing module to execute the corresponding task automatically.

Abstract: The invention provides a multi-electrode measuring system including a front end device which is a sensing device including a multi-electrode sensing device having a plurality of electrodes; a multi-channel fixture coupled to the multi-electrode sensing device; and a reference electrode. A back-end device as a virtual instrumentation is an electronic device including a read out circuit device coupled to the multi-channel fixture and the reference electrode for receiving each original signal from each electrode of the multi-electrode sensing device and the reference electrode determining a sample solution; a data acquisition device coupled to the read out circuit device for digitizing each original signal to form a digital signal and for array sampling; and a signal processing device coupled to the data acquisition device for processing each signal.

Abstract: A computer comprises a mother board. A CPU, a chipset and a flash memory storage device are configured on the mother board. Wherein, the chipset is coupled to the CPU and coupled to the flash memory storage device through a USB bus, so that the CPU is able to access data stored on the flash memory storage device through the chipset.