Abstract: An integrated vapor chamber includes a metallic top cover, a metallic bottom cover, a working space, capillary structures and a working fluid in the working space. The top cover includes oppositely an outer heat-dissipating surface and an inner condensation surface surrounded by a top frame. The inner condensation surface has parallel top grooves and protrusive supporting structures. The bottom cover includes oppositely an outer heat-absorption surface having recessed spaces for accommodating electronic elements and an inner evaporation surface surrounded by a bottom frame. The inner evaporation surface has parallel bottom grooves. The working space is an airtight space formed by engaging the top frame and the bottom frame with the inner condensation surface to face the inner evaporation surface, the top grooves to overlap individually the bottom grooves, the supporting structures to contact individually at the inner evaporation surface among the bottom grooves.

Abstract: A process of forming a back side deep trench isolation structure for an image sensing device includes etching first trenches in the back side of a semiconductor substrate, lining the first trenches with dielectric, depositing passivation layers over and within the first trenches, and etching second trenches through the passivation layers into the first trenches, and filling the second trenches to form a substrate-embedded metal grid. Optionally, the bottoms of the first trenches are filled by depositing and etching a lower fill material prior to depositing the passivation layers. The method prevents the passivation layers from pinching off in a way that causes voids within the first trenches. The result is better optical performance such as increased quantum efficiency and reduced crosstalk.

Abstract: An encrypted hard disk device is provided, including a near-field communication (NFC) sensing module, a processor, a storage unit, and a power switch. The NFC sensing module is configured to read a user identification (UID) of at least one sensor element. The processor is electrically connected to the NFC sensing module and the storage unit. The processor receives the UID and generates a control signal when the UID is approved. The power switch is electrically connected to the processor and the storage unit and maintains a conducting state according to the control signal and supplies power to the storage unit for accessing the storage unit.

Abstract: A method for performing access management in a memory device, the associated memory device and the controller thereof, and the associated electronic device are provided. The method may include: receiving a host command and a logical address from a host device; performing at least one checking operation to obtain at least one checking result, for determining whether to load a logical-to-physical (L2P) table from the NV memory to a random access memory (RAM) of the memory device, wherein the L2P table includes address mapping information for accessing the target data, and performing the at least one checking operation to obtain at least one checking result includes checking whether a first L2P-table index pointing toward the L2P table and a second L2P-table index sent from the host device are equivalent to each other; and reading the target data from the NV memory, and sending the target data to the host device.

Abstract: A stand for a computer monitor includes two auxiliary devices at two sides respectively. One auxiliary device is configured to extend out from one side of the stand and unfold to serve as a cup holder. The other auxiliary device is configured to extend out from the other side of the stand and unfold to serve as a holder for a cellular phone and/or a tablet computer.

Abstract: The present disclosure provides a 3D memory device such as a 3D AND flash memory and a method of forming a seal structure. The 3D memory device includes a chip region including a chip array and a seal region including a seal structure. The seal structure includes a ring-shaped stack structure disposed on a substrate and surrounding the chip array and a dummy channel pillar array penetrating through the ring-shaped stack structure and including a first dummy channel pillar group and a second dummy channel pillar group. The first dummy channel pillar group includes first dummy pillars that are arranged in a first direction and a second direction crossing the first direction to surround the chip array. The second dummy channel pillar group includes second dummy pillars that are arranged in the first direction and the second direction to surround the chip array. The first and the second dummy channel pillars are staggered with each other in the first and second directions.

Abstract: The invention relates to a logic control device of a serial peripheral interface, a master-slave system and a master-slave switchover method therefor. The logic control device is connected between N masters and M slaves, and define master-slave connection relationships between each of the masters and each of the slaves. Each of the master-slave connection relationship is that each of the masters and each of the slaves transmit information one-to-one at the same time, and includes connecting the logic control device between the masters and the slaves to form the master-slave system as well as the master-slave switchover method therefor.

Abstract: The present invention discloses an electronic device. The electronic device includes a connector and a sensing control unit. The connector includes a metal mask and at least one terminal. The sensing control unit is electrically connected to the metal mask and the at least one terminal. The sensing control unit is suitable for sensing whether the connector is connected to an external device, and includes a proximity sensing circuit connected to the metal mask. When the connector is connected to the external device, the sensing control unit enables the metal mask to be grounded. When the connector is not connected to the external device, the sensing control unit enables the metal mask to be floated, and the floated metal mask is suitable as a sensing electrode of the proximity sensing circuit.

Abstract: An image sensor includes a semiconductor substrate, a first isolation structure, a visible light detection structure, and an infrared light detection structure. The semiconductor substrate has a first surface and a second surface opposite to the first surface in a vertical direction. The first isolation structure is disposed in the semiconductor substrate for defining pixel regions in the semiconductor substrate. The visible light detection structure and the infrared light detection structure are disposed within the same pixel region, and a first portion of the visible light detection structure is disposed between the second surface of the semiconductor substrate and the infrared light detection structure in the vertical direction.

Abstract: A method of making an interconnect for an electrochemical cell stack includes providing the interconnect, and creep flattening the interconnect prior to placing the interconnect into the electrochemical cell stack.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: An IC device includes first and second cells adjacent each other and over a substrate. The first cell includes a first IO pattern along a first track among a plurality of tracks in a first metal layer, the plurality of tracks elongated along a first axis and spaced from each other along a second axis. The second cell includes a plurality of conductive patterns along corresponding different tracks among the plurality of tracks in the first metal layer, each of the plurality of conductive patterns being an IO pattern of the second cell or a floating conductive pattern. The first metal layer further includes a first connecting pattern along the first track and connects the first IO pattern and a second IO pattern of the second cell. The second IO pattern is one of the plurality of conductive patterns of the second cell and is along the first track.

Abstract: An electronic device is provided. The electronic device includes a substrate, a data line and a gate line that are disposed on the substrate. The data line extends in a first direction. The electronic device also includes a thin film transistor. The thin film transistor is disposed on the substrate and includes a semiconductor structure. The semiconductor structure includes a channel region, a source region, and a drain region. The gate line overlaps the channel region. The source region is electrically connected to the data line. The source region and the drain region are located on opposite sides of the gate line. The source region includes a first portion extending in a second direction, and an acute angle is formed between the first direction and the second direction.

Abstract: A composition includes an active composition. The active composition includes a niobium-titanium oxide and a silicon active material, or includes a doped niobium-titanium oxide and the silicon active material. The niobium-titanium oxide includes niobium element, titanium element and oxygen element. The doped niobium-titanium oxide includes niobium element, titanium element and oxygen element.

Abstract: A measurement assistance system and method are provided. The measurement assistance system includes: a measurement platform, having an operation area configured for a to-be-measured object and a measurement tool to be placed; a camera, arranged on the measurement platform and configured to obtain a measurement image; and a server module, electrically connected to the camera and configured to execute a measurement tool identification program, a measurement part identification program, and a measurement posture identification program according to the measurement image, and determine whether a measurement tool appearance image, a measurement part image, and a measurement posture image are correct. The server module has a processing unit. When the measurement tool appearance image, the measurement part image, and the measurement posture image are all correct, a measurement result is generated according to measurement data.

Abstract: An over-current protection device includes a heat-sensitive layer and an electrode layer. The electrode layer includes a top metal layer and a bottom metal layer, and the heat-sensitive layer attached therebetween. The heat-sensitive layer exhibits a positive temperature coefficient (PTC) characteristic and includes a polymer matrix and a conductive filler. The polymer matrix includes a polyolefin-based homopolymer and a polyolefin-based copolymer. The polyolefin-based homopolymer has a first coefficient of thermal expansion (CTE), and the polyolefin-based copolymer has a second CTE lower than the first CTE. The polyolefin-based homopolymer and the polyolefin-based copolymer together form an interpenetrating polymer network (IPN).

Abstract: A laser diode includes an original substrate having a substrate coefficient of thermal expansion, an epitaxy structure formed on the original substrate, and a composite multi-layer metal board disposed below the original substrate and at least including a first metal layer and a second metal layer. The first metal layer and the second metal layer are stacked, a material of the first metal layer is different from a material of the second metal layer, and the composite multi-layer metal board has a modified coefficient of thermal expansion. The original substrate has an initial thickness as the epitaxy structure is grown thereon, the original substrate is thinned to a combining thickness for attaching the composite multi-layer metal board, and the modified coefficient of thermal expansion of the composite multi-layer metal board is proximate to the substrate coefficient of thermal expansion.

Abstract: An intelligent detection system includes an image module, a target detection module, and a physical model processing module. The target detection module runs a scanning mode on the target object and controls the image module to capture target images of the target object with different physical properties under the scanning mode. The scanning mode is allowed to be based on luminescence or thermal radiation emitted by variation of time, voltage, current, or illumination. The physical model processing module receives the target images and carries out an image stacking process with each target image based on different physical properties, generating a detection result image through physical formula of electronic circuit in cooperation with a chromaticity coordinate diagram.

Abstract: The present invention discloses a multitype-adsorptive-group polycarboxylic acid water-reducing agent, consisting of 30-60 wt % of a macromolecule with multitype-adsorptive groups and water, the macromolecule with multitype-adsorptive groups has a polyethylene glycol side chain, and adsorption groups of the polymer backbone include a carboxylic acid group, a sulfonic acid group and a phosphoric acid group, the phosphoric acid group being linked to the backbone of the macromolecule with multitype-adsorptive groups by nucleophilic addition. The water-reducing agent of the present invention has significantly improved adaptability to different cements and aggregates while maintaining a high water reduction efficiency, compared with the conventional polycarboxylic acid water-reducing agent agent. It has a good water reducing efficiency in many different grades of cement, as well as a better resistance to aggregates containing more impurities such as machine-made sand.

Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.