Patents by Inventor Chia-Ming Cheng

Chia-Ming Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10424540
    Abstract: A chip package including a substrate having an upper surface, a lower surface, and a sidewall surface that is at the edge of the substrate is provided. The substrate includes a sensor device therein and adjacent to the upper surface thereof. The chip package further includes light-shielding layer disposed over the sidewall surface of the substrate and extends along the edge of the substrate to surround the sensor device. The chip package further includes a cover plate disposed over the upper surface of the substrate and a spacer layer disposed between the substrate and the cover plate. A method of forming the chip package is also provided.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: September 24, 2019
    Assignee: XINTEC INC.
    Inventors: Yen-Shih Ho, Po-Han Lee, Chia-Ming Cheng, Hsin-Yen Lin
  • Publication number: 20190281480
    Abstract: A user equipment (UE) is configured with at least one bandwidth part (BWP) specific configuration information. The UE receives a configuration information specific to the bandwidth part (BWP). The configuration information configures an initial value of a beam failure detection (BFD) timer and a beam failure indication (BFI) count threshold. The UE starts or re-starts the BFD timer from the initial value when receiving a beam failure indication (BFI) from a lower sublayer, and counts a number of the received BFIs using a BFI counter. The UE resets the BFI counter to zero when receiving a reconfiguration information. The reconfiguration information, that is specific to the BWP, re-configures at least one of the initial value of the BFD timer and the BFI count threshold.
    Type: Application
    Filed: March 9, 2019
    Publication date: September 12, 2019
    Inventors: CHIA-HUNG WEI, CHIE-MING CHOU, CHIEN-CHUN CHENG, YU-HSIN CHENG, HUNG-CHEN CHEN, HENG-LI CHIN
  • Patent number: 10397588
    Abstract: A method and apparatus of sharing an on-chip buffer or cache memory for a video coding system using coding modes including Inter prediction mode or Intra Block Copy (IntraBC) mode are disclosed. At least partial pre-deblocking reconstructed video data of a current picture is stored in an on-chip buffer or cache memory. If the current block is coded using IntraBC mode, the pre-deblocking reconstructed video data of the current picture stored in the on-chip buffer or cache memory are used to derive IntraBC prediction for the current block. In some embodiments, if the current block is coded using Inter prediction mode, Inter reference video data from the previous picture stored in the on-chip buffer or cache memory are used to derive Inter prediction for the current block. In another embodiment, the motion compensation/motion estimation unit is shared by the two modes.
    Type: Grant
    Filed: June 3, 2016
    Date of Patent: August 27, 2019
    Assignee: MEDIATEK INC.
    Inventors: Tzu-Der Chuang, Ping Chao, Ching-Yeh Chen, Yu-Chen Sun, Chih-Ming Wang, Chia-Yun Cheng, Han-Liang Chou, Yu-Wen Huang
  • Publication number: 20190215749
    Abstract: A user equipment (UE) is configured with at least one uplink carrier of a normal uplink carrier and a supplementary uplink carrier. The UE selects the supplementary uplink carrier if a measured RSRP is below a threshold. The UE performs a random access preamble transmission using a random access resources configured in association to the selected supplementary uplink carrier.
    Type: Application
    Filed: January 11, 2019
    Publication date: July 11, 2019
    Inventors: MEI-JU SHIH, CHIE-MING CHOU, HUNG-CHEN CHEN, CHIA-HUNG WEI, YUNG-LAN TSENG, YU-HSIN CHENG
  • Patent number: 10347616
    Abstract: A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. And the sensing element is disposed on the first surface. The computing chip has a second conductive pad and a computing element. The protective layer is formed by lamination and at least exposes the sensing element. The chip package further includes a conductive layer underneath the second surface of the sensing chip and extending to be in contact with the first conductive pad and the second conductive pad.
    Type: Grant
    Filed: May 9, 2017
    Date of Patent: July 9, 2019
    Assignee: XINTEC INC.
    Inventors: Hsin Kuan, Chin-Ching Huang, Chia-Ming Cheng
  • Publication number: 20190164844
    Abstract: Methods of cutting fins, and structures formed thereby, are described. In an embodiment, a structure includes a first fin on a substrate, a second fin on the substrate, and a fin cut-fill structure disposed between the first fin and the second fin. The first fin and the second fin are longitudinally aligned. The fin cut-fill structure includes an insulating liner and a fill material on the insulating liner. The insulating liner abuts a first sidewall of the first fin and a second sidewall of the second fin. The insulating liner includes a material with a band gap greater than 5 eV.
    Type: Application
    Filed: March 15, 2018
    Publication date: May 30, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wen HUANG, Chia-Hui LIN, Jaming CHANG, Jei Ming CHEN, Kai Hung CHENG
  • Publication number: 20190140012
    Abstract: A chip package includes a chip structure, a molding material, a conductive layer, a redistribution layer, and a passivation layer. The chip structure has a front surface, a rear surface, a sidewall, a sensing area, and a conductive pad. The molding material covers the rear surface and the sidewall. The conductive layer extends form the conductive pad to the molding material located on the sidewall. The redistribution layer extends form the molding material that is located on the rear surface to the molding material that is located on the sidewall. The redistribution layer is in electrical contact with an end of the conductive layer facing away from the conductive pad. The passivation layer is located on the molding material and the redistribution layer. The passivation layer has an opening, and a portion of the redistribution layer is located in the opening.
    Type: Application
    Filed: November 1, 2018
    Publication date: May 9, 2019
    Inventors: Hsin KUAN, Shih-Kuang CHEN, Chin-Ching HUANG, Chia-Ming CHENG
  • Publication number: 20180337142
    Abstract: A chip package is provided. A first bonding structure is disposed on a first redistribution layer (RDL). A first chip includes a sensing region and a conductive pad that are adjacent to an active surface. The first chip is bonded onto the first RDL through the first bonding structure. The first bonding structure is disposed between the conductive pad and the first RDL. A molding layer covers the first RDL and surrounds the first chip. A second RDL is disposed on the molding layer and the first chip and is electrically connected to the first RDL. A second chip is stacked on a non-active surface of the first chip and is electrically connected to the first chip through the second RDL, the first RDL, and the first bonding structure. A method of forming the chip package is also provided.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 22, 2018
    Inventors: Chia-Ming CHENG, Po-Han LEE, Wei-Chung YANG, Kuan-Jung WU, Shu-Ming CHANG
  • Publication number: 20180184064
    Abstract: A stereoscopic control method includes: establishing a specific mapping relation between a specific disparity value and a specific set of a first focal setting value of a first sensor of a stereo camera and a second focal setting value of a second sensor of the stereo camera; and controlling stereoscopic focus of the stereo camera according to the specific mapping relation. Besides, a stereoscopic control apparatus includes a mapping unit and a focus control unit. The mapping unit is arranged for establishing at least a specific mapping relation between a specific disparity value and a specific set of a first focal setting value of a first sensor of a stereo camera and a second focal setting value of a second sensor of the stereo camera. The focus control unit is arranged for controlling stereoscopic focus of the stereo camera according to the specific mapping relation.
    Type: Application
    Filed: February 22, 2018
    Publication date: June 28, 2018
    Applicant: MEDIATEK INC.
    Inventor: Chia-Ming Cheng
  • Publication number: 20180146182
    Abstract: A video frame processing method, which comprises: (a) capturing at least one first video flame via a first camera; (b) capturing at least one second video frame via a second camera; and (c) adjusting one candidate second video frame of the second video frames based on one of the first video frame to generate a target single view video frame.
    Type: Application
    Filed: January 18, 2018
    Publication date: May 24, 2018
    Applicant: MEDIATEK INC.
    Inventors: Chi-Cheng JU, Ding-Yun Chen, Cheng-Tsai Ho, Chia-Ming Cheng, Po-Hao Huang, Yuan-Chung Lee, Chung-Hung Tsai
  • Patent number: 9967549
    Abstract: A three-dimensional (3D) image capture method, employed in an electronic device with a monocular camera and a 3D display, includes at least the following steps: while the electronic device is moving, deriving a 3D preview image from a first preview image and a second preview image generated by the monocular camera, and providing 3D preview on the 3D display according to the 3D preview image, wherein at least one of the first preview image and the second preview image is generated while the electronic device is moving; and when a capture event is triggered, outputting the 3D preview image as a 3D captured image.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: May 8, 2018
    Assignee: MEDIATEK INC.
    Inventors: Chia-Ming Cheng, Cheng-Che Chan, Po-Hao Huang
  • Patent number: 9955142
    Abstract: An on-line stereo camera calibration method employed by an electronic device with a stereo camera device includes: retrieving a feature point set, and utilizing a stereo camera calibration circuit on the electronic device to calculate a stereo camera parameter set based on the retrieved feature point set. In addition, an on-line stereo camera calibration device on an electronic device with a stereo camera device includes a stereo camera calibration circuit. The stereo camera calibration circuit includes an input interface and a stereo camera calibration unit. The input interface is used to retrieve a feature point set. The stereo camera calibration unit is used to calculate a stereo camera parameter set based on at least the retrieved feature point set.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: April 24, 2018
    Assignee: MEDIATEK INC.
    Inventors: Chia-Ming Cheng, Po-Hao Huang, Yuan-Chung Lee, Chung-Hung Tsai
  • Patent number: 9948918
    Abstract: A stereoscopic control method includes: establishing a specific mapping relation between a specific disparity value and a specific set of a first focal setting value of a first sensor of a stereo camera and a second focal setting value of a second sensor of the stereo camera; and controlling stereoscopic focus of the stereo camera according to the specific mapping relation. Besides, a stereoscopic control apparatus includes a mapping unit and a focus control unit. The mapping unit is arranged for establishing at least a specific mapping relation between a specific disparity value and a specific set of a first focal setting value of a first sensor of a stereo camera and a second focal setting value of a second sensor of the stereo camera. The focus control unit is arranged for controlling stereoscopic focus of the stereo camera according to the specific mapping relation.
    Type: Grant
    Filed: December 10, 2012
    Date of Patent: April 17, 2018
    Assignee: MEDIATEK INC.
    Inventor: Chia-Ming Cheng
  • Publication number: 20180102321
    Abstract: A chip package including a substrate having an upper surface, a lower surface, and a sidewall surface that is at the edge of the substrate is provided. The substrate includes a sensor device therein and adjacent to the upper surface thereof. The chip package further includes light-shielding layer disposed over the sidewall surface of the substrate and extends along the edge of the substrate to surround the sensor device. The chip package further includes a cover plate disposed over the upper surface of the substrate and a spacer layer disposed between the substrate and the cover plate. A method of forming the chip package is also provided.
    Type: Application
    Filed: October 3, 2017
    Publication date: April 12, 2018
    Inventors: Yen-Shih HO, Po-Han LEE, Chia-Ming CHENG, Hsin-Yen LIN
  • Patent number: 9912929
    Abstract: A video frame processing method, which comprises: (a) capturing at least one first video frame via a first camera; (b) capturing at least one second video frame via a second camera; and (c) adjusting one candidate second video frame of the second video frames based on one of the first video frame to generate a target single view video frame.
    Type: Grant
    Filed: March 20, 2014
    Date of Patent: March 6, 2018
    Assignee: MEDIATEK INC.
    Inventors: Chi-Cheng Ju, Ding-Yun Chen, Cheng-Tsai Ho, Chia-Ming Cheng, Po-Hao Huang, Yuan-Chung Lee, Chung-Hung Tsai
  • Patent number: 9887229
    Abstract: This present invention provides a method of manufacturing a chip scale sensing chip package, comprising the steps of: providing a sensing device wafer having a first top surface and a first bottom surface opposite to each other, whereby the sensing device wafer comprises a plurality of chip areas, and each of the chip areas comprising a sensing device and a plurality of conductive pads adjacent to the sensing chip nearby the first top surface; providing a cap wafer having a second top surface and a second bottom surface opposite to each other, and bonding the second surface of the cap wafer to the first top surface of the sensing device wafer by sandwiching a first adhesive layer therebetween; providing a temporary carrier substrate, and bonding the temporary carrier substrate to the second top surface of the cap wafer by sandwiching a second adhesive layer therebetween; forming a wiring layer connecting to each of the conductive pads on the first bottom surface of the sensing device wafer; providing a first
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: February 6, 2018
    Assignee: XINTEC INC.
    Inventors: Yen-Shih Ho, Tsang-Yu Liu, Chia-Sheng Lin, Chia-Ming Cheng
  • Patent number: 9838672
    Abstract: A stereo preview apparatus has an auto-stereoscopic display, an input interface, a motion detection circuit, and a visual transition circuit. The input interface receives at least an input stereo image pair including a left-view image and a right-view image generated from an image capture device. The motion detection circuit evaluates a motion status of the image capture device. The visual transition circuit generates an output stereo image pair based on the input stereo image pair, and outputs the output stereo image pair to the auto-stereoscopic display for stereo preview, wherein the visual transition circuit refers to the evaluated motion status to configure adjustment made to the input stereo image pair when generating the output stereo image pair.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: December 5, 2017
    Assignee: MEDIATEK INC.
    Inventors: Chia-Ming Cheng, Po-Hao Huang, Yuan-Chung Lee
  • Publication number: 20170330871
    Abstract: A chip package includes a sensing chip, a computing chip, and a protective layer annularly surrounding the sensing chip and the computing chip. The sensing chip has a first conductive pad, a sensing element, a first surface and a second surface opposite to each other. And the sensing element is disposed on the first surface. The computing chip has a second conductive pad and a computing element. The protective layer is formed by lamination and at least exposes the sensing element. The chip package further includes a conductive layer underneath the second surface of the sensing chip and extending to be in contact with the first conductive pad and the second conductive pad.
    Type: Application
    Filed: May 9, 2017
    Publication date: November 16, 2017
    Inventors: Hsin KUAN, Chin-Ching HUANG, Chia-Ming CHENG
  • Patent number: 9799588
    Abstract: A chip package and a fabrication method thereof are provided according to an embodiment of the invention. The chip package includes a semiconductor substrate containing a chip and having a device area and a peripheral bonding pad area. A plurality of conductive pads is disposed at the peripheral bonding pad area and a passivation layer is formed over the semiconductor substrate to expose the conductive pads. An insulating protective layer is formed on the passivation layer at the device area. A packaging layer is disposed over the insulating protective layer to expose the conductive pads and the passivation layer at the peripheral bonding pad area. The method includes forming an insulating protective layer to cover a plurality of conductive pads during a cutting process and removing the insulating protective layer on the conductive pads through an opening of a packaging layer.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: October 24, 2017
    Assignee: XINTEC INC.
    Inventors: Ching-Yu Ni, Chia-Ming Cheng, Nan-Chun Lin
  • Patent number: 9690458
    Abstract: An image viewing method includes: determining at least a first partial image corresponding to a portion of a first image directly selected from a plurality of images, and driving a display apparatus according to the first partial image; in accordance with a user interaction input, determining a second partial image corresponding to a portion of a second image directly selected from the images; and driving the display apparatus according to at least the second partial image. In one implementation, the first image and the second image are spatially correlated, and a field of view (FOV) of each of the first image and the second image is larger than an FOV of the display apparatus.
    Type: Grant
    Filed: May 8, 2013
    Date of Patent: June 27, 2017
    Assignee: MEDIATEK INC.
    Inventor: Chia-Ming Cheng