Abstract: In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.

Abstract: A method and a device for driving high-voltage X ray tube with positive and negative pulses are disclosed comprises a microprocessor unit having a first output port and a second output port, respectively outputting a first and a second timing sequence of control signals, a high-voltage X ray tube, a first high-frequency voltage boost circuit outputting a first regulated high-voltage, a first high-voltage protection circuit, a second high-frequency voltage boost circuit outputting a second high-voltage, and a second high-voltage protection circuit. The first high and the second voltages are respectively, regulated by the first timing sequence of control signal and the second timing sequence of control signal. Both regulated high-voltages are, respectively, inputted to anode and cathode of the high-voltage X ray tube vias the high-voltage protected circuits.

Abstract: A touch panel and a manufacturing method of the touch panel are provided. The touch panel includes a touch circuit board, a cover plate and a glue layer. The glue layer is arranged between the touch circuit board and the cover plate to bond the touch circuit board and the cover plate. The glue layer contains an epoxy resin main agent and an epoxy resin hardener.

Abstract: An air duct for cooling dual socket information handling systems divides airflow into two parallel paths. Inner walls, a chassis divider and a top surface form a main channel. An intermediate divider and intermediate wall are positioned between the sockets, wherein airflow exiting the first socket is prevented from flowing through the second socket. Lower lateral channels and upper lateral channels are formed between each inner wall and a corresponding outer wall, wherein lower lateral channels allow airflow to bypass the first socket to cool the second socket and the upper lateral channels allow heated airflow exiting the first socket to bypass the second socket.

Abstract: A touch panel and a manufacturing method of the touch panel are provided. The touch panel includes a touch circuit board, a cover plate and a glue layer. The glue layer is arranged between the touch circuit board and the cover plate to bond the touch circuit board and the cover plate. The glue layer contains an epoxy resin main agent and an epoxy resin hardener.

Abstract: A true random metastable flip-flop (TRMFF) compiler generates an electrical architecture for a TRMFF chain. The compiler selects components for the TRMFF chain from a library of standard cells and logically connects these components in accordance with a primitive polynomial to generate the electrical architecture. The TRMFF chain provides a sequence of random numbers from one or more physical processes in accordance with the primitive polynomial. During operation, one or more microscopic phenomena inside and/or outside of the TRMFF chain can cause one or more low-level, statistically random entropy noise signals to be present within the TRMFF chain. The TRMFF chain advantageously utilizes the one or more low-level, statistically random entropy noise signals to provide the sequence of random numbers.

Abstract: A memory macro structure includes a first memory array, a second memory array, a cell activation circuit coupled to the first and second memory arrays and positioned between the first and second memory arrays, a control circuit coupled to the cell activation circuit and positioned adjacent to the cell activation circuit, and a through-silicon via (TSV) extending through one of the cell activation circuit or the control circuit.

Abstract: A touchpad module includes a bracket, a touch member and a supporting plate. The supporting plate is arranged between the bracket and the touch member. When an end of the touch member is pressed down, the end of the touch member is swung relative to the bracket through the supporting plate. The supporting plate includes a plate body, at least one supporting part and a swingable part. The plate body, the at least one supporting part and the swingable part are integrally formed as a one-piece structure. The present invention further provides a computing device with the touchpad module.

Abstract: A semiconductor device includes an analog voltage regulator and an integrated circuit module. The analog voltage regulator generates a regulated output voltage. The integrated circuit module generates an analog sense voltage based on the regulated output voltage and includes integrated circuit dies, a first sensor, second sensors, and a digital voltage offset controller (DVOC). The first sensor generates a digital reference voltage based on an analog reference voltage. The second voltage sensors detect voltages at predetermined locations on the integrated circuit dies. The DVOC generates a digital offset voltage substantially equal to the difference between the digital reference voltage and the voltage detected by a selected one of the second voltage sensors. The regulated output voltage is based on an unregulated input voltage, the analog sense voltage, and the digital offset voltage.

Abstract: A tool adapter quick-release structure includes an adapter and a locking mechanism. The adapter includes a seat portion and an engagement portion extended forward from the seat portion, and an installation hole formed to penetrate into the seat portion via the engagement portion. The locking mechanism includes a movable sleeve mounted onto the seat portion, an installation pin inserted into the movable sleeve and an elastic member abutted against the installation pin to push the movable sleeve axially, and the movable sleeve allowing a fixation member to penetrate through the seat portion to protrude outward inside the installation hole via push of the elastic member. The seat portion includes a repair hole corresponding to the installation pin and is connected to the installation hole.

Abstract: A head mounted display device and a power management method are provided. The head mounted display device includes a host device and a power input device. The power input device is detachably connected to a power device and an electronic device. The power input device generates a first input signal according to a supply voltage value of the power device, and generates a second input signal according to power supply information of the electronic device. The host device enters a power saving mode or performs a boot-up operation according to the first input signal and the second input signal.

Abstract: A solar adjustment apparatus includes a control circuit, two optical encoders, two driving modules, and a power circuit. The control circuit is arranged in an upper rail, and the upper rail is fixed on the upper side of a door or window of a building or vehicle. The two driving modules pivot two spools at the same speed. One of the driving modules controls a height of a middle rail in vertical direction of the door or window through one of optical encoders and one of spools. The other driving module controls a height of a lower rail in vertical direction of the door or window through the other optical encoder and the other spool.

Abstract: A method and a device for driving high-voltage X ray tube with positive and negative pulses are disclosed comprises a microprocessor unit having a first output port and a second output port, respectively outputting a first and a second timing sequence of control signals, a high-voltage X ray tube, a first high-frequency voltage boost circuit outputting a first regulated high-voltage, a first high-voltage protection circuit, a second high-frequency voltage boost circuit outputting a second high-voltage, and a second high-voltage protection circuit. The first high and the second voltages are respectively, regulated by the first timing sequence of control signal and the second timing sequence of control signal. Both regulated high-voltages are, respectively, inputted to anode and cathode of the high-voltage X ray tube vias the high-voltage protected circuits.

Abstract: A memory macro structure includes a first memory array, a second memory array, a cell activation circuit coupled to the first and second memory arrays and positioned between the first and second memory arrays, a control circuit coupled to the cell activation circuit and positioned adjacent to the cell activation circuit, and a through-silicon via (TSV) extending through one of the cell activation circuit or the control circuit.

Abstract: The present application provides an electronic device and a version control method thereof for comparing program code files of a program project in different versions. The method includes: reading a first manifest file of a first version and a second manifest file of a second version of the program project; and performing an analyzing main program on the first manifest file and the second manifest file to generate a comparison result, and displaying the comparison result on a display device.

Abstract: A touchpad module includes a base plate, a touch member, a switch, an elastic element, a first supporting element and a second supporting element. The base plate includes a triggering part. The touch member is located over the base plate. The switch is disposed on the touch member and aligned with the triggering part. The elastic element is located under the base plate. The elastic element includes a fixed part, a first swingable part and a second swingable part. The fixed part is fixed on the base plate. The first swingable part includes a first contact structure. The second swingable part includes a second contact structure. When an external force is exerted on the touch member, the touch member is swung toward the base plate relative to the first supporting element, and the second swingable part is swung away from the base plate.

Abstract: A keyboard device and a backlight module of the keyboard device are provided. The keyboard device includes a casing, the backlight module, a keyboard module and an expansion module. The backlight module includes a main body region and an extension region. The main body region and the extension region are connected with each other. A first light beam is outputted from the main body region to plural keys of the keyboard device. A second light beam is outputted from the extension region to the expansion module.

Abstract: The embodiments of the disclosure provide a manufacturing method of a package circuit, including the following steps. A circuit structure including a plurality of conductive pads is formed. A liquid crystal layer is formed on the circuit structure. An inspection step is performed, and the inspection step includes determining the conductivity of the conductive pads according to the result of the rotation of a liquid crystal layer oriented with an electric field. In addition, the liquid crystal layer is removed.

Abstract: A keyboard device and a backlight module of the keyboard device are provided. The keyboard device includes a casing, the backlight module, a keyboard module and an expansion module. The backlight module includes a main body region and an extension region. The main body region and the extension region are connected with each other. A first light beam is outputted from the main body region to plural keys of the keyboard device. A second light beam is outputted from the extension region to the expansion module.

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.