Patents by Inventor Chieh Wang

Chieh Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12113266
    Abstract: A dual-band transform circuit structure includes a first transmission line, a second transmission line, and a conductive layer. The first transmission line has a first input terminal, a first output terminal, and a second output terminal. The second transmission line has a second input terminal, a third input terminal, a third output terminal, and a fourth output terminal. The second input terminal is coupled to the first output terminal, and the third input terminal is coupled to the second output terminal. The conductive layer is stacked with the first transmission and the second transmission line. The conductive layer includes a first hollow pattern. The first hollow pattern and the second transmission line are overlapped in a top view.
    Type: Grant
    Filed: September 7, 2022
    Date of Patent: October 8, 2024
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Tzu-Hao Hsieh, Chih-Chieh Wang
  • Patent number: 12107015
    Abstract: A method includes forming a gate stack of a transistor. The formation of the gate stack includes forming a silicon oxide layer on a semiconductor region, depositing a hafnium oxide layer over the silicon oxide layer, depositing a lanthanum oxide layer over the hafnium oxide layer, and depositing a work-function layer over the lanthanum oxide layer. Source/drain regions are formed on opposite sides of the gate stack.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: October 1, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shahaji B. More, Zheng-Yang Pan, Shih-Chieh Chang, Chun Chieh Wang
  • Patent number: 12097303
    Abstract: The present disclosure provides a decellularized extracellular matrix, the preparation process and uses thereof. The decellularized extracellular matrix of the present disclosure is derived from a three-dimensional cell spheroid, and the decellularized extracellular matrix has a three-dimensional spherical structure. The decellularized extracellular matrix of the present disclosure can be used to prepare a biomedical material scaffold for promoting tissue regeneration and repair.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: September 24, 2024
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Chieh-Cheng Huang, Cheng-En Chiang, Yi-Qiao Fang, Chao-Ting Ho, Yu-Chieh Wang, Anna Blocki
  • Patent number: 12087575
    Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In a method embodiment, a dielectric layer is formed on a semiconductor substrate. The semiconductor substrate has a source/drain region. An opening is formed through the dielectric layer to the source/drain region. A silicide region is formed on the source/drain region and a barrier layer is formed in the opening along sidewalls of the dielectric layer by a same Plasma-Enhance Chemical Vapor Deposition (PECVD) process.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: September 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Wei Chang, Min-Hsiu Hung, Hung-Yi Huang, Chun Chieh Wang, Yu-Ting Lin
  • Publication number: 20240294618
    Abstract: This disclosure provides antibodies and antigen-binding fragments that can be administered to a subject that has been bitten by a venomous snake. Antibodies and antigen-binding fragments herein can be capable of treating or curing the subject and may provide protection against snake venom for up to several weeks. A combination or population of antibodies and antigen-binding fragments can be administered to the subject where the type of snake is not known or where a subject has been bitten by more than one species of snake. This disclosure further provides methods for identification of such broadly-neutralizing antibodies.
    Type: Application
    Filed: October 4, 2023
    Publication date: September 5, 2024
    Inventors: Jacob E. Glanville, Timothy Paul Friede, David Tsao, Sindy Andrea Liao Chan, I-Chieh Wang
  • Patent number: 12080761
    Abstract: The present disclosure describes an exemplary fin structure formed on a substrate. The disclosed fin structure comprises an n-type doped region formed on a top portion of the substrate, a silicon epitaxial layer on the n-type doped region, and an epitaxial stack on the silicon epitaxial layer, wherein the epitaxial stack comprises a silicon-based seed layer in physical contact with the silicon epitaxial layer. The fin structure can further comprise a liner surrounding the n-type doped region, and a dielectric surrounding the liner.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: September 3, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shahaji B. More, Huai-Tei Yang, Zheng-Yang Pan, Shih-Chieh Chang, Chun-Chieh Wang, Cheng-Han Lee
  • Publication number: 20240283693
    Abstract: A transceiver system includes a signal generator and controller circuit, a first signal converter circuit, an attenuator circuit, and a second signal converter circuit. Signal generator and controller circuit generates a transmitting baseband signal. First signal converter circuit generates a transmitting radio frequency signal according to transmitting baseband signal. Attenuator circuit generates an attenuated radio frequency signal according to transmitting radio frequency signal. Second signal converter circuit generates an attenuation range baseband reference signal according to attenuated radio frequency signal.
    Type: Application
    Filed: February 14, 2024
    Publication date: August 22, 2024
    Inventors: Tzu-Hao HSIEH, Chih-Chieh WANG
  • Patent number: 12068545
    Abstract: An antenna structure includes a first signal source, a second signal source, a first radiator, a second radiator, a third radiator, a first circuit, and a second circuit. The first signal source is used to generate a first wireless signal, and the second signal source is used to generate a second wireless signal. The first radiator is coupled to the first signal source to receive the first wireless signal, and the second radiator is coupled to the second signal source to receive the second wireless signal. The first circuit has a first end coupled to the third radiator and a second end coupled to the first radiator or the first signal source. The second circuit has a first end coupled to the third radiator and a second end coupled to the second radiator or the second signal source.
    Type: Grant
    Filed: August 18, 2023
    Date of Patent: August 20, 2024
    Assignee: HTC Corporation
    Inventors: Cheng-Hung Lin, Szu-Po Wang, Chia-Te Chien, Chun-Chieh Wang, Kang-Ling Li, Chun-Hsien Lee, Yu-Chieh Chiu
  • Patent number: 12068331
    Abstract: An electronic device having a peripheral area and a non-peripheral area adjacent to the peripheral area is provided. The electronic device includes a flexible substrate, a first conductive layer disposed on the flexible substrate and disposed in the peripheral area and the non-peripheral area, an organic layer disposed in the non-peripheral area and on the first conductive layer, a second conductive layer disposed on the first conductive layer, and an organic structure disposed between the first conductive layer and the second conductive layer in the peripheral area. The organic layer and the organic structure are the same material layer.
    Type: Grant
    Filed: April 21, 2023
    Date of Patent: August 20, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Ti-Chung Chang, Chih-Chieh Wang, Chien-Chih Chen
  • Publication number: 20240270825
    Abstract: This disclosure provides antibodies and that can be administered to an individual that is infected with a virus. Antibodies herein can be capable of treating or curing the virus, and which may provide protection against the virus for up to several weeks. Antibodies herein can be used to diagnose a SARS-CoV-2 infection.
    Type: Application
    Filed: August 24, 2023
    Publication date: August 15, 2024
    Inventors: Jacob Glanville, Shahrad Daraeikia, I-Chieh Wang, Sindy Andrea Liao Chan, Jean-Philippe Bürckert, Sawsan Youssef
  • Publication number: 20240266335
    Abstract: An electronic package and the manufacturing method thereof are provided, in which a first electronic element and a second electronic element are disposed on a carrier structure, and the first electronic element and the second electronic element are electrically connected to each other by a wire. Therefore, by replacing some layers of the circuit layer of the carrier structure with the wire, the carrier structure can satisfy the functional signal transmission of the first and second electronic elements without configuring too many circuit layers, so as to shorten the process steps and time of the carrier structure, thereby effectively reducing the manufacturing cost of the electronic package.
    Type: Application
    Filed: May 2, 2023
    Publication date: August 8, 2024
    Inventors: Huan-Shiang LI, Yih-Jenn JIANG, Cheng-Kai CHANG, Wei-Son TSAI, Yi-Chieh WANG
  • Publication number: 20240266439
    Abstract: A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a gate structure formed over a fin structure, and a gate spacer layer formed on a sidewall surface of the gate structure. The semiconductor structure includes a source/drain (S/D) epitaxial layer formed adjacent to the gate structure, and a dielectric spacer layer formed on the S/D epitaxial layer. The semiconductor structure includes a contact plug barrier formed over the S/D epitaxial layer, and a contact plug surrounding by the contact plug barrier, wherein the contact plug is separated from the gate spacer layer by the dielectric spacer layer and the contact plug barrier.
    Type: Application
    Filed: April 17, 2024
    Publication date: August 8, 2024
    Inventors: Chun-Chieh WANG, Yu-Ting LIN, Yueh-Ching PAI, Shih-Chieh CHANG, Huai-Tei YANG
  • Publication number: 20240266331
    Abstract: Methods for manufacturing an electronic device and a transfer device are provided. The method for manufacturing the electronic device includes the following steps. A plurality of elements are provided, wherein each of the elements includes a first bonding pad. A substrate including a plurality of second bonding pads is provided. The plurality of elements are transferred to a transfer head. A portion of the elements is selectively transferred to the substrate, wherein the step of selectively transferring includes projecting a laser-light onto the portion of the elements so that the first bonding pad of the portion of the elements is bonded to at least one of the second bonding pads on the substrate.
    Type: Application
    Filed: March 27, 2024
    Publication date: August 8, 2024
    Inventors: Tung-Kai LIU, Tsau-Hua HSIEH, Fang-Ying LIN, Kai CHENG, Hui-Chieh WANG, Shun-Yuan HU
  • Publication number: 20240249983
    Abstract: A light-emitting device includes a substrate, a light-emitting diode, a first layer, a color filter layer, and a second layer. The light-emitting diode is disposed on the substrate. The first layer is disposed on the substrate and has an opening. At least a portion of the light-emitting diode is disposed in the opening of the first layer. The color filter layer is disposed on the light-emitting diode. The second layer is disposed on the first layer and has an opening overlapped with the opening of the first layer. The second layer is configured to shield light emitted from the light-emitting diode. In the cross-sectional view of the light-emitting device, the minimum width of the opening of the first layer is less than the minimum width of the opening of the second layer.
    Type: Application
    Filed: April 2, 2024
    Publication date: July 25, 2024
    Inventors: Tung-Kai LIU, Tsau-Hua HSIEH, Wei-Cheng CHU, Chun-Hsien LIN, Chandra LIUS, Ting-Kai HUNG, Kuan-Feng LEE, Ming-Chang LIN, Tzu-Min YAN, Hui-Chieh WANG
  • Publication number: 20240251542
    Abstract: The present disclosure provides a method of manufacturing a semiconductor device. The method includes: sequentially forming a first supporting layer, a first mold layer, and a second supporting layer on a surface of a substrate; forming a plurality of first openings on the second supporting layer to expose the first mold layer; sequentially forming a second mold layer and a third supporting layer on the second supporting layer including the first openings; forming a plurality of second openings on the third supporting layer to expose the second mold layer; filling a mold material in the second openings; forming a plurality of trenches to expose the substrate, and the trenches are separated from the second openings; conformally forming a conductive layer on inner sidewalls of the trenches; and removing the mold material, the second mold layer, and the first mold layer.
    Type: Application
    Filed: January 19, 2023
    Publication date: July 25, 2024
    Inventor: Wen-Chieh WANG
  • Patent number: 12044574
    Abstract: A non-contact body temperature measurement device includes a thermal imager, an anemometer and a processing unit. The thermal imager is provided to capture thermal images. The anemometer is provided to measure wind speed and output a wind speed signal. The processing unit is provided to process the thermal images according to the wind speed signal and remove the thermal image showing great variation in temperature between two consecutive frames. Consequently, an accurate body temperature can be measured through the processed thermal images.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: July 23, 2024
    Assignee: NATIONAL SUN YAT-SEN UNIVERSITY
    Inventors: Fu-Kang Wang, Pin-Hsun Juan, Ya-Chi Su, Yu-Chieh Wang, Ju-Yin Shih
  • Patent number: 12046823
    Abstract: A communication device includes a nonconductive track, an antenna element, a first turning wheel, and a second turning wheel. The antenna element is disposed on the nonconductive track. The first turning wheel and the second turning wheel drive the nonconductive track according to a control signal, so as to adjust the position of the antenna element. The communication device provides an almost omnidirectional radiation pattern.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: July 23, 2024
    Assignee: HTC CORPORATION
    Inventors: Cheng-Hung Lin, Szu-Po Wang, Chia-Te Chien, Chun-Chieh Wang, Kang-Ling Li, Chun-Hsien Lee, Yu-Chieh Chiu
  • Patent number: 12045382
    Abstract: Apparatuses and methods of operating the same are described. An apparatus including a display, an input device, and a processing device coupled to the display and the input device. The processing device may send an output to the display. The output may include a graphical object associated with a first step of a user-implemented procedure. The processing device may receive an input from the input device. The input may indicate a progress on an execution of the first step by an operator. The processing device may determine whether the input indicates that the operator has completed the first step. The processing device may determine whether the first step is a final step in the user-implemented procedure. The processing device may identify a second step in the user-implemented procedure when the input indicates that the operator has completed the first step and the first step is not a final step.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: July 23, 2024
    Assignee: West Texas Technology Partners, LLC
    Inventors: Mohamed Nabil Hajj Chehade, Chieh Wang, Mohamed Fayez Taha, Karim Fikani, Paul Neil Iglesias Paulino
  • Publication number: 20240243114
    Abstract: An electronic package structure includes first and second package modules combined with each other. The first package module includes a substrate and a first electronic component disposed thereon, at least one second electronic component, and an insulation film. The first electronic component and the second electronic component are adjacent to each other. The insulation film includes a base material and a foam glue body, and the foam glue body is viscous and compressible. The second package module includes a heat dissipation plate and a liquid metal and an insulation protrusion portion disposed thereon. The liquid metal is pressed by the heat dissipation plate and the first electronic component. The insulation protrusion portion covers and abuts against the insulation film to press the foam glue body through the base material so as to deform the foam glue body and enable the foam glue body to cover the second electronic component.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Applicant: Acer Incorporated
    Inventors: Yu-Ming Lin, Mao-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Kuan-Lin Chen, Chun-Chieh Wang
  • Patent number: 12040428
    Abstract: The present disclosure provides a transferring head and a method for manufacturing an electronic device. The transferring head includes a substrate, a head unit, and a plurality of connecting elements. The head unit includes an electrode and a cantilever supporting the electrode. Two adjacent ones of the connecting elements are disposed between the substrate and the head unit. The electrode and a part of the cantilever are suspended over the substrate, and the cantilever is connected between one of the plurality of connecting elements and the electrode. The electrode is spaced apart from the plurality of connecting elements when viewed along a normal direction of the substrate.
    Type: Grant
    Filed: March 1, 2023
    Date of Patent: July 16, 2024
    Assignee: InnoLux Corporation
    Inventors: Hui-Chieh Wang, Tsau-Hua Hsieh, Fang-Ying Lin