Abstract: A heat dissipation system of an electronic device including a body, a plurality of heat sources disposed in the body, and at least one centrifugal heat dissipation fan disposed in the body is provided. The centrifugal heat dissipation fan includes a housing and an impeller disposed in the housing on an axis. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions, and the plurality of outlets respectively correspond to the plurality of heat sources.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: The invention relates to a logic control device of a serial peripheral interface, a master-slave system and a master-slave switchover method therefor. The logic control device is connected between N masters and M slaves, and define master-slave connection relationships between each of the masters and each of the slaves. Each of the master-slave connection relationship is that each of the masters and each of the slaves transmit information one-to-one at the same time, and includes connecting the logic control device between the masters and the slaves to form the master-slave system as well as the master-slave switchover method therefor.

Abstract: A network intrusion detecting system includes a network card configured to receive network traffic and a processor. The processor is configured to analyze the network traffic and extract traffic characteristics of the network traffic and confirm whether the network traffic is network traffic to be detected based on the traffic characteristics; input the network traffic to be detected into an automatic coding module to obtain a reconstructed sample and calculate a reconstruction error between the network traffic to be detected and the reconstructed sample; input the network traffic to be detected and the reconstructed sample respectively into at least one classification module and calculate a distribution similarity when the reconstruction error is less than a reconstruction error threshold; and input the network traffic to be detected into an intrusion anomaly classification model for network intrusion classification when the distribution similarity is less than a confidence distribution similarity threshold.

Abstract: An information handling system includes multiple dual in-line memory modules (DIMMs) and a basic input/output system (BIOS). The DIMMs form a memory system of the information handling system. The BIOS begins a system boot of the information handling system, and performs a first memory reference code training. Based on the first memory reference code training, the BIOS discovers a bad DIMM of the DIMMs, and stores information associated with the bad DIMM. The BIOS reboots the information handling system. During the reboot, the BIOS retrieves the information associated with the bad DIMM. The BIOS disables a slot associated with the bad DIMM. In response to the slot being disabled, the BIOS performs a second memory reference code training. Based on the second memory reference code training, the BIOS downgrades the memory system to a closest possible DIMM population.

Abstract: A method and a system for mental index prediction are provided. The method includes the following steps. A plurality of images of a subject person are obtained. A plurality of emotion tags of the subject person in the images are analyzed. A plurality of integrated emotion tags in a plurality of predetermined time periods are calculated according to the emotion tags respectively corresponding to the images. A plurality of preferred features are determined according to the integrated emotion tags. A mental index prediction model is established according to the preferred features to predict a mental index according to the emotional index prediction model.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A fan is provided herein, including a housing, a hub, and a plurality of blades. The housing includes a top case and a bottom case. The hub is rotatably disposed between the top case and the bottom case in an axial direction. The blades extend from the hub in a radial direction, located between the top case and the bottom case. Each of the blades has a proximal end and a distal end. The proximal end is connected to the hub. The distal end is opposite from the proximal end, located at the other side of the blade, having at least one recessed portion. Each of the recessed portions form a passage for air.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: A memory device, an error correction device and an error correction method thereof are provided. The error correction device includes a first error correction decoder and a second error correction decoder. The first error correction decoder performs at least one iteration of a first error correction operation on a data chunk, calculates a counting number of syndrome values equal to a set logic value generated in the at least one iteration of the first error correction operation, and generates a control signal according to the counting number. The second error correction decoder receives the control signal and determines whether to be activated to perform a second error correction operation on the data chunk or not according to the control signal. An error correction ability of the second error correction decoder is higher than an error correction ability of the first error correction decoder.

Abstract: A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a lower horizontal supporting layer, an upper horizontal supporting layer, a vertical supporting structure, and a first capacitor electrode. The lower horizontal supporting layer is disposed on the substrate. The upper horizontal supporting layer is disposed on the lower horizontal supporting layer. The vertical supporting structure extends between the lower horizontal supporting layer and the upper horizontal supporting layer. The first capacitor electrode is disposed on the substrate and extends from the lower horizontal supporting layer to the upper horizontal supporting layer.

Abstract: A semiconductor device and a method for manufacturing the same are provided. The semiconductor device includes a substrate, a lower horizontal supporting layer, an upper horizontal supporting layer, a vertical supporting structure, and a first capacitor electrode. The lower horizontal supporting layer is disposed on the substrate. The upper horizontal supporting layer is disposed on the lower horizontal supporting layer. The vertical supporting structure extends between the lower horizontal supporting layer and the upper horizontal supporting layer. The first capacitor electrode is disposed on the substrate and extends from the lower horizontal supporting layer to the upper horizontal supporting layer.

Abstract: A surgical robot including at least one contact module, a control connection module, at least one first robotic arm, and at least one grip control device. A first transmission member of the control connection module drives the control module through a first transmission connecting member. A first shaft member of the first robotic arm is connected with the first transmission member while the grip control device is connected with the first robotic arm by a transmission interface. A force sensing member of the first robotic arm detects a first reaction force from the contact module so that the first robotic arm sends a feedback control signal to the grip control device to control a grip driving member to generate a force feedback for allowing a grip portion to move. Thereby, users can feel movement of the grip portion caused by the force feedback to avoid accidental iatrogenic injuries.

Abstract: An electronic device, a carrying buckle, and a carrying frame of a carrying buckle are provided. The carrying frame is integrally formed as a single one-piece structure and is insertable into a retaining case along an insertion direction for being fixed in the retaining case. The carrying frame includes a body segment, two buckling arms respectively extending from two opposite sides of the body segment, and an elastic structure that extends from the body segment. The elastic structure is elastically deformable when being pressed along the insertion direction, such that an abutting end of each of the two buckling arms has a displacement that allows the abutting end to be abutted against the retaining case.

Abstract: A centrifugal heat dissipation fan including a housing and an impeller disposed in the housing on an axis is provided. The housing has at least one inlet on the axis and has a plurality of outlets in different radial directions. A heat dissipation system of an electronic device is also provided.

Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.

Abstract: A mobile device includes a housing, a first radiation element, a second radiation element, a third radiation element, a first switch element, and a second switch element. The first radiation element has a first feeding point. The second radiation element has a second feeding point. The first radiation element, the second radiation element, and the third radiation element are distributed over the housing. The first switch element is closed or open, so as to selectively couple the first radiation element to the third radiation element. The second switch element is closed or open, so as to selectively couple the second radiation element to the third radiation element. An antenna structure is formed by the first radiation element, the second radiation element, and the third radiation element.

Abstract: An antenna structure and a head mounted display device are provided. The antenna structure includes a first structure body, a second structure body and a feeding element. The first structure body receives a reference ground voltage. The second structure body is coupled to the first structure body. The second structure body includes a conductive part, a shaft sleeves part and a shaft body, the shaft body passes through the shaft sleeves part, the shaft body is electronically coupled to the conductive part, and the conductive part is coupled to a feed point. The feeding element is coupled to the feed point and the first structure body, and is used for transmitting and receiving a radio frequency signal.

Abstract: An underwater ultrasonic device includes a curvilinear ultrasonic transducer and a plurality of straight linear ultrasonic transducers. The straight linear ultrasonic transducers are disposed with respect to the curvilinear ultrasonic transducer. A first angle is included between the straight linear ultrasonic transducers. One of the curvilinear ultrasonic transducer and the straight linear ultrasonic transducer is configured to transmit a plurality of ultrasonic signals. Another one of the curvilinear ultrasonic transducer and the straight linear ultrasonic transducer is configured to receive a plurality of reflected signals of the ultrasonic signals.

Abstract: A method of curing or otherwise processing semiconductor wafers in an environmentally controlled process chamber includes: loading a plurality of semiconductor wafers into the process chamber such that pairs of adjacent semiconductor wafers are spaced apart from one another by gaps therebetween; introducing a process gas into the process chamber containing the plurality of semiconductor wafers; and drawing gas from the process chamber through one or more exhaust manifolds. Suitably, each exhaust manifold includes a plurality of inlet orifices through which gas is drawn into the exhaust manifold, at least one of the inlet orifices facing and aligning with each of the gaps.