Patents by Inventor Chien-An Lai
Chien-An Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190371398Abstract: A memory circuit includes a bias voltage generator, a drive circuit, and a resistive random-access memory (RRAM) device. The bias voltage generator includes a first current path configured to receive a first current from a current source, and output a bias voltage based on a voltage difference generated from conduction of the first current in the first current path. The drive circuit is configured to receive the bias voltage and output a drive voltage having a voltage level based on the bias voltage, and the RRAM device is configured to conduct a second current responsive to the drive voltage.Type: ApplicationFiled: May 24, 2019Publication date: December 5, 2019Inventors: Chung-Cheng CHOU, Hsu-Shun CHEN, Chien-An LAI, Pei-Ling TSENG, Zheng-Jun LIN
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Patent number: 10466750Abstract: An electronic device includes a first body, a second body, a function module and a driving module. The second body is pivoted to the first body. The function module is pivoted to the first body and located between the first body and the second body. The driving module is at least disposed at the first body and the function module. When the first body is closed to the second body, the function module is located at an original position relative to the second body, and the function module is exposed from the first body. When the first body is rotated in a first clock direction to a first angle relative to the second body, the function module is driven by the driving module so as to rotate in a second clock direction to a second angle relative to the second body, and the first angle is greater than the second angle.Type: GrantFiled: December 21, 2018Date of Patent: November 5, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Nien-Chen Lee, Tzu-Chien Lai, Yen-Hsiao Yeh
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Publication number: 20190317557Abstract: An electronic device includes a first component, a second component, a dual axis module, and a third component. The second component is flipably disposed at the first component. The dual axis module has a first shaft and a second shaft. The second component is pivoted to the second shaft. The third component is pivoted to the first shaft. The electronic device is switched between a first state, a second state, a third state, and a fourth state. During the switching of the first state to the second state, the first shaft is rotatable relative to the first component and the second shaft is non-rotatable. During the switching of the second state to the third state, the first shaft is non-rotatable and the second shaft is rotatable relative to the first component. During the switching of the third state to the fourth state, the first shaft is rotatable relative to the first component and the second shaft is non-rotatable.Type: ApplicationFiled: April 16, 2019Publication date: October 17, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Tzu-Chien Lai, Yen-Hsiao Yeh
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Publication number: 20190250673Abstract: An electronic device includes a first body, a second body, a base, a first shaft structure, a second shaft structure, and a locking component. The second body is connected to the first body through the base. The first shaft structure includes a first shaft and a second shaft. The second body is pivoted to a first base portion of the base through the first shaft and a second base portion of the base through the second shaft. The second shaft structure includes a connecting component fixed to the first body and a third shaft pivoted to the first base portion and the connecting component. The first and second shafts are perpendicular to the third shaft. The locking component is slidably disposed between the second base portion and the first body and configured to lock or release a connection between the second base portion and the first body.Type: ApplicationFiled: February 1, 2019Publication date: August 15, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Wei-Ting Chen, Tzu-Chien Lai, Yen-Hsiao Yeh, Nien-Chen Lee, Yi-Chun Lin
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Publication number: 20190196553Abstract: An electronic device includes a first body, a second body, a function module and a driving module. The second body is pivoted to the first body. The function module is pivoted to the first body and located between the first body and the second body. The driving module is at least disposed at the first body and the function module. When the first body is closed to the second body, the function module is located at an original position relative to the second body, and the function module is exposed from the first body. When the first body is rotated in a first clock direction to a first angle relative to the second body, the function module is driven by the driving module so as to rotate in a second clock direction to a second angle relative to the second body, and the first angle is greater than the second angle.Type: ApplicationFiled: December 21, 2018Publication date: June 27, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Nien-Chen Lee, Tzu-Chien Lai, Yen-Hsiao Yeh
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Patent number: 10312651Abstract: An electronic device adapted to be detachably assembled to a lamp holder having a lamp socket is provided. The electronic device includes an adaptor module and a functional module. The adaptor module includes a lamp connector corresponding to the lamp socket, a first connector electrically connected to the lamp connector, and a first engaging member adjacent to the first connector. The functional module includes a second connector and a second engaging member. The second engaging member of the functional module is detachably connected to the first engaging member of the adaptor module. When the functional module is assembled to the adaptor module, the second connector is electrically connected to the first connector.Type: GrantFiled: March 19, 2018Date of Patent: June 4, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Tzu-Chien Lai, Chia-Chen Lin
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Publication number: 20190139770Abstract: A method includes receiving a semiconductor wafer into a chamber; generating a plasma within the chamber to accelerate particles toward the semiconductor wafer; generating a magnetic field above the semiconductor wafer by an electromagnetic structure contained within the chamber, wherein the electromagnetic structure comprises a plurality of electromagnetic elements; and adjusting the magnetic field, wherein the adjusting of the magnetic field includes moving positions of each of the plurality of electromagnetic elements independently.Type: ApplicationFiled: December 28, 2018Publication date: May 9, 2019Inventors: Chien-An Lai, Joseph Wu, Wen-Yu Ku
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Publication number: 20190129475Abstract: An electronic device includes a first body, a second body, a hinge structure, a pivot bracket, and a third body. The hinge structure is pivotally connected to the first body and the second body, and the second body is adapted to rotate along an axis relative to the first body. The pivot bracket includes a pivot portion and a fixing portion, wherein the pivot portion is pivoted to the hinge structure. The third body is fixed to the fixing portion of the pivot bracket, so that the third body is adapted to rotate along the axis center relative to the first body.Type: ApplicationFiled: October 31, 2018Publication date: May 2, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Tzu-Chien Lai, Shih-Yao Lin, Tung-Ching Lin
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Publication number: 20190020748Abstract: An electronic device including a main body, a driver module, and a plurality of expanded members is provided. The main body includes at least one image module. The driver module is movably disposed in the main body. The expanded members are disposed beside the main body and connected to the driver module, and each of the expanded members includes at least one of a radio module and a speaker module. The driver module is adapted to drive the expanded members to expand from a collapsed position to a use position, when the expanded members are located at the collapsed position, the expanded members are collapsed to the main body, and the expanded members are driven by the driver module to be expanded with respect to the main body and are moved to the use position.Type: ApplicationFiled: May 7, 2018Publication date: January 17, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Tzu-Chien Lai, Shih-Yao Lin
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Patent number: 10170313Abstract: Systems and methods for improving doping and/or deposition uniformity using a tunable electromagnetic field generation device are provided. In an exemplary embodiment, the system includes a chamber configured to contain a semiconductor wafer, a plasma generator, and a gas inlet, and an exhaust gas outlet. The gas inlet permits a controlled flow of a gas into the chamber through a wall of the chamber and the exhaust gas outlet permits exhausting of gas from the chamber. The system further includes a wafer support structure configured to support the semiconductor wafer during a doping or deposition process and an electromagnetic structure positioned within the chamber and at least partially surrounding an upper surface of the wafer support structure.Type: GrantFiled: May 2, 2016Date of Patent: January 1, 2019Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-An Lai, Joseph Wu, Wen-Yu Ku
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Publication number: 20180278002Abstract: An electronic device adapted to be detachably assembled to a lamp holder having a lamp socket is provided. The electronic device includes an adaptor module and a functional module. The adaptor module includes a lamp connector corresponding to the lamp socket, a first connector electrically connected to the lamp connector, and a first engaging member adjacent to the first connector. The functional module includes a second connector and a second engaging member. The second engaging member of the functional module is detachably connected to the first engaging member of the adaptor module. When the functional module is assembled to the adaptor module, the second connector is electrically connected to the first connector.Type: ApplicationFiled: March 19, 2018Publication date: September 27, 2018Applicant: COMPAL ELECTRONICS, INC.Inventors: Tzu-Chien Lai, Chia-Chen Lin
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Patent number: 10026391Abstract: A microphone device including a first sound receiving module, a second sound receiving module and a sound collecting trough is provided. The first sound receiving module receives a sound signal to output a first electronic signal. The second sound receiving module receives the sound signal to output a second electronic signal. The first sound receiving module is coupled to the second sound receiving module, and the phase of the first electronic signal and the phase of the second electronic signal are inverse to each other. A distance between the first sound receiving module and the sound collecting trough is smaller than a distance between the second sound receiving module and the sound collecting trough, and another sound signal is transferred to the first sound receiving module through the sound collecting trough.Type: GrantFiled: August 14, 2017Date of Patent: July 17, 2018Assignee: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Chia-Chung Lin, Chao-Kuan Chiang, Chien-An Lai
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Patent number: 10024906Abstract: A device comprises a coarse timing skew characterization circuit having a buffer chain and a coarse delay cell calibration circuit comprising a first flip-flop, a second flip-flop and a logic gate, wherein the coarse delay cell calibration circuit is configured to measure a delay between an input of the buffer chain and an output of the buffer chain.Type: GrantFiled: November 12, 2014Date of Patent: July 17, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chao Kai Chuang, Yen-Chien Lai, Hung-Jen Liao
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Publication number: 20180114520Abstract: A microphone device including a first sound receiving module, a second sound receiving module and a sound collecting trough is provided. The first sound receiving module receives a sound signal to output a first electronic signal. The second sound receiving module receives the sound signal to output a second electronic signal. The first sound receiving module is coupled to the second sound receiving module, and the phase of the first electronic signal and the phase of the second electronic signal are inverse to each other. A distance between the first sound receiving module and the sound collecting trough is smaller than a distance between the second sound receiving module and the sound collecting trough, and another sound signal is transferred to the first sound receiving module through the sound collecting trough.Type: ApplicationFiled: August 14, 2017Publication date: April 26, 2018Applicant: Merry Electronics(Shenzhen) Co., Ltd.Inventors: Chia-Chung Lin, Chao-Kuan Chiang, Chien-An Lai
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Patent number: 9886064Abstract: A connecting assembly is disposed between two opposite assembling sides of a first body and a second body of an electronic device. The connecting assembly includes an engaging member, an engaging portion and an elastic fixing mechanism. The engaging member is pivoted to the first body and the engaging portion is fixed to the second body. The elastic fixing mechanism is connected to the first body. When the first body is assembled to the second body, the engaging member rotates relative to the engaging portion from a first position to a second position, such that the engaging member is infixed to the engaging portion and the second body. Then elastic force of the elastic fixing mechanism fixes the engaging member together with the engaging portion and the second body, such that the first body is assembled to the second body. An electronic device having the connecting assembly is also provided.Type: GrantFiled: February 17, 2014Date of Patent: February 6, 2018Assignee: COMPAL ELECTRONICS, INC.Inventors: Tzu-Chien Lai, Kun-Hsin Liu, Wei-Hao Lan, Ching-Tai Chang, Hong-Tien Wang, Yao-Tsung Yeh, Cheng-Hsun Lee, Chia-Ying Chen
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Publication number: 20170316942Abstract: Systems and methods for improving doping and/or deposition uniformity using a tunable electromagnetic field generation device are provided. In an exemplary embodiment, the system includes a chamber configured to contain a semiconductor wafer, a plasma generator, and a gas inlet, and an exhaust gas outlet. The gas inlet permits a controlled flow of a gas into the chamber through a wall of the chamber and the exhaust gas outlet permits exhausting of gas from the chamber. The system further includes a wafer support structure configured to support the semiconductor wafer during a doping or deposition process and an electromagnetic structure positioned within the chamber and at least partially surrounding an upper surface of the wafer support structure.Type: ApplicationFiled: May 2, 2016Publication date: November 2, 2017Inventors: Chien-An Lai, Joseph Wu, Wen-Yu Ku
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Patent number: 9671830Abstract: An electronic device including a main body and a stand module is provided. The stand module includes a supporting component and a sliding component. The supporting component is pivoted to the main body. The sliding component is slidably disposed to the main body and has an end. The sliding component is adapted to slide to a first position such that the end protrudes out of the main body. The end is adapted to receive an external force to move inside the main body, such that the sliding component slides to a second position and drives the supporting component to expand from the main body.Type: GrantFiled: February 5, 2016Date of Patent: June 6, 2017Assignee: COMPAL ELECTRONICS, INC.Inventors: Yi-Hung Chen, Tzu-Chien Lai, Cheng-Ya Chi
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Publication number: 20160230924Abstract: An electronic device including a main body and a stand module is provided. The stand module includes a supporting component and a sliding component. The supporting component is pivoted to the main body. The sliding component is slidably disposed to the main body and has an end. The sliding component is adapted to slide to a first position such that the end protrudes out of the main body. The end is adapted to receive an external force to move inside the main body, such that the sliding component slides to a second position and drives the supporting component to expand from the main body.Type: ApplicationFiled: February 5, 2016Publication date: August 11, 2016Applicant: COMPAL ELECTRONICS, INC.Inventors: Yi-Hung Chen, Tzu-Chien Lai, Cheng-Ya Chi
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Patent number: D803832Type: GrantFiled: December 22, 2016Date of Patent: November 28, 2017Assignee: COMPAL ELECTRONICS, INC.Inventors: Shih-Yao Lin, Tzu-Chien Lai, Wei-Han Hu, Tse-Hsun Pang
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Patent number: D846524Type: GrantFiled: June 3, 2017Date of Patent: April 23, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Tzu-Chien Lai, Shih-Yao Lin