Abstract: An SSD control system comprising a first control system including a first control device, and comprising a second control system including a second control device. The first control system is coupled to a first SSD group comprising a plurality of first SSDs, and the second control system is coupled to a second SSD group comprising a plurality of second SSDs. The first control device comprises: a first processing circuit, configured to control a first portion of the first SSDs; and a second processing circuit, configured to control a second portion of the first SSDs. The second control device comprises: a first signal repeating device, configured to respectively receive first, second control signals from the first, second processing circuit to control a first, second portion of the second SSDs. The second control system does not comprise any circuit which can generate control signals to control the second SSD group.

Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

Abstract: In a method of manufacturing a semiconductor device, a fin structure in which first semiconductor layers and second semiconductor layers are alternately stacked is formed, a sacrificial gate structure is formed over the fin structure, a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space, the first semiconductor layers are laterally etched through the source/drain space, and a source/drain epitaxial layer is formed in the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers and at least one of the spacer has width changes along vertical direction of device. At least one of the first semiconductor layers has a composition different from another of the first semiconductor layers.

Abstract: A light path adjustment mechanism includes a carrier, an optical plate member, a support, a base, a first pair of transmission mechanical pieces, and a second pair of transmission mechanical pieces. One side of the support is provided with a first actuator, and one side of the base is provided with a second actuator. The first pair of transmission mechanical pieces are connected between the base and the support, and the second pair of transmission mechanical pieces are connected between the carrier and the support. The first pair of transmission mechanical pieces are entirely disposed on only one side of the carrier.

Abstract: An intelligence-defined optical tunnel network system includes pods. Each pod includes optical add-drop sub-systems. Each optical add-drop sub-system includes a first transmission module and a second transmission module. The first transmission modules of the optical add-drop sub-systems are connected to each other for forming a first transmission ring. The second transmission modules of the optical add-drop sub-systems are connected to each other for forming a second transmission ring. Each first transmission module includes a multiplexer and an optical signal amplifier. The multiplexer is connected to a Top-of-Rack switch. The multiplexer is configured to receive, through input ports, upstream optical signals from the Top-of-Rack switch, and combine the upstream optical signals into a composite optical signal. The upstream optical signals have wavelengths respectively.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.

Abstract: A semiconductor device package includes a plurality of semiconductor chips and an interposer structure. The interposer structure has a plurality of tiers for accommodating the plurality of semiconductor chips. The interposer structure includes at least one conductive via connecting to a pad of the plurality of semiconductor chips.

Abstract: An interactive education system includes a storage, an output device, a processor, an input device and a recognition device. The processor controls the output device to produce voice based on a hint on a target answer stored in the storage. The recognition device generates a response through performing speech recognition on input data generated by the input device from voice of a user. The processor controls the output device to produce voice based on whether the response matches the target answer or any relevant characteristic. Depending on a count of consecutive occurrences of a failed event, the processor controls the output device to produce voice based on another hint or the target answer.

Abstract: The present invention provides a memory device including a connector and a flash memory controller. The connector is configured to connect to a first host and a second host. The flash memory controller is configured to select one of the first host and the second host based on a selection signal, and the flash memory controller only processes commands from the selected one of the first host and the second host, and accesses a flash memory module based on the commands.

Abstract: The invention relates to a method for establishing a wireless communication channel between a vehicle and a vehicle accessory. The method comprises, in the vehicle: detecting a wired communication channel between the vehicle and the accessory; transmitting a vehicle identifier from the vehicle to the accessory via the wired communication channel; receiving an accessory identifier; deriving a unique code based on the vehicle identifier and the accessory identifier using a predetermined function; broadcasting the unique code by a vehicle wireless transceiver.

Abstract: A recipient recommendation system and method may include receiving an input from a message creator using a messaging platform, continuously analyzing the input for a plurality of dynamic characteristics, as the input is received from the message creator via the messaging platform, the plurality of dynamic characteristics being used to determine a content of the input, comparing the content with an interest map that aggregates interests of a plurality of potential recipients from of a plurality of interest matrices, wherein the interests of the plurality of potential recipients are acquired by constantly monitoring a message platform activity of the plurality of potential recipients, determining, as a function of the comparing, a relevance ranking of the plurality of potential recipients with respect to the content input by the message creator, and providing a list of recommended recipients from the plurality of recipients, based on the relevance ranking.

Abstract: An integrated circuit die includes a FinFET transistor. The FinFET transistor includes an anti-punch through region below a channel region. Undesirable dopants are removed from the anti-punch through region during formation of the source and drain regions. When source and drain recesses are formed, a layer of dielectric material is deposited in the recesses. An annealing process is then performed. Undesirable dopants diffuse from the anti-punch through region into the layer of dielectric material during the annealing process. The layer of dielectric material is then removed. The source and drain regions are then formed by depositing semiconductor material in the recesses.

Abstract: A first neural network model of a user device processes audio data to extract audio embeddings that represent vocal characteristics of a user of an utterance represented in the audio data. The audio embeddings may then be hashed to remove characteristics specific to the user while still maintaining a unique set of characteristics. The hashed embeddings may be sent to a remote system, which may use them to identify the user.

Abstract: The disclosure describes embodiments of an apparatus including a first gas chromatograph including a fluid inlet, a fluid outlet, and a first temperature control. A controller is coupled to the first temperature control and includes logic to apply a first temperature profile to the first temperature control to heat, cool, or both heat and cool the first gas chromatograph. Other embodiments are disclosed and claimed.

Abstract: A splicable environmentally-friendly non-PVC advertising cloth made of a woven structure, wherein the advertising cloth comprising a mesh base layer (40); a first adhesion-promoting structural layer (10), which is a refractory and waterproof layer covering the front surface (43) and the rear surface (44) of the mesh base layer (40); a second adhesion-promoting structural layer (20) coated on the first surface (13) of the first adhesion-promoting structure layer (10); and a third adhesion-promoting structural layer (30) coated on the upper surface (24) of the second adhesion-promoting structure layer (20), therefore, waterproof and ink-absorbing structure arranged on a mesh base (40) layer, and the width of the advertising cloth (50) can be spliced unlimitedly as required by using high frequency splicing, making the environmentally friendly advertising cloth more applicable also improving the overall advertising effect and quality.

Abstract: The present invention provides a detection device and a method with simplified computing manner A transmitter transmits detection signals to an environment to detect a target. At least a portion of the detection signals are reflected by the target to generate a plurality of reflection signals. A receiver comprises a plurality of receiving units. Each of the receiving units receives the reflection signals to generate a receiving signal. A processing module connected to the receiver includes a conversion unit, an integration unit and a computing unit. The conversion unit converts the receiving signals into transformation signals by a time-domain to frequency-domain transformation. The integration unit integrates the transformation signals into a first integration signal and a second integration signal. The computing unit decomposes the first integration signal and the second integration signal to 1D arrays.

Abstract: The present invention provides a circuit having a filter with an amplifier circuit for filtering and amplifying an input signal to generate an output signal, wherein a corner frequency of the filter is adjustable to control a settling time of the output signal.

Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

Abstract: An intelligence-defined optical tunnel network system includes a plurality of pods. Any one of the pods includes a plurality of optical add-drop sub-systems (OADS), which are configured to perform data transmission, respectively, through a plurality of Top-of-Rack (ToR) switches between a corresponding plurality of servers. Any one of the OADSs includes a first transmission module and a second transmission module. The first transmission module is configured to perform data transmission at a first frequency band, and the first transmission module of any one of the OADSs connected to the first transmission module of the adjacent OADSs to form a first transmission ring. The second transmission module is configured to perform data transmission at a second frequency band differed to the first frequency band, and the second transmission module of any one of the OADSs connected to the second transmission module of the adjacent OADSs to form a second transmission ring.

Abstract: A hot spot defect detecting method and a hot spot defect detecting system are provided. In the method, hot spots are extracted from a design of a semiconductor product to define a hot spot map comprising hot spot groups, wherein local patterns in a same context of the design yielding a same image content are defined as a same hot spot group. During runtime, defect images obtained by an inspection tool performing hot scans on a wafer manufactured with the design are acquired and the hot spot map is aligned to each defect image to locate the hot spot groups. The hot spot defects in each defect image are detected by dynamically mapping the hot spot groups located in each defect image to a plurality of threshold regions and respectively performing automatic thresholding on pixel values of the hot spots of each hot spot group in the corresponding threshold region.