Abstract: A touch sensor comprises a first electrode, a second electrode arranged spaced apart from the first electrode, and an insulator arranged between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode is energized, and an energy difference exists between the first electrode and the second electrode. At least one of the first electrode and the second electrode is a stressed electrode. When the stressed electrode is not stressed, no electrical signal is generated, and when the stressed electrode is stressed, the stressed electrode deforms at a stressed point and changes the distance between the stressed point and the other electrode to generate a tunneling current, and the touch sensor generates the electrical signal according to whether the tunneling current is generated. Therefore, the invention solves a limitation of the conventional touch sensor in touching and provides good touching sensitivity.

Abstract: A touch sensor comprises a first electrode, a second electrode arranged spaced apart from the first electrode, and an insulator arranged between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode is energized, and an energy difference exists between the first electrode and the second electrode. At least one of the first electrode and the second electrode is a stressed electrode. When the stressed electrode is not stressed, no electrical signal is generated, and when the stressed electrode is stressed, the stressed electrode deforms at a stressed point and changes the distance between the stressed point and the other electrode to generate a tunneling current, and the touch sensor generates the electrical signal according to whether the tunneling current is generated. Therefore, the invention solves a limitation of the conventional touch sensor in touching and provides good touching sensitivity.

Abstract: The present invention provides a memory device including a connector and a flash memory controller. The connector is configured to connect to a first host and a second host. The flash memory controller is configured to select one of the first host and the second host based on a selection signal, and the flash memory controller only processes commands from the selected one of the first host and the second host, and accesses a flash memory module based on the commands.

Abstract: A polypropylene environmentally friendly advertising cloth having a fabric base layer (20), which is a mesh braid made of Polypropylene woven by warp thread (21) and weft thread (22); a first waterproof and fireproof layer (30) and a second waterproof and fireproof layer (40) which are made by coating an aqueous polyacrylate coating slurry on the first surface (24) and the second surface (25) to form a thin film layer, the aqueous polyacrylate coating slurry penetrating the meshes (11); an ink-absorbing layer (50) which are made by coating a water absorption coating material that made of acrylic on the second waterproof and fireproof layer (40). The present invention is PVC free and non-toxic, so that it is particularly suitable for indoor advertising and interior decoration and fulfills the use for medical purposes.

Abstract: The disclosure describes embodiments of an apparatus including a first gas chromatograph including a fluid inlet, a fluid outlet, and a first temperature control. A controller is coupled to the first temperature control and includes logic to apply a first temperature profile to the first temperature control to heat, cool, or both heat and cool the first gas chromatograph. Other embodiments are disclosed and claimed.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.

Abstract: An SSD comprising: a circuit board; a first storage region, provided on a first side of the circuit board, comprising at least one first memory; a control region, provided on the first side, comprising at least one control IC for controlling the first memory; and first heat sink material, provided on the first storage region or the first control region.

Abstract: An SSD control system comprising a first control system including a first control device, and comprising a second control system including a second control device. The first control system is coupled to a first SSD group comprising a plurality of first SSDs, and the second control system is coupled to a second SSD group comprising a plurality of second SSDs. The first control device comprises: a first processing circuit, configured to control a first portion of the first SSDs; and a second processing circuit, configured to control a second portion of the first SSDs. The second control device comprises: a first signal repeating device, configured to respectively receive first, second control signals from the first, second processing circuit to control a first, second portion of the second SSDs. The second control system does not comprise any circuit which can generate control signals to control the second SSD group.

Abstract: A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

Abstract: In a method of manufacturing a semiconductor device, a fin structure in which first semiconductor layers and second semiconductor layers are alternately stacked is formed, a sacrificial gate structure is formed over the fin structure, a source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space, the first semiconductor layers are laterally etched through the source/drain space, and a source/drain epitaxial layer is formed in the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers and at least one of the spacer has width changes along vertical direction of device. At least one of the first semiconductor layers has a composition different from another of the first semiconductor layers.

Abstract: A light path adjustment mechanism includes a carrier, an optical plate member, a support, a base, a first pair of transmission mechanical pieces, and a second pair of transmission mechanical pieces. One side of the support is provided with a first actuator, and one side of the base is provided with a second actuator. The first pair of transmission mechanical pieces are connected between the base and the support, and the second pair of transmission mechanical pieces are connected between the carrier and the support. The first pair of transmission mechanical pieces are entirely disposed on only one side of the carrier.

Abstract: An intelligence-defined optical tunnel network system includes pods. Each pod includes optical add-drop sub-systems. Each optical add-drop sub-system includes a first transmission module and a second transmission module. The first transmission modules of the optical add-drop sub-systems are connected to each other for forming a first transmission ring. The second transmission modules of the optical add-drop sub-systems are connected to each other for forming a second transmission ring. Each first transmission module includes a multiplexer and an optical signal amplifier. The multiplexer is connected to a Top-of-Rack switch. The multiplexer is configured to receive, through input ports, upstream optical signals from the Top-of-Rack switch, and combine the upstream optical signals into a composite optical signal. The upstream optical signals have wavelengths respectively.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.

Abstract: A semiconductor device package includes a plurality of semiconductor chips and an interposer structure. The interposer structure has a plurality of tiers for accommodating the plurality of semiconductor chips. The interposer structure includes at least one conductive via connecting to a pad of the plurality of semiconductor chips.

Abstract: An interactive education system includes a storage, an output device, a processor, an input device and a recognition device. The processor controls the output device to produce voice based on a hint on a target answer stored in the storage. The recognition device generates a response through performing speech recognition on input data generated by the input device from voice of a user. The processor controls the output device to produce voice based on whether the response matches the target answer or any relevant characteristic. Depending on a count of consecutive occurrences of a failed event, the processor controls the output device to produce voice based on another hint or the target answer.

Abstract: The present invention provides a memory device including a connector and a flash memory controller. The connector is configured to connect to a first host and a second host. The flash memory controller is configured to select one of the first host and the second host based on a selection signal, and the flash memory controller only processes commands from the selected one of the first host and the second host, and accesses a flash memory module based on the commands.

Abstract: The invention relates to a method for establishing a wireless communication channel between a vehicle and a vehicle accessory. The method comprises, in the vehicle: detecting a wired communication channel between the vehicle and the accessory; transmitting a vehicle identifier from the vehicle to the accessory via the wired communication channel; receiving an accessory identifier; deriving a unique code based on the vehicle identifier and the accessory identifier using a predetermined function; broadcasting the unique code by a vehicle wireless transceiver.

Abstract: A recipient recommendation system and method may include receiving an input from a message creator using a messaging platform, continuously analyzing the input for a plurality of dynamic characteristics, as the input is received from the message creator via the messaging platform, the plurality of dynamic characteristics being used to determine a content of the input, comparing the content with an interest map that aggregates interests of a plurality of potential recipients from of a plurality of interest matrices, wherein the interests of the plurality of potential recipients are acquired by constantly monitoring a message platform activity of the plurality of potential recipients, determining, as a function of the comparing, a relevance ranking of the plurality of potential recipients with respect to the content input by the message creator, and providing a list of recommended recipients from the plurality of recipients, based on the relevance ranking.

Abstract: An integrated circuit die includes a FinFET transistor. The FinFET transistor includes an anti-punch through region below a channel region. Undesirable dopants are removed from the anti-punch through region during formation of the source and drain regions. When source and drain recesses are formed, a layer of dielectric material is deposited in the recesses. An annealing process is then performed. Undesirable dopants diffuse from the anti-punch through region into the layer of dielectric material during the annealing process. The layer of dielectric material is then removed. The source and drain regions are then formed by depositing semiconductor material in the recesses.

Abstract: A first neural network model of a user device processes audio data to extract audio embeddings that represent vocal characteristics of a user of an utterance represented in the audio data. The audio embeddings may then be hashed to remove characteristics specific to the user while still maintaining a unique set of characteristics. The hashed embeddings may be sent to a remote system, which may use them to identify the user.