Abstract: A tiered immersion cooling system includes a chassis, a cabinet frame slidably mounted to the chassis, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidable between a first internal position and a first external position. Sliding motion of the cabinet frame is in a horizontal direction along a depth of the chassis. The upper immersion tank is slidably mounted to the chassis. The upper immersion tank is slidable with the cabinet frame in the horizontal direction. The upper immersion tank slides relative to the cabinet frame, in a vertical direction along a height of the chassis. The lower immersion tank is positioned below the upper immersion tank in the vertical direction. The lower immersion tank is mounted to slide independently from the cabinet frame, in the horizontal direction. The lower immersion tank slides between a second internal and a second external position.

Abstract: A server rack for supporting a plurality of servers of varying heights includes opposing side walls each including one or more vertical tracks. A first column of holes is disposed in one of the vertical tracks and a second column of holes disposed in a corresponding opposing vertical track of the opposing side wall. A third and fourth column of holes are disposed adjacent to and corresponding to the first column of holes and the second column of holes. A first pair of opposing rails are each disposed on the opposing side walls. Each of the opposing rails are mechanically secured to the one or more vertical tracks at the first and second columns of holes. The first pair of opposing rails are configured to support a first server having a first height. For the first and second columns of holes, the spacing between holes is predefined to accommodate opposing rails to support servers of the first height.

Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) chip in which a pad barrier layer caps a pad of a piezoelectric device. The pad barrier layer is configured to block hydrogen ions and/or other errant materials from diffusing to the piezoelectric layer. Absent the pad barrier layer, hydrogen ions from hydrogen-ion containing processes performed after forming the pad may diffuse to the piezoelectric layer along a via extending from the pad to the piezoelectric device. By blocking diffusion of hydrogen ions and/or other errant materials to the piezoelectric device, the pad barrier layer may prevent delamination and breakdown of the piezoelectric layer. Hence, the pad barrier layer may prevent failure of the piezoelectric device.

Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: (I), in which Ra, Rb, Rc, Rd, X1, X2, R1-R4, W, Z, and L are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating HBV infection and a pharmaceutical composition containing same.

Abstract: A wavelength conversion element includes a substrate, a wavelength conversion layer and a fixed ring. The fixed ring has a first surface, a second surface, and a plurality of flow guiding structures. The second surface has a first region and a second region. The plurality of flow guiding structures is located on the first surface, and each of the plurality of flow guiding structures is formed with a first flow guiding hole. The first flow guiding hole extends from the first surface to the second region of the second surface. The plurality of flow guiding structures respectively have a spoiler surface, the spoiler surface stands on the first surface and has a second flow guiding hole, in which the second flow guiding hole and the first flow guiding hole of each of the plurality of flow guiding structures face different directions. A projection device of the invention is further provided.

Abstract: A piezoelectric device including a substrate, a metal-insulator-metal element, a hydrogen blocking layer, a passivation layer, a first contact terminal and a second contact terminal is provided. The metal-insulator-metal element is disposed on the substrate. The hydrogen blocking layer is disposed on the metal-insulator-metal element. The passivation layer covers the hydrogen blocking layer and the metal-insulator-metal element. The first contact terminal is electrically connected to the metal-insulator-metal element. The second contact terminal is electrically connected to the metal-insulator-metal element.

Abstract: A device includes a substrate, a first layer of getter material, a first electrode, an insulator element, a second electrode, a first input-output electrode, and a second input-output electrode. The first layer of getter material is deposited on the substrate. The first electrode is formed in a first conductive layer deposited on the first layer of getter material. The first layer of getter material has a getter capacity for hydrogen that is higher than the first electrode. The insulator element is formed in a piezoelectric layer deposited on the first electrode. The second electrode is formed in a second conductive layer deposited on the insulator element. The first input-output electrode is conductively connecting to the first layer of getter material. The second input-output electrode is conductively connecting to the second electrode.

Abstract: In some embodiments, the present disclosure relates to a processing tool that includes a wafer chuck disposed within a hot plate chamber and having an upper surface configured to hold a semiconductor wafer. A heating element is disposed within the wafer chuck and configured to increase a temperature of the wafer chuck. A motor is coupled to the wafer chuck and configured to rotate the wafer chuck around an axis of rotation extending through the upper surface of the wafer chuck. The processing tool further includes control circuitry coupled to the motor and configured to operate the motor to rotate the wafer chuck while the temperature of the wafer chuck is increased to form a piezoelectric layer from a sol-gel solution layer on the semiconductor wafer.

Abstract: The present disclosure relates to a method of forming a device. The method includes depositing a first layer of getter material on a substrate. A first electrode is formed in a first conductive layer deposited on the first layer of getter material. An insulator element is formed in a piezoelectric layer deposited on the first electrode. A second electrode is formed in a second conductive layer deposited on the insulator element. A first input-output electrode is formed to be conductively connected to the first layer of getter material and a second input-output electrode is formed to be conductively connected to the second electrode.

Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.

Abstract: An integrated circuit package system includes a substrate, a plurality of leads, N semiconductor devices, N first heat sinks, an encapsulating body, a second heat sink and a plurality of heat-dissipating fins protruding upward from the second heat sink, where N is a natural number. The leads are formed on a lower surface of the substrate. Each of the semiconductor devices is attached on an upper surface of the substrate, and includes a plurality of bonding pads which each is electrically connected to the corresponding lead. Each first heat sink is thermally coupled to a first top surface of the corresponding semiconductor device. The encapsulating body is formed to cover the substrate, the N semiconductor devices and the N first heat sinks such that the leads are exposed. The second heat sink is mounted on the encapsulating body, and is thermally coupled to the N first heat sinks.

Abstract: A power supply unit where the main DC voltage output rail is incorporated within the enclosure of the power supply unit and some DC voltage output rails and DC-DC converters are located outside the enclosure of the power supply unit close to or directly at the input of the system board and input of associated system peripheral via integration into a cable harness assembly, to negate the voltage drop on the cable harness assembly, resulting in a lower power loss across the cable harness assembly, leading to an improvement in combined power supply unit and cable harness assembly efficiency.

Abstract: An optical network optimization method is disclosed. The optimization method includes training a neural network, adjusting at least one of a plurality of auxiliary output values of a plurality of auxiliary neurons of the neural network, and performing inference with the neural network. A neural network and an attention mechanism are utilized to predict network performance key performance indicator(s) so as to achieve efficient routing optimization, network planning and fast failure recovery.

Abstract: The present invention is directed to therapeutic compositions for treating pancreatic cancer comprising a cyclohexnone compound and one or more anti-cancer agents.

Abstract: A key preloading structure including a base, a set of switches and a set of keys is provided. The set of switches is arranged on the base. The set of keys has a rotating shaft and two actuators. The rotating shaft is assembled on the base. One end of each actuator is fixedly connected to the rotating shaft, and another end is disposed on a switch of the set of switches. Each of the two actuators preloads the set of switches with a force less than a triggering force for starting the set of switches.

Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.

Abstract: A multi-body device includes a first machine body, a second machine body, a rotating member, a first magnetic member, a second magnetic member, and a stopper. The second machine body is pivoted to a pivot side of the first machine body. The rotating member is pivoted to the pivot side of the first machine body and located beside the second machine body. The first magnetic member is disposed at the second machine body. The second magnetic member is disposed at a portion of the rotating member corresponding to the first magnetic member. Two corresponding ends of the first magnetic member and the second magnetic member are magnetically repulsive to each other. The stopper is driven by the second machine body and disposed at the pivot side of the first machine body, so as to stretch into or retreat from a rotation path of the rotating member.

Abstract: The present invention provides methods and compositions for treating atopic dermatitis by cyclohexenone compounds.

Abstract: A monitoring method based on Internet of things (IoT), a fog computing terminal and an Internet of things system are provided. The fog computing terminal downloads an application package from a cloud server, downloads a general model from the cloud server through the application package, sets one or more IoT devices to a device group to receive a plurality of sensing data from the device group, and executes an incremental learning based on the sensing data and the general model to obtain an incrementally learning model for controlling the device group by the incrementally learning model.

Abstract: A wavelength conversion element includes an illumination system, a light valve, and a projection lens. The illumination system is configured to provide an illumination beam. The light valve is disposed on a transmissive path of the illumination beam to convert the illumination beam into an image beam. The projection lens is disposed on a transmissive path of the image beam. The illumination system includes an excitation beam source and the aforementioned wavelength conversion element. The excitation beam source is configured to provide an excitation beam. The wavelength conversion element is disposed on a transmissive path of the excitation beam. A projection apparatus adopting the aforementioned wavelength conversion element is further provided. The substrate has good structural strength and the surface of the substrate has better flatness, so the excitation beam can be accurately focused on the wavelength conversion layer to maintain stable excitation efficiency.