Patents by Inventor Chih-Ming Chen

Chih-Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230112534
    Abstract: An artificial intelligence planning method and a real-time radio access network intelligence controller are provided. The method includes: obtaining current input data; predicting a prediction result based on the current input data by using a causal reasoning model; generating a current state at least based on the prediction result; treating the current state as an initial state of an artificial intelligence planner and finding a specific planning path in a planning tree based on the initial state by using the artificial intelligence planner; and controlling a target system based on a plurality of action instructions.
    Type: Application
    Filed: April 14, 2022
    Publication date: April 13, 2023
    Applicant: Wistron Corporation
    Inventor: Chih-Ming Chen
  • Publication number: 20230110592
    Abstract: A construction system for recurrent Bayesian networks, a construction method for recurrent Bayesian networks, a computer-readable recording medium, a non-transitory computer program product, and a radio network control system are provided. The method is performed by a processor, and includes: establishing an initial population, and setting the initial population as a current population; establishing a corresponding recurrent Bayesian network for each CPPN in the current population, to obtain a set of recurrent Bayesian networks corresponding to the current population; evolving the current population by using an evolutionary algorithm and a fitness function to obtain a next population; determining whether a termination condition is met; and repeatedly performing the foregoing steps in response to the termination condition being not met, and selecting a solution network in the current population as the task network based on the fitness function in response to the termination condition being met.
    Type: Application
    Filed: June 14, 2022
    Publication date: April 13, 2023
    Inventor: Chih-Ming Chen
  • Publication number: 20230111791
    Abstract: An artificial intelligence planning method and an artificial intelligence planning device are provided. When a considered specific application has a plurality of planning layers, a corresponding planning node set and a planning tree are built for each of the planning layers according to a domain file, and all planning nodes in the planning node set of each of the planning layers satisfy a plurality of corresponding preset conditions. In addition, a corresponding planning path may be determined in each of the planning trees, and a plurality of action commands may be accordingly issued to the specific application to achieve a corresponding target state. In this way, the specific application having multiple planning layers may be equipped with self-configuration, self-optimizing, and self-healing functions and is then implemented as a self-organizing application.
    Type: Application
    Filed: November 19, 2021
    Publication date: April 13, 2023
    Applicant: Wistron Corporation
    Inventor: Chih-Ming Chen
  • Patent number: 11624978
    Abstract: A method for manufacturing a semiconductor includes: receiving a photomask substrate including a shielding layer; defining a chip region and a peripheral region adjacent to the chip region; forming a design pattern in the chip region; forming a reference pattern by emitting one first radiation shot and a beta pattern by emitting a plurality of second radiation shots in the peripheral region, wherein a pixel size of the first radiation shot is greater than a pixel size of the second radiation shot; comparing a reference roughness of a boundary of the reference pattern and a beta roughness of a boundary of the beta pattern; transferring the design pattern to the shielding layer if a difference between the reference roughness and the beta roughness is within a tolerance; and transferring the design pattern of the photomask to a semiconductor substrate.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: April 11, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Cheng-Ming Lin, Hao-Ming Chang, Chih-Ming Chen, Chung-Yang Huang
  • Publication number: 20230079756
    Abstract: A piezoelectric device including a substrate, a metal-insulator-metal element, a hydrogen blocking layer, a passivation layer, a first contact terminal and a second contact terminal is provided. The metal-insulator-metal element is disposed on the substrate. The hydrogen blocking layer is disposed on the metal-insulator-metal element. The passivation layer covers the hydrogen blocking layer and the metal-insulator-metal element. The first contact terminal is electrically connected to the metal-insulator-metal element. The second contact terminal is electrically connected to the metal-insulator-metal element.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chih-Ming Chen
  • Publication number: 20230052701
    Abstract: A tiered immersion cooling system includes a chassis, a cabinet frame slidably mounted to the chassis, an upper immersion tank, and a lower immersion tank. The cabinet frame is slidable between a first internal position and a first external position. Sliding motion of the cabinet frame is in a horizontal direction along a depth of the chassis. The upper immersion tank is slidably mounted to the chassis. The upper immersion tank is slidable with the cabinet frame in the horizontal direction. The upper immersion tank slides relative to the cabinet frame, in a vertical direction along a height of the chassis. The lower immersion tank is positioned below the upper immersion tank in the vertical direction. The lower immersion tank is mounted to slide independently from the cabinet frame, in the horizontal direction. The lower immersion tank slides between a second internal and a second external position.
    Type: Application
    Filed: October 21, 2021
    Publication date: February 16, 2023
    Inventors: Chao-Jung CHEN, Ta-Chih CHEN, Chih-Ming CHEN
  • Patent number: 11576277
    Abstract: A server rack for supporting a plurality of servers of varying heights includes opposing side walls each including one or more vertical tracks. A first column of holes is disposed in one of the vertical tracks and a second column of holes disposed in a corresponding opposing vertical track of the opposing side wall. A third and fourth column of holes are disposed adjacent to and corresponding to the first column of holes and the second column of holes. A first pair of opposing rails are each disposed on the opposing side walls. Each of the opposing rails are mechanically secured to the one or more vertical tracks at the first and second columns of holes. The first pair of opposing rails are configured to support a first server having a first height. For the first and second columns of holes, the spacing between holes is predefined to accommodate opposing rails to support servers of the first height.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: February 7, 2023
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Chih-Ming Chen
  • Publication number: 20230037116
    Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit (IC) chip in which a pad barrier layer caps a pad of a piezoelectric device. The pad barrier layer is configured to block hydrogen ions and/or other errant materials from diffusing to the piezoelectric layer. Absent the pad barrier layer, hydrogen ions from hydrogen-ion containing processes performed after forming the pad may diffuse to the piezoelectric layer along a via extending from the pad to the piezoelectric device. By blocking diffusion of hydrogen ions and/or other errant materials to the piezoelectric device, the pad barrier layer may prevent delamination and breakdown of the piezoelectric layer. Hence, the pad barrier layer may prevent failure of the piezoelectric device.
    Type: Application
    Filed: January 18, 2022
    Publication date: February 2, 2023
    Inventor: Chih-Ming Chen
  • Publication number: 20230012560
    Abstract: A compound of Formula (I) below, or a pharmaceutically acceptable salt, stereoisomer, solvate, or prodrug thereof: (I), in which Ra, Rb, Rc, Rd, X1, X2, R1-R4, W, Z, and L are defined as in the SUMMARY section. Further disclosed are a method of using the above-described compound, salt, stereoisomer, solvate, or prodrug for treating HBV infection and a pharmaceutical composition containing same.
    Type: Application
    Filed: September 4, 2020
    Publication date: January 19, 2023
    Applicant: TAIGEN BIOTECHNOLOGY CO., LTD.
    Inventors: Chih-Ming Chen, Chu-Chung Lin, Chang-Pin Huang, Chiayn Chiang
  • Publication number: 20220413372
    Abstract: A wavelength conversion element includes a substrate, a wavelength conversion layer and a fixed ring. The fixed ring has a first surface, a second surface, and a plurality of flow guiding structures. The second surface has a first region and a second region. The plurality of flow guiding structures is located on the first surface, and each of the plurality of flow guiding structures is formed with a first flow guiding hole. The first flow guiding hole extends from the first surface to the second region of the second surface. The plurality of flow guiding structures respectively have a spoiler surface, the spoiler surface stands on the first surface and has a second flow guiding hole, in which the second flow guiding hole and the first flow guiding hole of each of the plurality of flow guiding structures face different directions. A projection device of the invention is further provided.
    Type: Application
    Filed: June 8, 2022
    Publication date: December 29, 2022
    Inventor: CHIH-MING CHEN
  • Patent number: 11527701
    Abstract: A piezoelectric device including a substrate, a metal-insulator-metal element, a hydrogen blocking layer, a passivation layer, a first contact terminal and a second contact terminal is provided. The metal-insulator-metal element is disposed on the substrate. The hydrogen blocking layer is disposed on the metal-insulator-metal element. The passivation layer covers the hydrogen blocking layer and the metal-insulator-metal element. The first contact terminal is electrically connected to the metal-insulator-metal element. The second contact terminal is electrically connected to the metal-insulator-metal element.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: December 13, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chih-Ming Chen
  • Patent number: 11527702
    Abstract: A device includes a substrate, a first layer of getter material, a first electrode, an insulator element, a second electrode, a first input-output electrode, and a second input-output electrode. The first layer of getter material is deposited on the substrate. The first electrode is formed in a first conductive layer deposited on the first layer of getter material. The first layer of getter material has a getter capacity for hydrogen that is higher than the first electrode. The insulator element is formed in a piezoelectric layer deposited on the first electrode. The second electrode is formed in a second conductive layer deposited on the insulator element. The first input-output electrode is conductively connecting to the first layer of getter material. The second input-output electrode is conductively connecting to the second electrode.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: December 13, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Ming Chen, Chung-Yi Yu
  • Publication number: 20220344575
    Abstract: In some embodiments, the present disclosure relates to a processing tool that includes a wafer chuck disposed within a hot plate chamber and having an upper surface configured to hold a semiconductor wafer. A heating element is disposed within the wafer chuck and configured to increase a temperature of the wafer chuck. A motor is coupled to the wafer chuck and configured to rotate the wafer chuck around an axis of rotation extending through the upper surface of the wafer chuck. The processing tool further includes control circuitry coupled to the motor and configured to operate the motor to rotate the wafer chuck while the temperature of the wafer chuck is increased to form a piezoelectric layer from a sol-gel solution layer on the semiconductor wafer.
    Type: Application
    Filed: April 27, 2021
    Publication date: October 27, 2022
    Inventors: Chih-Ming Chen, Chiao-Chun Hsu, Chung-Yi Yu
  • Publication number: 20220336726
    Abstract: The present disclosure relates to a method of forming a device. The method includes depositing a first layer of getter material on a substrate. A first electrode is formed in a first conductive layer deposited on the first layer of getter material. An insulator element is formed in a piezoelectric layer deposited on the first electrode. A second electrode is formed in a second conductive layer deposited on the insulator element. A first input-output electrode is formed to be conductively connected to the first layer of getter material and a second input-output electrode is formed to be conductively connected to the second electrode.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 20, 2022
    Inventors: Chih-Ming Chen, Chung-Yi Yu
  • Publication number: 20220311357
    Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.
    Type: Application
    Filed: June 16, 2022
    Publication date: September 29, 2022
    Inventors: Chiao-Chun Hsu, Chih-Ming Chen, Chung-Yi Yu, Lung Yuan Pan
  • Publication number: 20220293484
    Abstract: An integrated circuit package system includes a substrate, a plurality of leads, N semiconductor devices, N first heat sinks, an encapsulating body, a second heat sink and a plurality of heat-dissipating fins protruding upward from the second heat sink, where N is a natural number. The leads are formed on a lower surface of the substrate. Each of the semiconductor devices is attached on an upper surface of the substrate, and includes a plurality of bonding pads which each is electrically connected to the corresponding lead. Each first heat sink is thermally coupled to a first top surface of the corresponding semiconductor device. The encapsulating body is formed to cover the substrate, the N semiconductor devices and the N first heat sinks such that the leads are exposed. The second heat sink is mounted on the encapsulating body, and is thermally coupled to the N first heat sinks.
    Type: Application
    Filed: March 1, 2022
    Publication date: September 15, 2022
    Inventors: Chun-Lung HUANG, Chih-Ming CHEN
  • Patent number: 11442514
    Abstract: A power supply unit where the main DC voltage output rail is incorporated within the enclosure of the power supply unit and some DC voltage output rails and DC-DC converters are located outside the enclosure of the power supply unit close to or directly at the input of the system board and input of associated system peripheral via integration into a cable harness assembly, to negate the voltage drop on the cable harness assembly, resulting in a lower power loss across the cable harness assembly, leading to an improvement in combined power supply unit and cable harness assembly efficiency.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: September 13, 2022
    Assignee: High Power Electronic Co., Ltd.
    Inventors: Chih-Ming Chen, Feng-Hsun Mo
  • Publication number: 20220263572
    Abstract: An optical network optimization method is disclosed. The optimization method includes training a neural network, adjusting at least one of a plurality of auxiliary output values of a plurality of auxiliary neurons of the neural network, and performing inference with the neural network. A neural network and an attention mechanism are utilized to predict network performance key performance indicator(s) so as to achieve efficient routing optimization, network planning and fast failure recovery.
    Type: Application
    Filed: April 13, 2021
    Publication date: August 18, 2022
    Inventor: Chih-Ming Chen
  • Patent number: 11406605
    Abstract: The present invention is directed to therapeutic compositions for treating pancreatic cancer comprising a cyclohexnone compound and one or more anti-cancer agents.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: August 9, 2022
    Assignee: Golden Biotechnology Corporation
    Inventors: Sheng-Yung Liu, Chih-Ming Chen
  • Patent number: 11387056
    Abstract: A key preloading structure including a base, a set of switches and a set of keys is provided. The set of switches is arranged on the base. The set of keys has a rotating shaft and two actuators. The rotating shaft is assembled on the base. One end of each actuator is fixedly connected to the rotating shaft, and another end is disposed on a switch of the set of switches. Each of the two actuators preloads the set of switches with a force less than a triggering force for starting the set of switches.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: July 12, 2022
    Assignee: BenQ Corporation
    Inventor: Chih-Ming Chen