Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.

Abstract: An integrated circuit package system includes a substrate, a plurality of leads, N semiconductor devices, N first heat sinks, an encapsulating body, a second heat sink and a plurality of heat-dissipating fins protruding upward from the second heat sink, where N is a natural number. The leads are formed on a lower surface of the substrate. Each of the semiconductor devices is attached on an upper surface of the substrate, and includes a plurality of bonding pads which each is electrically connected to the corresponding lead. Each first heat sink is thermally coupled to a first top surface of the corresponding semiconductor device. The encapsulating body is formed to cover the substrate, the N semiconductor devices and the N first heat sinks such that the leads are exposed. The second heat sink is mounted on the encapsulating body, and is thermally coupled to the N first heat sinks.

Abstract: A power supply unit where the main DC voltage output rail is incorporated within the enclosure of the power supply unit and some DC voltage output rails and DC-DC converters are located outside the enclosure of the power supply unit close to or directly at the input of the system board and input of associated system peripheral via integration into a cable harness assembly, to negate the voltage drop on the cable harness assembly, resulting in a lower power loss across the cable harness assembly, leading to an improvement in combined power supply unit and cable harness assembly efficiency.

Abstract: An optical network optimization method is disclosed. The optimization method includes training a neural network, adjusting at least one of a plurality of auxiliary output values of a plurality of auxiliary neurons of the neural network, and performing inference with the neural network. A neural network and an attention mechanism are utilized to predict network performance key performance indicator(s) so as to achieve efficient routing optimization, network planning and fast failure recovery.

Abstract: The present invention is directed to therapeutic compositions for treating pancreatic cancer comprising a cyclohexnone compound and one or more anti-cancer agents.

Abstract: A key preloading structure including a base, a set of switches and a set of keys is provided. The set of switches is arranged on the base. The set of keys has a rotating shaft and two actuators. The rotating shaft is assembled on the base. One end of each actuator is fixedly connected to the rotating shaft, and another end is disposed on a switch of the set of switches. Each of the two actuators preloads the set of switches with a force less than a triggering force for starting the set of switches.

Abstract: In some embodiments, the present disclosure relates to a microelectromechanical system (MEMS) comb actuator including a comb structure. The comb structure includes a support layer having a first material and a plurality of protrusions extending away from a first surface of the support layer in a first direction. The plurality of protrusions are also made of the first material. The plurality of protrusions are separated along a second direction parallel to the first surface of the support layer. The MEMS comb actuator may further include a dielectric liner structure that continuously and completely covers the first surface of the support layer and outer surfaces of the plurality of protrusions. The dielectric liner structure includes a connective portion that continuously connects topmost surfaces of at least two of the plurality of protrusions.

Abstract: The present invention provides methods and compositions for treating atopic dermatitis by cyclohexenone compounds.

Abstract: A multi-body device includes a first machine body, a second machine body, a rotating member, a first magnetic member, a second magnetic member, and a stopper. The second machine body is pivoted to a pivot side of the first machine body. The rotating member is pivoted to the pivot side of the first machine body and located beside the second machine body. The first magnetic member is disposed at the second machine body. The second magnetic member is disposed at a portion of the rotating member corresponding to the first magnetic member. Two corresponding ends of the first magnetic member and the second magnetic member are magnetically repulsive to each other. The stopper is driven by the second machine body and disposed at the pivot side of the first machine body, so as to stretch into or retreat from a rotation path of the rotating member.

Abstract: A monitoring method based on Internet of things (IoT), a fog computing terminal and an Internet of things system are provided. The fog computing terminal downloads an application package from a cloud server, downloads a general model from the cloud server through the application package, sets one or more IoT devices to a device group to receive a plurality of sensing data from the device group, and executes an incremental learning based on the sensing data and the general model to obtain an incrementally learning model for controlling the device group by the incrementally learning model.

Abstract: A wavelength conversion element includes an illumination system, a light valve, and a projection lens. The illumination system is configured to provide an illumination beam. The light valve is disposed on a transmissive path of the illumination beam to convert the illumination beam into an image beam. The projection lens is disposed on a transmissive path of the image beam. The illumination system includes an excitation beam source and the aforementioned wavelength conversion element. The excitation beam source is configured to provide an excitation beam. The wavelength conversion element is disposed on a transmissive path of the excitation beam. A projection apparatus adopting the aforementioned wavelength conversion element is further provided. The substrate has good structural strength and the surface of the substrate has better flatness, so the excitation beam can be accurately focused on the wavelength conversion layer to maintain stable excitation efficiency.

Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a nonconductive support element, and an accessory element. The feeding radiation element has a feeding point. The first radiation element includes a branch portion and a widening portion. The feeding radiation element is coupled through the first radiation element to a ground voltage. The second radiation element is coupled to the feeding radiation element and the first radiation element. The nonconductive support element carries the feeding radiation element, the first radiation element, and the second radiation element. The accessory element includes a nonconductive housing and an internal metal element. The branch portion and widening portion of the first radiation element are disposed on the nonconductive housing of the accessory element.

Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a nonconductive support element, and an accessory element. The feeding radiation element has a feeding point. The first radiation element includes a branch portion and a widening portion. The feeding radiation element is coupled through the first radiation element to a ground voltage. The second radiation element is coupled to the feeding radiation element and the first radiation element. The nonconductive support element carries the feeding radiation element, the first radiation element, and the second radiation element. The accessory element includes a nonconductive housing and an internal metal element. The branch portion and widening portion of the first radiation element are disposed on the nonconductive housing of the accessory element.

Abstract: In accordance with some embodiments, a method for processing semiconductor wafer is provided. The method includes introducing a first processing gas of an atomic layer deposition (ALD) process on the semiconductor substrate in a chamber; introducing a second processing gas of the ALD process on the semiconductor substrate in the chamber; creating an exhaust flow from the chamber; monitoring a concentration of the first processing gas of the ALD process in the exhaust flow; in response to the monitored concentration of the first processing gas of the ALD process in the exhaust flow, introducing a cleaning gas into the chamber.

Abstract: The embodiments of the disclosure provide a method for selecting a task network, a system and a method for determining actions based on sensing data. The method of the embodiments of the disclosure includes: mapping the sensing data into an input feature vector; feeding the input feature vector into a specific task network to generate an output feature vector via the specific task network, in which the specific task network is trained based on a plurality of first individuals and a plurality of second individuals, the first individuals belong to a first population, the second individuals belong to a second population, and the first individuals and the second individuals are evolved via a coevolution process; and determining an output action according to the output feature vector, and setting a second specific individual based on the output action, in which the second specific individual belongs to the second population.

Abstract: Various embodiments of the present disclosure are directed towards an image sensor with a passivation layer for dark current reduction. A device layer overlies a substrate. Further, a cap layer overlies the device layer. The cap and device layers and the substrate are semiconductor materials, and the device layer has a smaller bandgap than the cap layer and the substrate. For example, the cap layer and the substrate may be silicon, whereas the device layer may be or comprise germanium. A photodetector is in the device and cap layers, and the passivation layer overlies the cap layer. The passivation layer comprises a high k dielectric material and induces formation of a dipole moment along a top surface of the cap layer.

Abstract: A data capturing device and a data calculation system and method are provided. The data capturing device transmits sensing data to a computing device, and receives a machine learning model and a library corresponding to a current scene from the computing device. The data capturing device runs the machine learning model to capture feature data from the sensing data, runs the library to convert a requirement into a service task, and then transmits the feature data and the service task.

Abstract: In accordance with some embodiments, a method for processing semiconductor wafer is provided. The method includes loading a semiconductor wafer into a chamber. The method also includes creating an exhaust flow from the chamber. The method further includes depositing a film on the semiconductor wafer by supplying a processing gas into the chamber. In addition, the method includes detecting, with a use of a gas sensor, a concentration of the processing gas in the exhaust flow and generating a detection signal according to a result of the detection. The method further includes supplying a cleaning gas into the processing chamber for a time period after the film is formed on the semiconductor wafer. The time period is determined based on the detection signal.

Abstract: The present disclosure provides a packaging method, including: providing a first semiconductor substrate; forming a bonding region on the first semiconductor substrate, wherein the bonding region of the first semiconductor substrate includes a first bonding metal layer and a second bonding metal layer; providing a second semiconductor substrate having a bonding region, wherein the bonding region of the second semiconductor substrate includes a third bonding layer; and bonding the first semiconductor substrate to the second semiconductor substrate by bringing the bonding region of the first semiconductor substrate in contact with the bonding region of the second semiconductor substrate; wherein the first and third bonding metal layers include copper (Cu), and the second bonding metal layer includes Tin (Sn). An associated packaging structure is also disclosed.

Abstract: A system and method for question-based content answering that can include training a query-content model; indexing a collection of media content data forming indexed content; receiving a query input through a computer implemented computer interface; applying a retrieval model to the query input and indexed content and determining candidate content segment results, which may include: retrieving an initial set of candidate content segments by performing a keyword search of the query input on the indexed content, and ranking, based in part on language modeling using the query-content model, the initial set of candidate content segments into the candidate content segment results; and presenting the candidate content segment results in the computer interface.