Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A jig structure for manufacturing heat dissipation unit includes a main body, which internally defines a chamber and has a top forming an upper side thereof. The top defines at least one opening, on which at least one silicon dioxide layer is provided. The chamber is in a vacuum-tight state or maintains a positive pressure inert gas atmosphere therein. The jig structure for manufacturing heat dissipation unit can be used with a laser machining tool to provide a better environment and increased flexibility for laser machining or laser welding in manufacturing a heat dissipation unit.

Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.

Abstract: A heat dissipation component is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. Such that, the connection and sealing of the welded first and second metal plate bodies can be enhanced.

Abstract: A wet suit includes a composite cloth which includes an outer tarpaulin, an inner tarpaulin and a plurality of heat insulation units. The inner tarpaulin is located on the inner side of the outer tarpaulin and connected to the outer tarpaulin. A plurality of heat insulation units are located between the outer tarpaulin and the inner tarpaulin.

Abstract: A method of controlling a battery-powered remote controller to decrease a duty cycle to allow continued operations despite the quantity of the battery is bad determines a drop in voltage of the battery in standby mode as voltage of the battery is being read. When receiving a command to activate a voice function, determining whether the drop in voltage in standby mode is greater than or equal to a preset value. If yes, the method then determines whether the drop in voltage falls in a preset range. If yes, the method regulates a duty cycle of the pulse signal activating the voice function, and activates the voice function as required. A remote controller and a non-transitory storage medium are also provided.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: Novel processes for the preparation of a compound of Formula I-2 substantially free of the 5,6-trans isomer: wherein R2, R3 and R4 are as defined in the specification are provided. Novel intermediates for the preparations of isomer free Prostaglandins and derivatives thereof are also provided.

Abstract: A heat dissipation component manufacturing method is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. The heat dissipation component manufacturing method employs fillet welding to directly perpendicularly weld and connect the first and second metal plate bodies so as to enhance the connection and sealing of the welded first and second metal plate bodies.

Abstract: A heat dissipation component is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. Such that, the connection and sealing of the welded first and second metal plate bodies can be enhanced.

Abstract: A heat dissipation unit manufacturing method is disclosed. The heat dissipation unit has a main body formed of a first and a second metal plate member, which together define a sealed chamber between them. The chamber has a wick structure and a working fluid provided therein, and a lip portion formed along an outer peripheral edge thereof. The lip portion includes a sinter-welded section perpendicularly connects the first metal plate member to the second metal plate member. In the heat dissipation unit manufacturing method, the first and the second metal plate member are joined along their peripheral edges by lap joint laser welding, in which a laser beam directly perpendicularly passes through the first metal plate member into one third to two thirds of a thickness of the second metal plate member, so that the two metal plate members are more firmly joined to create upgraded vacuum-tightness between them.

Abstract: A jig structure for manufacturing heat dissipation unit includes a main body, which internally defines a chamber and has a top forming an upper side thereof. The top defines at least one opening, on which at least one silicon dioxide layer is provided. The chamber is in a vacuum-tight state or maintains a positive pressure inert gas atmosphere therein. The jig structure for manufacturing heat dissipation unit can be used with a laser machining tool to provide a better environment and increased flexibility for laser machining or laser welding in manufacturing a heat dissipation unit.

Abstract: In one embodiment, compositions and methods are provided for the detection and/or quantification of epigenetic modifications in DNA. In particular aspects, probes are provided comprising fluorescent metal nanocluster beacons, which can selectively detect nucleic acids including an epigenetic modification.

Abstract: Systems and methods for particle tracking using spatiotemporal offset light beams. In exemplary embodiments, the optical systems and methods can be used with conventional two-photon microscopy equipment to perform high speed, high precision, and deep tissue three-dimensional single-particle tracking. Exemplary embodiments can be configured for single-molecule studies of biological diffusion and transport processes.

Abstract: The invention provides a chemical-mechanical polishing composition comprising (a) abrasive particles, b) a removal rate inhibitor selected from (I) a surfactant comprising a polyoxyalkylene functional group and a sulfonate functional group, (II) a surfactant comprising a polyoxyalkylene functional group and a sulfate functional group, (III) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfonate functional group, and (IV) a first surfactant comprising a polyoxyalkylene functional group and a second surfactant comprising a sulfate functional group, and (c) an aqueous carrier. The invention also provides a method of chemically-mechanically polishing a substrate comprising TiN and SiN with the inventive chemical-mechanical polishing composition.

Abstract: An integrated circuit (IC) structure includes a plurality of driver pins, each driver pin positioned at a driver pin level and oriented in a driver pin direction, and a plurality of layers of metal segment arrays. Each layer of metal segment arrays has a layer direction and includes two parallel metal segments oriented in the layer direction. The layer direction of a lowermost layer is perpendicular to the driver pin direction, the layer direction of each additional layer is perpendicular to the layer direction of a layer immediately below the additional layer, and each metal segment of a topmost layer is electrically connected to each driver pin of the plurality of driver pins.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A heat dissipation device includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

Abstract: A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets, which are subjected to a heat treatment before undergoing mechanical processing, plastic working and surface modification. With these arrangements, the titanium metal sheets can be freely plastically deformed and possess a capillary force, and can therefore be used in place of the conventional copper material to serve as a material for making heat dissipation devices, and the heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.