Patents by Inventor Chih Yeh

Chih Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for sending a keycode of a non-keyboard apparatus
    Patent number: 8788730
    Abstract: A method for sending a keycode of a non-keyboard apparatus is provided and includes the following steps. The non-keyboard apparatus determines the connection status between itself and a computer by the time required for device enumeration. Then, according to a value generated from device enumeration, the non-keyboard apparatus identifies the kind of operating system running on the computer. The non-keyboard apparatus sends to the computer a keycode corresponding to the Num Lock key and/or a keycode corresponding to the Caps Lock key such that a sending time and a feedback time are obtained. A parameter related to the efficiency of the computer is then calculated based.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: July 22, 2014
    Assignee: Tenx Technology Inc.
    Inventors: Cheng-Hung Huang, Wei-Chih Yeh, Bo-Wen Cheng
  • HEAT DISSIPATION DEVICE
    Publication number: 20140174704
    Abstract: A heat dissipation device includes a first board body and a second board body. The first board body has a first face and a second face. The second face is formed with a rough structure. The second board body has a third face and a fourth face. The fourth face is mated with the second face and covered by the second face. The second and fourth faces together define a chamber. A working fluid is filled in the chamber. The rough structure is coated with a coating. By means of the rough structure and the coating, the cost for the heat dissipation device is reduced and the thermal resistance of the heat dissipation device is lowered.
    Type: Application
    Filed: December 20, 2012
    Publication date: June 26, 2014
    Applicant: ASIA VITAL COMPONENTS CO., LTD.
    Inventor: Chih-Yeh Lin
  • Conductive material formed using light or thermal energy, method for forming the same and nano-scale composition
    Patent number: 8715536
    Abstract: An electrically conductive material includes a plurality of nanowires and a plurality of nanoconnectors. The ratio by weight of the plurality of nanowires to the plurality of nanoconnectors is in a range of from 1:9 to 9:1. Nanoconnectors can be heated by thermal energy or light energy so that the nanoconnectors can be closely interconnected to each other and to nanowires, resulting in significant increase of the electrical conductivity of the electrically conductive material.
    Type: Grant
    Filed: May 27, 2010
    Date of Patent: May 6, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Yu Ming Wang, Yion Ni Liu, Yeu Kuen Wei, Chen Chih Yeh, Ming Jyh Chang
  • Circuit for performing motion estimation and motion compensation
    Patent number: 8654852
    Abstract: Circuits for performing motion estimation (ME) and motion compensation (MC) are disclosed. In the ME circuit, rows of a first register are correspondingly coupled to rows of a first memory that stores a search range of a first frame, and rows of a second register are correspondingly coupled to rows of a second memory that stores a search range of a second frame. Block-matching metric calculations are performed through the search range to obtain a motion vector (MV). In the MC circuit, first multiplexers couples each row of a first register to corresponding row of a first memory, and each macro block (MB) may accordingly be selected from the first memory and loaded into the first register. Second multiplexers couples each row of a second register to corresponding row of a second memory, and each MB may accordingly be selected from the second memory and loaded into the second register.
    Type: Grant
    Filed: June 7, 2010
    Date of Patent: February 18, 2014
    Assignee: Himax Technologies Ltd.
    Inventors: Yung-Sheng Tseng, Chih-Yeh Tseng
  • HEAT DISSIPATION STRUCTURE FOR HEAT DISSIPATION UNIT
    Publication number: 20130306274
    Abstract: A heat dissipation structure for heat dissipation unit includes a heat dissipation unit main body that internally defines a chamber, and the chamber is internally provided with at least a layer of nanoscale threadlike bodies and a working fluid. The layer of nanoscale threadlike bodies is provided on an inner wall surface of the chamber. By providing the layer of nanoscale threadlike bodies in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation unit, enabling the latter to have upgraded heat transfer performance.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Inventors: Hsiu-Wei Yang, Chih-Yeh Lin
  • HEAT DISSIPATION STRUCTURE FOR HEAT DISSIPATION DEVICE
    Publication number: 20130306275
    Abstract: A heat dissipation structure for heat dissipation device includes a heat dissipation device main body that internally defines a chamber, and the chamber is internally provided with at least a whisker layer and a working fluid. The whisker layer is provided on an inner wall surface of the chamber. By providing the whisker layer in the chamber, it is able to provide largely upgraded capillary effect in the chamber to thereby increase the vapor/liquid cycling efficiency of the working fluid in the heat dissipation device, enabling the latter to have upgraded heat transfer performance.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Inventors: Hsiu-Wei Yang, Chih-Yeh Lin
  • Reduce mask overlay error by removing film deposited on blank of mask
    Patent number: 8589828
    Abstract: A method for reducing layer overlay errors by synchronizing the density of mask material in the frame area across the masks in a set is disclosed. An exemplary method includes creating a mask design database corresponding to a mask and containing a die area with one or more dies and a frame area outside the die area. Fiducial features within the frame area are identified, and from the fiducial features, an idle frame area is identified. A reference mask design, which corresponds to a reference mask configured to be aligned with the mask, is used to determine a reference density for the idle frame area. The idle frame area of the mask design database is modified to correspond to the reference density. The modified mask design database is then available for further use including manufacturing the mask.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: November 19, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsin-Chang Lee, Chia-Jen Chen, Lee-Chih Yeh, Anthony Yen
  • Processes for the preparation of optically active cyclopentenones and cyclopentenones prepared therefrom
    Patent number: 8546114
    Abstract: The present invention relates to novel processes for preparing optically active Cyclopentenones of Formula (R)-1, which are useful for the preparation of Prostaglandins and analogs thereof. The invention also relates to novel Cyclopentenones prepared from the processes.
    Type: Grant
    Filed: January 18, 2006
    Date of Patent: October 1, 2013
    Assignee: Chirogate International Inc.
    Inventors: Yu-Chih Yeh, Ming-Kun Hsu, Shih-Yi Wei
  • Supplying power to integrated circuits using a grid matrix formed of through-silicon vias
    Patent number: 8549460
    Abstract: An integrated circuit structure includes a chip including a substrate and a power distribution network. The power distribution network includes a plurality of power through-silicon vias (TSVs) penetrating the substrate, wherein the plurality of power TSVs forms a grid; and a plurality of metal lines in a bottom metallization layer (M1), wherein the plurality of metal lines couples the plurality of power TSVs to integrated circuit devices on the substrate.
    Type: Grant
    Filed: July 26, 2012
    Date of Patent: October 1, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Oscar M. K. Law, Kuo H. Wu, Wei-Chih Yeh
  • HIGHLY ADHESIVE POLYIMIDE COPPER CLAD LAMINATE AND METHOD OF MAKING THE SAME
    Publication number: 20130244000
    Abstract: The present invention is related to a chip on film package, comprising a polyimide copper clad laminate and the process of making the same. The laminate comprises a layer of polyimide and a layer of copper foil, wherein the polyimide layer is made from a polyimide precursor comprising a diamine monomer, a dianhydride monomer, an organic solvent and a silane coupling agent having one or more organic functional groups, and the copper foil is a smooth copper foil. The polyimide layer of the present invention provides high transparency, good dimensional stability, good mechanical properties and good adhesion to the copper foil.
    Type: Application
    Filed: September 4, 2012
    Publication date: September 19, 2013
    Applicant: E I DU PONT DE NEMOURS AND COMPANY
    Inventors: Yu-Jean Chen, Brian C. Auman, Sheng-Yu Huang, Tsutomu Mutoh, Ming-Te We, Yu-Chih Yeh
  • REDUCE MASK OVERLAY ERROR BY REMOVING FILM DEPOSITED ON BLANK OF MASK
    Publication number: 20130219350
    Abstract: A method for reducing layer overlay errors by synchronizing the density of mask material in the frame area across the masks in a set is disclosed. An exemplary method includes creating a mask design database corresponding to a mask and containing a die area with one or more dies and a frame area outside the die area. Fiducial features within the frame area are identified, and from the fiducial features, an idle frame area is identified. A reference mask design, which corresponds to a reference mask configured to be aligned with the mask, is used to determine a reference density for the idle frame area. The idle frame area of the mask design database is modified to correspond to the reference density. The modified mask design database is then available for further use including manufacturing the mask.
    Type: Application
    Filed: February 17, 2012
    Publication date: August 22, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsin-Chang Lee, Chia-Jen Chen, Lee-Chih Yeh, Anthony Yen
  • HEAT DISSIPATING DEVICE
    Publication number: 20130206369
    Abstract: A heat dissipating device includes a chamber body, a heat sink, a pipe, a first capillary structure and N vapor channels. The chamber body has an evaporation chamber and a compensation chamber, wherein the evaporation chamber has a vapor outlet and the compensation chamber has a liquid inlet. The heat sink is disposed on an outer wall of a first side of the chamber body and at least covers the compensation chamber. The pipe is installed within the heat sink, wherein a first end of the pipe is connected to the vapor outlet and a second end of the pipe is connected to the liquid inlet. The first capillary structure is formed in the evaporation chamber. The N vapor channels are formed in the first capillary structure. The N vapor channels and the compensation chamber are isolated by the first capillary structure.
    Type: Application
    Filed: February 13, 2012
    Publication date: August 15, 2013
    Inventors: Wei-I Lin, Chien-Chih Yeh, Wen-Shiang Chen, Chun-Hung Lin
  • THIN HEAT PIPE
    Publication number: 20130175008
    Abstract: A thin heat pipe includes a thin hollow tube and a capillary structure. The capillary structure is formed in at least half of an inner wall of the thin hollow tube by a chemical etching process.
    Type: Application
    Filed: January 10, 2012
    Publication date: July 11, 2013
    Inventors: Chien-Chih Yeh, Wen-Shiang Chen, Chian Tao, Chun-Hung Lin
  • Probe and method for DNA detection
    Patent number: 8476014
    Abstract: A hybridization probe containing two linear strands of DNA lights up upon hybridization to a target DNA using silver nanoclusters that have been templated onto one of the DNA strands. Hybridization induces proximity between the nanoclusters on one strand and an overhang on the other strand, which results in enhanced fluorescence emission from the nanoclusters.
    Type: Grant
    Filed: February 22, 2011
    Date of Patent: July 2, 2013
    Assignee: Los Alamos National Security, LLC
    Inventors: Hsin-Chih Yeh, James Henry Werner, Jaswinder Kumar Sharma, Jennifer Suzanne Martinez
  • Distance measuring device
    Patent number: 8390792
    Abstract: A distance measuring device is provided. The distance measuring device includes: a distance sensing unit, for sensing a distance value of a target object; a drive unit, for driving the distance sensing unit to rotate according to a rotation angle; and a compensation unit, for providing a compensation value according to the rotation angle and obtaining an actual distance according to the compensation value and the distance value.
    Type: Grant
    Filed: December 30, 2009
    Date of Patent: March 5, 2013
    Assignee: MSI Computer (Shenzhen) Co., Ltd.
    Inventors: Bi-Jung Rung, Yi-Chih Yeh, Li-Lu Chen, Yung-Shen Lee
  • Processes for preparing cyclopentenones and cyclopentenones for the synthesis of benzindene prostaglandins
    Patent number: 8350090
    Abstract: The present invention provides novel processes of preparing racemic and optically active cyclopentenones of Formula I: The invention also provides novel cyclopentenones of formula I in racemic or optically active form.
    Type: Grant
    Filed: August 24, 2011
    Date of Patent: January 8, 2013
    Assignee: Chirogate International Inc.
    Inventors: Shih-Yi Wei, Wan-Chun Chang, Yu-Chih Yeh
  • GAPLESS HEAT PIPE COMBINATION STRUCTURE AND COMBINATION METHOD THEREOF
    Publication number: 20120312508
    Abstract: A gapless heat pipe combination structure and a combination method thereof are provided. An open slot being open is formed on a bottom surface of a heat dissipation device, an adhesive layer is disposed on a surface of grooves in the open slot, and a plurality of heat pipes is provided, which are adhered to the surface of the grooves closely through the adhesive layer respectively. A jig is used to press heating segments of the heat pipes at least once, so that the heating segments exposed from the open slot form a plane heating surface, and the heating surface of the heat pipes completely contact with an area of a heat source, thereby improving overall thermal conduction performance.
    Type: Application
    Filed: June 8, 2011
    Publication date: December 13, 2012
    Inventor: Chih-Yeh SHEN
  • Supplying Power to Integrated Circuits Using a Grid Matrix Formed of Through-Silicon Vias
    Publication number: 20120290996
    Abstract: An integrated circuit structure includes a chip including a substrate and a power distribution network. The power distribution network includes a plurality of power through-silicon vias (TSVs) penetrating the substrate, wherein the plurality of power TSVs forms a grid; and a plurality of metal lines in a bottom metallization layer (M1), wherein the plurality of metal lines couples the plurality of power TSVs to integrated circuit devices on the substrate.
    Type: Application
    Filed: July 26, 2012
    Publication date: November 15, 2012
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Oscar M. K. Law, Kuo H. Wu, Wei-Chih Yeh
  • Iron-based alloy for a golf club head
    Patent number: 8287403
    Abstract: An iron-based alloy for a golf club head includes: chromium in an amount ranging from 16.3 to 17.2 wt %; nickel in an amount ranging from 5.8 to 6.5 wt %; nitrogen in an amount ranging from 0.10 to 0.20 wt %; carbon in an amount ranging from 0.01 to 0.12 wt %; silicon in an amount ranging from 0.3 to 1.2 wt %; manganese in an amount ranging from 0.3 to 1.2 wt %; and a balance of iron and impurities, based on a total weight of the iron-based alloy. The alloy has a duplex-phase microstructure including a martensite phase and 10 to 30 percent austenite phase, and has a tensile strength greater than 120 Ksi and an elongation greater than 35%.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: October 16, 2012
    Assignee: O-Ta Precision Industry Co., Ltd.
    Inventors: Chih-Yeh Chao, Chuan-Hsien Chang, Jui-Ming Su
  • Through silicon via (TSV) wire bond architecture
    Patent number: 8264067
    Abstract: A through silicon via architecture for integrated circuits is provided. The integrated circuit (IC) includes a substrate with a top surface and a bottom surface with circuitry formed on the top surface, a plurality of bonding pads formed along a periphery of the bottom surface, and a backside metal layer (BML) formed on the bottom surface and electrically coupled to a second subset of bonding pads in the plurality of bonding pads. A first subset of bonding pads in the plurality of bonding pads is electrically coupled to circuitry on the top surface with through silicon vias (TSV). The BML distributes electrical signals provided by the second subset of bonding pads.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: September 11, 2012
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Oscar M. K. Law, Kuo H. Wu, Wei-Chih Yeh