Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.

Abstract: A manufacturing method of heat dissipation unit is disclosed. The heat dissipation unit is mainly composed of two titanium metal plate bodies. The titanium metal plate bodies are heat-treated, whereby the titanium metal plate bodies can be mechanical processed, shaped and surface-modified. Accordingly, the titanium metal can be freely shaped and provide capillary attraction. In this case, the titanium metal plate bodies can be used as the material of the heat dissipation unit instead of the conventional copper plate bodies to greatly reduce the weight and enhance the heat dissipation performance.

Abstract: Novel processes for the preparation of a compound of Formula I-2 substantially free of the 5,6-trans isomer: wherein R2, R3 and R4 are as defined in the specification are provided. Novel intermediates for the preparations of isomer free Prostaglandins and derivatives thereof are also provided.

Abstract: An integrated circuit (IC) structure includes a plurality of driver pins, each driver pin positioned at a driver pin level and oriented in a driver pin direction, and a plurality of layers of metal segment arrays. Each layer of metal segment arrays has a layer direction and includes two parallel metal segments oriented in the layer direction. The layer direction of a lowermost layer is perpendicular to the driver pin direction, the layer direction of each additional layer is perpendicular to the layer direction of a layer immediately below the additional layer, and each metal segment of a topmost layer is electrically connected to each driver pin of the plurality of driver pins.

Abstract: Novel processes for the preparation of a compound of Formula I-2 substantially free of the 5,6-trans isomer: wherein R2, R3 and R4 are as defined in the specification are provided. Novel intermediates for the preparations of isomer free Prostaglandins and derivatives thereof are also provided.

Abstract: An integrated circuit (IC) structure includes a plurality of driver pins at a driver pin level and oriented in a driver pin direction. Each layer of a plurality of layers of metal segment arrays includes two parallel metal segments oriented in a layer direction. The layer direction of a lowermost layer is perpendicular to the driver pin direction, and the layer direction of each additional layer is perpendicular to the layer direction of a layer immediately below the additional layer. The IC structure also includes a plurality of via arrays, each via array including two vias positioned at locations where one or more metal segments of a corresponding overlying layer overlap one or more of the two metal segments of a layer immediately below the via array or the plurality of driver pins.

Abstract: Novel processes for the preparation of a compound of Formula I-2 substantially free of the 5,6-trans isomer: wherein R2, R3 and R4 are as defined in the specification are provided. Novel intermediates for the preparations of isomer free Prostaglandins and derivatives thereof are also provided.

Abstract: According to embodiments of the disclosure, a thermal needle probe is provided. The thermal needle probe may include a heater, a cooler, a temperature measuring element, a heat conduction element and a processor. The heater is configured to heat an object. The cooler is configured to cool the object. The temperature measuring element is configured to measure a temperature raising curve of the object and a temperature dropping curve of the object. The heat conduction element is configured to conduct heat between the heater and the object. The processor is configured to determine a thermal property of the object according to at least one of the temperature raising curve and the temperature dropping curve.

Abstract: Novel processes for the preparation of a compound of Formula I-2 substantially free of the 5,6-trans isomer: wherein R2, R3 and R4 are as defined in the specification are provided. Novel intermediates for the preparations of isomer free Prostaglandins and derivatives thereof are also provided.

Abstract: An integrated circuit (IC) structure includes a plurality of driver pins at a driver pin level and oriented in a driver pin direction. Each layer of a plurality of layers of metal segment arrays includes two parallel metal segments oriented in a layer direction. The layer direction of a lowermost layer is perpendicular to the driver pin direction, and the layer direction of each additional layer is perpendicular to the layer direction of a layer immediately below the additional layer. The IC structure also includes a plurality of via arrays, each via array including two vias positioned at locations where one or more metal segments of a corresponding overlying layer overlap one or more of the two metal segments of a layer immediately below the via array or the plurality of driver pins.

Abstract: Systems and methods for particle tracking using spatiotemporal offset light beams. In exemplary embodiments, the optical systems and methods can be used with conventional two-photon microscopy equipment to perform high speed, high precision, and deep tissue three-dimensional single-particle tracking. Exemplary embodiments can be configured for single-molecule studies of biological diffusion and transport processes.

Abstract: An image building module includes an image builder, a signal-shielding flexible film, and a signal shielding cover. The image builder includes a first image capturing element and a processing chip. The first image capturing element is used for capturing a first image. The processing chip is used for processing the first image. The signal-shielding flexible film covers the processing chip. The signal shielding cover covers the image builder and the signal-shielding flexible film. The signal shielding cover has a first through hole exposing the first image capturing element.

Abstract: Novel processes for the preparation of a compound of Formula I-2 substantially free of the 5,6-trans isomer: wherein R2, R3 and R4 are as defined in the specification are provided. Novel intermediates for the preparations of isomer free Prostaglandins and derivatives thereof are also provided.

Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) colloidal silica particles that are surface modified with metal ions selected from Mg, Ca, Al, B, Be, and combinations thereof, and wherein the colloidal silica particles have a surface hydroxyl group density of from about 1.5 hydroxyls per nm2 to about 8 hydroxyls per nm2 of a surface area of the particles, (b) an anionic surfactant, (c) a buffering agent, and (d) water, wherein the polishing composition has a pH of about 2 to about 7, and wherein the polishing composition is substantially free of an oxidizing agent that oxidizes a metal. The invention further provides a method of chemically-mechanically polishing a substrate with the inventive chemical-mechanical polishing composition. Typically, the substrate contains silicon nitride, silicon oxide, and/or polysilicon.

Abstract: An integrated circuit structure includes a plurality of power or ground rails for an integrated circuit, the plurality of power or ground rails vertically separated on a plane, a plurality of functional cells between the plurality of power rails or between the plurality of ground rails or both, and a jumper connection between the vertically separated power rails or ground rails, the jumper connection within a vertically aligned gap among the plurality of functional cells. A method of mitigating IR drop and electromigration affects in an integrated circuit includes forming a plurality of power rails or ground rails, each of the power rails or ground rails on separate vertical levels of a plane of an integrated circuit layout and connecting with a jumper connection at least two power rails or two ground rails, the jumper connection within a vertically aligned gap among cells of the integrated circuit.

Abstract: A chemical mechanical polishing (CMP) method for removal of a metal layer deposited over a titanium nitride (TiN) or titanium/titanium nitride (Ti/TiN) barrier layer is described herein. The method comprises abrading the metal layer with an acidic CMP composition to expose the underlying TiN or Ti/TiN layer, wherein the TiN or Ti/N layer is polished at a low rate due to the presence of a surfactant inhibitor. The acidic CMP composition comprises a particulate abrasive (e.g., silica, alumina) suspended in a liquid carrier containing a surfactant selected from the group consisting of an anionic surfactant, a nonionic surfactant, cation surfactants, and a combination thereof.

Abstract: A golf club head and a low density alloy thereof are provided. The low density alloy has a balanced weight percentage of titanium, 10˜11 wt % aluminum, and trace elements including (C+N+O) <0.2 wt %, silicon <0.2 wt %, and (Fe+Cr+V+Mo) <0.4 wt %. The golf club head has a tensile strength of 90˜110 kips/in2, and a density of 4.18˜4.30 g/cm3. Through heat treatment at a high temperature of 925±25° C., the precipitation or ?2 phase of the interfacial interphase can be avoided, and thus the embrittlement phenomena can be improved.

Abstract: An integrated circuit structure includes a plurality of power or ground rails for an integrated circuit, the plurality of power or ground rails vertically separated on a plane, a plurality of functional cells between the plurality of power rails or between the plurality of ground rails or both, and a jumper connection between the vertically separated power rails or ground rails, the jumper connection within a vertically aligned gap among the plurality of functional cells. A method of mitigating IR drop and electromigration affects in an integrated circuit includes forming a plurality of power rails or ground rails, each of the power rails or ground rails on separate vertical levels of a plane of an integrated circuit layout and connecting with a jumper connection at least two power rails or two ground rails, the jumper connection within a vertically aligned gap among cells of the integrated circuit.

Abstract: Novel processes for the preparation of a compound of Formula I-2 substantially free of the 5,6-trans isomer: wherein R2, R3 and R4 are as defined in the specification are provided. Novel intermediates for the preparations of isomer free Prostaglandins and derivatives thereof are also provided.

Abstract: According to embodiments of the disclosure, a thermal needle probe is provided. The thermal needle probe may include a heater, a cooler, a temperature measuring element, a heat conduction element and a processor. The heater is configured to heat an object. The cooler is configured to cool the object. The temperature measuring element is configured to measure a temperature raising curve of the object and a temperature dropping curve of the object. The heat conduction element is configured to conduct heat between the heater and the object. The processor is configured to determine a thermal property of the object according to at least one of the temperature raising curve and the temperature dropping curve.