Patents by Inventor Chin Yu

Chin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230395468
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Application
    Filed: August 2, 2023
    Publication date: December 7, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Publication number: 20230381444
    Abstract: An apparatus is provided to prevent water ingress to a medical device with a housing. Such water ingress may originate, for example, from a connected humidifier. The apparatus consists of an endcap including at least one aperture for selective coupling with a compatible accessory. The end cap is constructed from panels which cooperate to provide an internal fluid passageway for diverting water from the point of ingress to the exterior of the housing.
    Type: Application
    Filed: October 29, 2021
    Publication date: November 30, 2023
    Inventors: Tzu-Chin YU, Simon Robert CORK, Bing LUO, Millen James RATH-MAY
  • Publication number: 20230361156
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation element partially covering the magnetic element. The semiconductor device structure further includes a conductive feature over the isolation element.
    Type: Application
    Filed: July 17, 2023
    Publication date: November 9, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Cheng CHEN, Wei-Li HUANG, Chien-Chih KUO, Hon-Lin HUANG, Chin-Yu KU, Chen-Shien CHEN
  • Patent number: 11810492
    Abstract: The embodiments of the disclosure provide a method for determining an ambient light luminance, a host, and a computer readable storage medium. The method includes: obtaining a first frame and a second frame, wherein the first frame comprises a plurality of first regions of interest (ROI), the second frame comprises a plurality of second ROIs, and the first ROIs respectively correspond to the second ROIs; in response to determining that the first ROIs comprise at least one specific ROI satisfying a predetermined condition and at least one first candidate ROI, obtaining at least one second candidate ROI among the second ROIs, wherein the at least one second candidate ROI respectively correspond to the at least one specific ROI; and determining the ambient light luminance based on the at least one first candidate ROI and the at least one second candidate ROI.
    Type: Grant
    Filed: May 4, 2022
    Date of Patent: November 7, 2023
    Assignee: HTC Corporation
    Inventors: Chia-Wei Yu, Ping-Chang Hsieh, Chin-Yu Chang
  • Patent number: 11791042
    Abstract: Systems and methods permit generation of a digital scan of a user's face such as for obtaining of a patient respiratory mask, or component(s) thereof, based on the digital scan. The method may include: receiving video data comprising a plurality of video frames of the user's face taken from a plurality of angles relative to the user's face, generating a three-dimensional representation of a surface of the user's face based on the plurality of video frames, receiving scale estimation data associated with the received video data, the scale estimation data indicative of a relative size of the user's face, and scaling the digital three-dimensional representation of the user's face based on the scale estimation data. In some aspects, the scale estimation data may be derived from motion information collected by the same device that collects the scan of the user's face.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: October 17, 2023
    Inventors: Simon Michael Lucey, Benjamin Peter Johnston, Priyanshu Gupta, Tzu-Chin Yu
  • Publication number: 20230325579
    Abstract: A method includes generating a diffraction map from a plurality of target patterns, generating a favorable zone and an unfavorable zone from the diffraction map, placing a plurality of sub-resolution patterns in the favorable zone, and performing a plurality of geometric operations on the plurality of sub-resolution patterns to generate modified sub-resolution patterns. The modified sub-resolution patterns extend into the favorable zone, and are away from the unfavorable zone.
    Type: Application
    Filed: June 14, 2023
    Publication date: October 12, 2023
    Inventors: Shih-Ming Chang, Shinn-Sheng Yu, Jue-Chin Yu, Ping-Chieh Wu
  • Patent number: 11784627
    Abstract: A Lamb wave resonator includes a piezoelectric material layer, a first finger electrode, a second finger electrode, at least two floating electrodes, and at least two gaps. The first finger electrode is disposed on one side of the piezoelectric material layer and includes a first main portion and first fingers. The second finger electrode is disposed on the side of the piezoelectric material layer and includes a second main portion and second fingers. The first fingers are parallel to and alternately arranged with the second fingers. The floating electrodes are disposed between each first finger and each second finger, and the gaps are disposed at two ends of each floating electrode, respectively.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: October 10, 2023
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Chin-Yu Chang, Yen-Lin Chen, Chien-Hui Li, Tai-I Yang, Yung-Hsiang Chen
  • Publication number: 20230309251
    Abstract: An information processing system includes a housing, a circuit board in the housing, a functional module in the housing, and a module fixing device in the housing. The functional module is inserted into the circuit board. The module fixing device is connected to the functional module and is connected to the circuit board. The module fixing device comprises a clamping member and an elastic member. The clamping member is movably connected to the circuit board in a first direction and a second direction opposite to the first direction, the clamping member comprises a first clamping portion to clamp the functional module. The elastic member is connected to the clamping member, the elastic member is deformable in the first direction to drive the clamping member to move in the first direction to clamp the functional module.
    Type: Application
    Filed: July 14, 2022
    Publication date: September 28, 2023
    Inventors: TUNG-HO SHIH, HUNG-WEI CHEN, KUAN-CHIN YU, MING-HENG LU
  • Patent number: 11768782
    Abstract: An electrical circuit device includes a signal bus comprising a plurality of parallel signal paths and a calibration circuit, operatively coupled with the signal bus. The calibration circuit can perform operations including determining a representative duty cycle for a plurality of signals transferred via the plurality of parallel signal paths, the plurality of signals comprising a plurality of duty cycles and comparing the representative duty cycle for the plurality of signals transferred via the plurality of parallel signal paths to a reference value to determine a comparison result. The calibration circuit can perform further operations including adjusting, based on the comparison result, a trim value associated with the plurality of duty cycles of the plurality of signals to compensate for distortion in the plurality of duty cycles and calibrating the plurality of duty cycles of the plurality of signals using the adjusted trim value.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: September 26, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Guan Wang, Ali Feiz Zarrin Ghalam, Chin-Yu Chen, Jongin Kim
  • Patent number: 11769716
    Abstract: A semiconductor device and method of forming the same are provided. The semiconductor device includes at least one substrate and an interconnection structure. The at least one substrate has a cavity partially defined by an inner sidewall of the at least one substrate and a channel disposed at a bottom of the at least one substrate. The channel laterally penetrates through the at least one substrate. The interconnections structure is disposed over the substrate, and the interconnection structure has a through hole penetrating through the interconnection structure. The through hole, the cavity and the channel are in spatial communication with each other.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: September 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu, Tang-Wei Huang, Fu Wei Liu
  • Patent number: 11749711
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an adhesive element between the magnetic element and the substrate. The adhesive element extends exceeding opposite edges of the magnetic element. The semiconductor device structure further includes an isolation element extending exceeding the opposite edges of the magnetic element. The isolation element partially covers a top surface of the magnetic element. In addition, the semiconductor device structure includes a conductive line over the isolation element.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: September 5, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Cheng Chen, Wei-Li Huang, Chien-Chih Kuo, Hon-Lin Huang, Chin-Yu Ku, Chen-Shien Chen
  • Patent number: 11741233
    Abstract: In one example in accordance with the present disclosure, a computing device is described. The computing device includes a printed circuit assembly and a basic input/output system (BIOS) coupled to the printed circuit assembly. The BIOS includes a subsystem identifier (SSID). The computing device also includes a non-volatile memory device which includes an override flag to indicate whether an override of the SSID is enabled and a protected variable value to, when enabled, override the SSID in the BIOS.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: August 29, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chin-Yu Wang, Ming-Chang Hung
  • Patent number: 11714951
    Abstract: A method includes generating a diffraction map from a plurality of target patterns, generating a favorable zone and an unfavorable zone from the diffraction map, placing a plurality of sub-resolution patterns in the favorable zone, and performing a plurality of geometric operations on the plurality of sub-resolution patterns to generate modified sub-resolution patterns. The modified sub-resolution patterns extend into the favorable zone, and are away from the unfavorable zone.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: August 1, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Shih-Ming Chang, Shinn-Sheng Yu, Jue-Chin Yu, Ping-Chieh Wu
  • Publication number: 20230238422
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.
    Type: Application
    Filed: March 30, 2023
    Publication date: July 27, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Cheng CHEN, Wei-Li HUANG, Chun-Yi WU, Kuang-Yi WU, Hon-Lin HUANG, Chih-Hung SU, Chin-Yu KU, Chen-Shien CHEN
  • Publication number: 20230231334
    Abstract: A connector clip is disclosed. The connector clip includes a base, a cover, a hinge coupling the cover and the base, and a fastener. The base has a first base side joined to a second base side via a connecting base side. The cover has a first cover side joined to a second cover side via a connecting cover side. The fastener holds the first base side and the first cover side in a fixed position when the connector clip is in a closed configuration in which the connecting base side is parallel to the connecting cover side. An internal cable opening is formed in part by the connecting base side and the connecting cover side when the connector clip is in the closed configuration. The connector clip secures a cable passing through the internal cable opening and connected to a board in its place in the closed configuration.
    Type: Application
    Filed: February 23, 2022
    Publication date: July 20, 2023
    Inventors: Yaw-Tzorng TSORNG, Chen-Chien KUO, Tang-Shun-Lee CHEN, Chin-Yu LIN
  • Publication number: 20230211107
    Abstract: A headgear assembly includes a strap of a first flexible material with an elongate edge, and a second flexible material folded around and running along the elongate edge. The second flexible material may be an elastic material. The second flexible material may also cover an intersection or joint in the first flexible material such that the first flexible material may be made from two flexible materials layered together or joined end to end.
    Type: Application
    Filed: February 27, 2023
    Publication date: July 6, 2023
    Inventors: Michiel KOOIJ, Rupert Christian SCHEINER, Annie YU, Tzu-Chin YU, Kit Lun YICK, Yiu Wan YIP, Jessica Lea DUNN
  • Publication number: 20230213449
    Abstract: A sample inspection device includes a filter unit having a plurality of optical filters configured to transmit lights of different wavelength ranges, a light source unit configured to irradiate light to any one of the optical filters, a stage for placing a sample, and a reflector oriented to reflect light transmitted through one of the optical filters to the stage and to reflect light emitted from the sample on the stage to another one of the optical filters. The device also includes a detection unit for detecting light emitted from the sample on the stage through light transmitted through the another one of the optical filters, an actuator for moving the filter unit, and a control unit configured to control the actuator to move the filter unit when the detection unit receives the light passing through the another one of the optical filters.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 6, 2023
    Inventors: Alexey DAN CHIN YU, Neon Cheol JUNG, Keunchang CHO
  • Patent number: 11679287
    Abstract: A personal entertainment respiratory apparatus provides air to a user to provide a fully immersive entertainment experience. The personal entertainment system may comprise a flow generator for providing the flow of air. A personal spatial respiratory interface may be coupled to the flow generator. The personal spatial respiratory interface may comprise an outlet for the flow generator. The personal spatial respiratory interface may further be configured to direct the flow of air within an ambient breathing proximity of a user. The personal entertainment respiratory apparatus may further comprise a controller and a sensory particle dispenser. The controller and sensory particle dispenser may be configured to selectively activate release of a sensory particle from the dispenser into the directed flow of air in response to an entertainment triggering signal.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: June 20, 2023
    Inventors: Tzu-chin Yu, Emma Anne Connell, David Creusot, Donald Darkin, Barton John Kenyon, Paul Jan Klasek, Andrew Sims, Quangang Yang, Philip Rodney Kwok
  • Publication number: 20230186810
    Abstract: The embodiments of the disclosure provide a method for determining an ambient light luminance, a host, and a computer readable storage medium. The method includes: obtaining a first frame and a second frame, wherein the first frame comprises a plurality of first regions of interest (ROI), the second frame comprises a plurality of second ROIs, and the first ROIs respectively correspond to the second ROIs; in response to determining that the first ROIs comprise at least one specific ROI satisfying a predetermined condition and at least one first candidate ROI, obtaining at least one second candidate ROI among the second ROIs, wherein the at least one second candidate ROI respectively correspond to the at least one specific ROI; and determining the ambient light luminance based on the at least one first candidate ROI and the at least one second candidate ROI.
    Type: Application
    Filed: May 4, 2022
    Publication date: June 15, 2023
    Applicant: HTC Corporation
    Inventors: Chia-Wei Yu, Ping-Chang Hsieh, Chin-Yu Chang
  • Publication number: 20230154788
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the end portion. The first protection cap and the first conductive line are made of different conductive materials, and the first protection cap exposes a peripheral region of a top surface of the end portion. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap.
    Type: Application
    Filed: January 13, 2023
    Publication date: May 18, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li YANG, Wei-Li HUANG, Sheng-Pin YANG, Chi-Cheng CHEN, Hon-Lin HUANG, Chin-Yu KU, Chen-Shien CHEN