Patents by Inventor Chin Yu

Chin Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230121400
    Abstract: In examples, an electronic device comprises a first speaker port, a second speaker port, and storage comprising a first port attribute corresponding to the first speaker port and a second port attribute corresponding to the second speaker port. The storage comprises executable code. The electronic device comprises a processor coupled to the first and second speaker ports and the storage. The processor, upon executing the executable code, is to collect ambient noise data using a first speaker corresponding to the first speaker port in response to the first port attribute indicating that the first speaker is to be used as a microphone and the second port attribute indicating that a second speaker corresponding to the second speaker port is to be used as a speaker. The processor is to modify an audio output signal using the ambient noise data collected using the first speaker. The processor is to provide the modified audio output signal to the second speaker port.
    Type: Application
    Filed: April 29, 2020
    Publication date: April 20, 2023
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chin-Yu Wang, Bing-Hao Cheng, Kuang-che Teng
  • Publication number: 20230120006
    Abstract: A method incudes forming a plurality of photodiodes in a substrate; forming an interconnect structure on a front-side of the substrate; forming a barrier layer on a back-side of the substrate; depositing a metal layer over the barrier layer; forming an adhesion enhancement layer over the metal layer; forming an oxide layer over the adhesion enhancement layer; etching the oxide layer, the adhesion enhancement layer, the metal layer, and the barrier layer to form an oxide grid, an adhesion enhancement grid, a metal grid, and a barrier grid, respectively, wherein the barrier grid and the adhesion enhancement grid have a same chemical element.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 20, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chin-Yu LIN, Keng-Ying LIAO, Su-Yu YEH, Po-Zen CHEN, Huai-Jen TUNG, Hsien-Li CHEN
  • Publication number: 20230111767
    Abstract: A method of manufacturing a patient interface for sealed delivery of a flow of air at a continuously positive pressure with respect to ambient air pressure to an entrance to the patient's airways includes collecting anthropometric data of a patient's face. Anticipated considerations are identified from the collected anthropometric data during use of the patient interface. The collected anthropometric data is processed to provide a transformed data set based on the anticipated considerations, the transformed data set corresponding to at least one customised patient interface component. At least one patient interface component is modelled based on the transformed data set.
    Type: Application
    Filed: December 8, 2022
    Publication date: April 13, 2023
    Applicant: ResMed Pty Ltd
    Inventors: Tzu-Chin YU, Aaron Samuel DAVIDSON, Robert Henry FRATER, Benjamin Peter JOHNSTON, Paul Jan KLASEK, Robert Anthony PATERSON, Quangang YANG, Gerard Michael RUMMERY, Priyanshu GUPTA, Liam HOLLEY, Gordon Joseph MALOUF
  • Patent number: 11621317
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: April 4, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Cheng Chen, Wei-Li Huang, Chun-Yi Wu, Kuang-Yi Wu, Hon-Lin Huang, Chih-Hung Su, Chin-Yu Ku, Chen-Shien Chen
  • Patent number: 11622263
    Abstract: A wireless repeater device and a configuration method for the same are provided. The wireless repeater device is configured to: connect to a target network provided by a DHCP server; send a detection packet to the target network to confirm transmission modes supported by the DHCP server; confirm whether a request for dynamically obtaining an IP address from a client device is received; forward a request packet to the DHCP server, which instructs the DHCP server to respond in a first transmission mode; receive a response to the request from the DHCP server and forward it to the client device; confirm whether the request from the client device is still received, if so, modify the request packet and forward it to the DHCP server, and the request packet is modified to instruct the DHCP server to respond in a second transmission mode.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: April 4, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Chin-Min Huang, Chin-Yu Hsu
  • Publication number: 20230063096
    Abstract: A semiconductor device includes a substrate, at least one via, a liner layer and a conductive layer. The substrate includes an electronic circuitry. The at least one via passes through the substrate. The at least one via includes a plurality of concave portions on a sidewall thereof. The liner layer fills in the plurality of concave portions of the at least one via. The conductive layer is disposed on the sidewall of the at least one via, covers the liner layer, and extends onto a surface of the substrate. The thickness of the conductive layer on the sidewall of the at least one via is varied.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ting-Li Yang, Wen-Hsiung Lu, Jhao-Yi Wang, Fu Wei Liu, Chin-Yu Ku
  • Patent number: 11590311
    Abstract: A headgear assembly includes a strap of a first flexible material with an elongate edge, and a second flexible material folded around and running along the elongate edge. The second flexible material may be an elastic material. The second flexible material may also cover an intersection or joint in the first flexible material such that the first flexible material may be made from two flexible materials layered together or joined end to end.
    Type: Grant
    Filed: June 17, 2020
    Date of Patent: February 28, 2023
    Assignee: ResMed Pty Ltd
    Inventors: Michiel Kooij, Rupert Christian Scheiner, Annie Yu, Tzu-Chin Yu, Kit Lun Yick, Yiu Wan Yip, Jessica Lea Dunn
  • Patent number: 11594484
    Abstract: A method includes forming a first dielectric layer over a conductive pad, forming a second dielectric layer over the first dielectric layer, and etching the second dielectric layer to form a first opening, with a top surface of the first dielectric layer exposed to the first opening. A template layer is formed to fill the first opening. A second opening is then formed in the template layer and the first dielectric layer, with a top surface of the conductive pad exposed to the second opening. A conductive pillar is formed in the second opening.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: February 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Mirng-Ji Lii, Chung-Shi Liu, Chin-Yu Ku, Hung-Jui Kuo, Alexander Kalnitsky, Ming-Che Ho, Yi-Wen Wu, Ching-Hui Chen, Kuo-Chio Liu
  • Publication number: 20230057550
    Abstract: A method for flattening a three-dimensional shoe upper template is provided. The method includes providing a three-dimensional last model, obtaining a three-dimensional grid model, obtaining a three-dimensional thickened grid model, obtaining a two-dimensional initial-value grid model, and obtaining a two-dimensional grid model with the smallest energy value. A system and a non-transitory computer-readable medium for performing the method are also provided. The method makes it possible to precisely flatten a three-dimensional last model with a non-developable surface and thereby convert the three-dimensional last model into a two-dimensional grid model.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 23, 2023
    Inventors: Chih-Chuan CHEN, Wei-Hsiang TSAI, Chin-Yu CHEN, Ching-Cherng SUN, Jann-Long CHERN, Yu-Kai LIN
  • Publication number: 20230036784
    Abstract: An apparatus is provided to change the absolute humidity of a flow of air for delivery to an entrance of the airways of a patient, the change being compared to the absolute humidity of ambient air. The apparatus has a reservoir configured to hold a volume of liquid. A heating element creates vapour from the liquid. A chamber is provided to mix the flow of air with the vapour. The apparatus has a body having a first wall structure with a chamber inlet port. A closure element having an air inlet port for pneumatically connecting to a source of the flow of air is secured to the body to provide a sealed gas flow path between the air inlet port and the chamber inlet port, and a liquid trap in the gas flow path.
    Type: Application
    Filed: December 23, 2020
    Publication date: February 2, 2023
    Inventors: Simon Robert CORK, Hayat CHAMTIE, Bing LUO, Tzu-Chin YU, Benjamin John LEAVENS
  • Publication number: 20230026969
    Abstract: The present disclosure relates to an oligopeptide. The oligopeptide includes an amino acid sequence. The amino acid sequence includes a binding motif, and the binding motif has a specific amino acid sequence. The present disclosure also relates to a testing kit including the oligopeptide and a medical composition including the oligopeptide.
    Type: Application
    Filed: December 3, 2020
    Publication date: January 26, 2023
    Applicant: China Medical University
    Inventors: Shih-Chieh Hung, Han-Chung Wu, Chin-Yu Lin, Yi-Hsuan Chi
  • Publication number: 20230018253
    Abstract: A LED device includes multiple LED chips each including opposite first and second surfaces, a side surface, and an electrode assembly disposed on the second surface and including first and second electrodes. The first surface of each of the LED chips is a light exit surface. The LED device further includes an electric circuit layer assembly disposed on the second surfaces of the LED chips and having opposite first and second surfaces and a side surface. The first surface is electrically connected to the first and second electrodes. The LED device further includes an encapsulating layer enclosing the LED chips and the electric circuit layer assembly to expose the second surface of the electric circuit layer assembly.
    Type: Application
    Filed: September 16, 2022
    Publication date: January 19, 2023
    Inventors: Junpeng SHI, Chen-Ke HSU, Chang-Chin YU, Yanqiu LIAO, Zhenduan LIN, Zhaowu HUANG, Senpeng HUANG
  • Patent number: 11555350
    Abstract: A window includes a window frame and a screen mounting assembly. The window frame is formed with two rail slots. The screen mounting assembly is adapted to be connected to a window screen and includes a roller unit, a sliding unit and an interconnecting unit. The roller unit includes a roller seat. The sliding unit is slidable along the rail slots and defines an engaging groove. The interconnecting unit is operable between a disengaging state where the interconnecting unit is connected to the roller seat, and an engaging state where the interconnecting unit is separated from the roller seat and inserted into the engaging groove so as to engage the sliding unit, such that movement of the sliding unit along the rail slots results in winding and unwinding of the window screen.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: January 17, 2023
    Assignee: ONWELL CURTAIN & SCREEN CO., LTD.
    Inventors: Chiu-Lan Fan, Chin-Yu Kuo
  • Patent number: 11557508
    Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first conductive line over a substrate. The semiconductor device structure includes a first protection cap over the first conductive line. The semiconductor device structure includes a first photosensitive dielectric layer over the substrate, the first conductive line, and the first protection cap. The semiconductor device structure includes a conductive via structure passing through the first photosensitive dielectric layer and connected to the first protection cap. The semiconductor device structure includes a second conductive line over the conductive via structure and the first photosensitive dielectric layer. The semiconductor device structure includes a second protection cap over the second conductive line. The semiconductor device structure includes a second photosensitive dielectric layer over the first photosensitive dielectric layer, the second conductive line, and the second protection cap.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: January 17, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Li Yang, Wei-Li Huang, Sheng-Pin Yang, Chi-Cheng Chen, Hon-Lin Huang, Chin-Yu Ku, Chen-Shien Chen
  • Patent number: 11550421
    Abstract: A method for controlling an electronic device by an input device, and an input device is disclosed. The method includes: controlling, by the input device, an electronic device by using a touch apparatus when the input device detects that the input device is in contact with the touch apparatus of the electronic device; and when the input device detects that the input device is in contact with an object surface beyond the touch apparatus of the electronic device, detecting, by the input device, a motion of the input device on the object surface, and sending information about the motion to the electronic device, to control the electronic device.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: January 10, 2023
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chi Wah Sun, Po Chin Yu, Wei Kuang Chu
  • Patent number: 11540745
    Abstract: A method of manufacturing a patient interface for sealed delivery of a flow of air at a continuously positive pressure with respect to ambient air pressure to an entrance to the patient's airways includes collecting anthropometric data of a patient's face. Anticipated considerations are identified from the collected anthropometric data during use of the patient interface. The collected anthropometric data is processed to provide a transformed data set based on the anticipated considerations, the transformed data set corresponding to at least one customised patient interface component. At least one patient interface component is modeled based on the transformed data set.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: January 3, 2023
    Inventors: Tzu-Chin Yu, Aaron Samuel Davidson, Robert Henry Frater, Benjamin Peter Johnston, Paul Jan Klasek, Robert Anthony Paterson, Quangang Yang, Gerard Michael Rummery, Priyanshu Gupta, Liam Holley, Gordon Joseph Malouf
  • Patent number: 11532658
    Abstract: An image sensor structure includes a semiconductor device, a plurality of image sensing elements formed in the semiconductor substrate, an interconnect structure formed on the semiconductor substrate, and a composite grid structure over the semiconductor substrate. The composite grid structure includes a tungsten grid, an oxide grid over the tungsten grid, and an adhesion enhancement grid spacing the tungsten grid from the oxide grid.
    Type: Grant
    Filed: January 17, 2020
    Date of Patent: December 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chin-Yu Lin, Keng-Ying Liao, Su-Yu Yeh, Po-Zen Chen, Huai-Jen Tung, Hsien-Li Chen
  • Patent number: 11527504
    Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: December 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
  • Publication number: 20220391385
    Abstract: A system for managing a report comprises a generating module, for receiving data of a first user and for generating a first report according to the data; an associating module, coupled to the generating module, for determine a first content of a second report according an association between the first report and the second report; and a notifying module, coupled to the associating module, for notifying a managing result of the first report and the second report to the first user and a second user, wherein the second user is associated with a project corresponding to the first report.
    Type: Application
    Filed: August 12, 2021
    Publication date: December 8, 2022
    Applicants: Inventec (Pudong) Technology Corp., Inventec Corporation
    Inventors: Chih-Chin Yu, Yung-Wei Tseng, Yu-Fu Chen, Wan-Ling Zhong
  • Publication number: 20220376154
    Abstract: A semiconductor light-emitting device includes a lead frame, a light-emitting element, and a reflection layer. The lead frame includes a main body and a side body extending upwardly from the main body. The main body and the side body cooperatively define a receiving space. The side body has an inner surface facing the receiving space, and a first height measured from a surface of the main body. The light-emitting element is disposed on the surface of the main body and in the receiving space. The reflection layer covers at least a part of the inner surface, and has a second height measured from the surface of the main body. The second height is not smaller than 90% of the first height.
    Type: Application
    Filed: May 13, 2022
    Publication date: November 24, 2022
    Inventors: Zhaowu HUANG, Chang-Chin YU, Li YANG, Chenxi YAN, Xinglong LI, Yang LI