Patents by Inventor Ching Chu

Ching Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9975145
    Abstract: An electrical waveform generating circuit has a pair of Pulse Amplitude Controlled Switching Current Sources (PACS). A gate pulse driver circuit is coupled to an input of each of the pair of PACS for sending gate pulses for driving the pair of PACS. A digital-to-analog converter (DAC) circuit is coupled to the gate pulse driver circuit for controlling amplitudes of the gate pulses. A transducer is coupled to the PACS.
    Type: Grant
    Filed: October 3, 2013
    Date of Patent: May 22, 2018
    Assignee: Microchip Technology Inc.
    Inventors: Jimes Lei, Ching Chu
  • Publication number: 20180126417
    Abstract: An electrical waveform generating circuit has a pair of Pulse Amplitude Controlled Switching Current Sources (PACS). A gate pulse driver circuit is coupled to an input of each of the pair of PACS for sending gate pulses for driving the pair of PACS. A digital-to-analog converter (DAC) circuit is coupled to the gate pulse driver circuit for controlling amplitudes of the gate pulses. A transducer is coupled to the PACS.
    Type: Application
    Filed: October 3, 2013
    Publication date: May 10, 2018
    Inventors: Jimes LEI, Ching CHU
  • Patent number: 9577623
    Abstract: A capacitive parametric zero crossing detection circuit has a nonlinear voltage controlled capacitive device coupled to an input voltage to convert a zero crossing current pulse into zero crossing voltage signal.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: February 21, 2017
    Assignee: Microchip Technology Inc.
    Inventors: Ching Chu, Benedict Choy, Andy Tu
  • Patent number: 9568597
    Abstract: An ultrasound image system has a plurality of channels. At least one of the plurality of channels has a capacitive T/R switch.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: February 14, 2017
    Assignee: Microchip Technology Inc.
    Inventors: Benedict Choy, Ching Chu, Andy Tu
  • Publication number: 20150340435
    Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.
    Type: Application
    Filed: June 1, 2015
    Publication date: November 26, 2015
    Inventors: Benedict C.K. Choy, Ching Chu, Haibing (Robin) Liu, Ming-Yuan Yeh
  • Patent number: 9048104
    Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: June 2, 2015
    Assignee: Microchip Technology Inc.
    Inventors: Benedict C. K. Choy, Ching Chu, Haibing (Robin) Liu, Ming-Yuan Yeh
  • Publication number: 20150098307
    Abstract: An electrical waveform generating circuit has a pair of Pulse Amplitude Controlled Switching Current Sources (PACS). A gate pulse driver circuit is coupled to an input of each of the pair of PACS for sending gate pulses for driving the pair of PACS. A digital-to-analog converter (DAC) circuit is coupled to the gate pulse driver circuit for controlling amplitudes of the gate pulses. A transducer is coupled to the PACS.
    Type: Application
    Filed: October 3, 2013
    Publication date: April 9, 2015
    Inventors: Jimes LEI, Ching CHU
  • Publication number: 20150070034
    Abstract: A capacitive parametric zero crossing detection circuit has a nonlinear voltage controlled capacitive device coupled to an input voltage to convert a zero crossing current pulse into zero crossing voltage signal.
    Type: Application
    Filed: September 9, 2013
    Publication date: March 12, 2015
    Inventors: Ching Chu, Ben Choy, Andy Tu
  • Publication number: 20150049577
    Abstract: An ultrasound image system has a plurality of channels. At least one of the plurality of channels has a capacitive T/R switch.
    Type: Application
    Filed: August 13, 2013
    Publication date: February 19, 2015
    Inventors: Benedict C.K. Choy, Ching Chu, Andy Tu
  • Publication number: 20140049299
    Abstract: An electrical waveform generating circuit has a programmable current source-driver. A digital switched current source is coupled to the programmable current source-driver and controlled by waveforms stored in the programmable current source-driver. A plurality of MOSFETs is coupled to the programmable current source driver. A first coupled inductor is connected to the plurality of high voltage MOSFETs. A transducer is coupled to the first coupled inductor.
    Type: Application
    Filed: August 16, 2012
    Publication date: February 20, 2014
    Inventor: Ching Chu
  • Patent number: 8648627
    Abstract: An electrical waveform generating circuit has a programmable current source-driver. A digital switched current source is coupled to the programmable current source-driver and controlled by waveforms stored in the programmable current source-driver. A plurality of MOSFETs is coupled to the programmable current source driver. A first coupled inductor is connected to the plurality of high voltage MOSFETs. A transducer is coupled to the first coupled inductor.
    Type: Grant
    Filed: August 16, 2012
    Date of Patent: February 11, 2014
    Assignee: Supertex, Inc.
    Inventor: Ching Chu
  • Patent number: 8542037
    Abstract: A multi-level high-voltage pulse generator integrated circuit has a digital logic-level control interface circuit. A pair of complementary MOSFETs is controlled by the digital control interface circuit. A pair of supply voltage rails is provided, wherein one of the pair of supply voltage rails is connected to each of the pair of complementary MOSFETs. A pair of Zener diodes is provided, wherein one of the pair of Zener diodes is connected to each of the pair of complementary MOSFETs. A pair of resistors is provided, wherein one of the pair of resistors is connected in parallel with each of the pair of Zener diodes. A pair of complementary voltage blocking-MOSFETs having predetermined gate bias voltages is provided, wherein each of the pair complementary voltage blocking-MOSFETs is attached to a corresponding one pair of complementary MOSFETs.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: September 24, 2013
    Assignee: Supertex, Inc.
    Inventors: Ben Choy, Ching Chu
  • Publication number: 20130187697
    Abstract: A multi-level high-voltage pulse generator integrated circuit has a digital logic-level control interface circuit. A pair of complementary MOSFETs is controlled by the digital control interface circuit. A pair of supply voltage rails is provided, wherein one of the pair of supply voltage rails is connected to each of the pair of complementary MOSFETs. A pair of Zener diodes is provided, wherein one of the pair of Zener diodes is connected to each of the pair of complementary MOSFETs. A pair of resistors is provided, wherein one of the pair of resistors is connected in parallel with each of the pair of Zener diodes. A pair of complementary voltage blocking-MOSFETs having predetermined gate bias voltages is provided, wherein each of the pair complementary voltage blocking-MOSFETs is attached to a corresponding one pair of complementary MOSFETs.
    Type: Application
    Filed: January 23, 2012
    Publication date: July 25, 2013
    Inventors: Ben Choy, Ching Chu
  • Patent number: 8198922
    Abstract: A digital switched current source is coupled to a programmable current source-driver and controlled by waveforms stored in the programmable and floating complementary sourcing and sinking current source-driver. A plurality of complementary P- and N-MOSFET is coupled to the programmable floating current source driver. The transformer-less programmable ultrasound transmit beamformer integrated circuit is provided and directly coupled to the plurality of transducers.
    Type: Grant
    Filed: May 6, 2010
    Date of Patent: June 12, 2012
    Assignee: Supertex, Inc.
    Inventor: Ching Chu
  • Publication number: 20120007216
    Abstract: A circuit module comprises a die attach pad with a surface and a plurality of leads surrounding the surface. A nonconductive adhesive is on the surface. A plurality of electronic circuit dies are on the surface of the die attach pad. Each die has a top surface and a bottom surface with the bottom surface on the adhesive. The top surface has a plurality of bonding pads. A first electronic circuit die has at least one routing path of a conductive material connecting a first bonding pad to a second bonding pad. A first bonding wire connects a bonding pad of a second electronic circuit die to the first bonding pad of the first electronic die. A second bonding wire connects the second bonding pad of the first electronic circuit die to a lead. Where one of the dies contains vertical circuit element, where a doped layer forms a terminal along the bottom surface of the layer, a trench filled with doped polysilicon extends from the top surface to the terminal to connect to the terminal.
    Type: Application
    Filed: July 12, 2010
    Publication date: January 12, 2012
    Inventors: Benedict C. K. Choy, Ching Chu, Haibing (Robin) Liu, Ming-Yuan Yeh
  • Patent number: 8013640
    Abstract: An electrical waveform generating circuit has a programmable current source-driver. A digital switched current source is coupled to the programmable current source-driver and controlled by waveforms stored in the programmable current source-driver. A plurality of MOSFETs is coupled to the programmable current source driver. A center-tapped RF transformer is provided and has a primary coupled to the plurality of high voltage MOSFETs. A transducer is coupled to a secondary of the RF transformer.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: September 6, 2011
    Assignee: Supertex, Inc.
    Inventor: Ching Chu
  • Patent number: 7977820
    Abstract: A ultrasound transmit pulse waveform generator for driving a piezoelectric transducer in medical ultrasound imaging, nondestructive testing (NDT) ultrasound imaging applications, includes a capacitor, switching programmable current sources, and a power amplifier.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: July 12, 2011
    Assignee: Supertex, Inc.
    Inventors: Ching Chu, Benedict C. K. Choy
  • Patent number: 7956653
    Abstract: A complementary high voltage switched current source circuit has a complementary current source pair, wherein a first of the current source pair is coupled to a positive voltage rail and a second of the current source pair is coupled to a negative voltage rail. A digital logic-level control interface circuit is coupled to the complementary current source pair and to the positive voltage rail and the negative voltage rail. A pair of high voltage switches is coupled to the complementary current source pair and the digital logic-level control interface circuit and controlled by the digital control interface circuit.
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: June 7, 2011
    Assignee: Supertex, Inc.
    Inventors: Benedict C. K. Choy, Ching Chu
  • Patent number: 7893714
    Abstract: An integrated circuit high voltage analog switch has digital logic-level control interface circuit. A level translator is coupled to the digital logic-level control interface circuit. A plurality of output multi-channel high voltage switches is coupled to the level translator.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: February 22, 2011
    Assignee: Supertex, Inc.
    Inventor: Ching Chu
  • Publication number: 20100201428
    Abstract: An integrated circuit high voltage analog switch has digital logic-level control interface circuit. A level translator is coupled to the digital logic-level control interface circuit. A plurality of output multi-channel high voltage switches is coupled to the level translator.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 12, 2010
    Inventor: Ching Chu