Abstract: A substrate assembly is provided, including a first substrate and a circuit substrate. The first substrate comprising an edge. An active element layer is disposed on the first substrate. A plurality of first electrodes are disposed on the first substrate and between the edge and an edge of the active element layer, and arranged along a first direction. At least one of the plurality of first electrodes is electrically connected to the active element layer, a first register mark is disposed on the first substrate. The circuit substrate is partially overlapping the first substrate in a vertical projection direction, a plurality of second electrodes is disposed on the circuit substrate.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin structure extended above a substrate along a first direction, and a first gate structure formed over the first fin structure along a second direction. The semiconductor device structure includes a first source/drain (S/D) structure formed over the first fin structure and adjacent to the first gate structure, and a cap layer formed on and in direct contact with the first S/D structure. The semiconductor device structure includes an isolation structure formed adjacent to the first gate structure and the first S/D structure along the first direction, and a bottom surface of the isolation structure is lower than a bottom surface of the first gate structure and a bottom surface of the first S/D structure.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary method of manufacture comprises receiving a substrate including a semiconductor material stack formed thereon, wherein the semiconductor material stack includes a first semiconductor layer of a first semiconductor material and second semiconductor layer of a second semiconductor material that is different than the first semiconductor material. Patterning the semiconductor material stack to form a trench. The patterning includes performing a first etch process with a first etchant for a first duration and then performing a second etch process with a second etchant for a second duration, where the second etchant is different from the first etchant and the second duration is greater than the first duration. The first etch process and the second etch process are repeated a number of times. Then epitaxially growing a third semiconductor layer of the first semiconductor material on a sidewall of the trench.

Abstract: A semiconductor structure includes an isolation structure; first and second source/drain (S/D) features over the isolation structure, defining a first direction from the first S/D feature to the second S/D feature from a top view; one or more channel layers connecting the first and the second S/D features; a gate structure between the first and the second S/D features and engaging each of the one or more channel layers; and a via structure under the first S/D feature and electrically connecting to the first S/D feature. In a cross-sectional view perpendicular to the first direction, the via structure has a profile that widens and then narrows along a bottom-up direction.

Abstract: Disclosed is a topical composition comprising: (i) an antimicrobial active which is at least one of hydroxamic acids or hydroxamic acid derivatives; and (ii) an atractylenolide compound; wherein weight ratio of the amount of said atractylenolide compound to that of said antimicrobial active is at least 5:1. Also disclosed is a non-therapeutic method of providing topical antimicrobial benefit on a topical surface of a human or animal body comprising a step of applying a safe and effective amount of the topical antimicrobial composition.

Abstract: A display device includes: a substrate; a thin film transistor structure disposed on the substrate and including a gate electrode and a drain electrode; and a data line disposed on the substrate. Herein, from a top view, the data line is separated from the drain electrode, an edge of the gate electrode overlaps the drain electrode, the edge has two ends, and a first direction is parallel to a connection line of the two ends. In addition, from the top view, the drain electrode has a first distance and a second distance, the first distance is a maximum distance of the drain electrode not overlapping the gate electrode in the first direction, the second distance is a maximum distance of the drain electrode overlapping the gate electrode in the first direction, and the first distance is greater than the second distance.

Abstract: Photosensitive polymers and their use in photoresists for photolithographic processes are disclosed. The polymers are copolymers, with at least one monomer that includes pendant polycyclic aromatic groups and a second monomer that includes an acidic leaving group (ALG). The polymers have high resistance to etching and high development contrast.

Abstract: A semiconductor device includes a substrate having a first region and a second region of opposite conductivity types, an isolation feature over the substrate, a first fin protruding from the substrate and through the isolation feature in the first region, a first epitaxial feature over the first fin, a second fin protruding from the substrate and through the isolation feature in the second region, and a second epitaxial feature over the second fin. A portion of the isolation feature located between the first fin and the second fin protrudes from a top surface of the isolation feature.

Abstract: The disclosure provides a display panel including a substrate, an active layer, a first electrode layer, a common electrode layer, a cathode layer, and a spacer. The active layer is located on the substrate. The first electrode layer is located on the active layer, and the first electrode layer includes a first gate and a second gate. The common electrode layer is located on the first electrode layer. The common electrode layer has a first region, a second region, and a first necking region. The first necking region connects the first region and the second region. The first region and the first gate are correspondingly disposed, and the second region and the second gate are correspondingly disposed. The cathode layer is located on the common electrode layer. The spacer is located between the common electrode layer and the cathode layer. The spacer and the first necking region are correspondingly disposed.

Abstract: Methods and associated devices including the fabrication of a semiconductor structure that provides a silicon-on-insulator substrate. The semiconductor structure may be formed by providing a base substrate, forming a sacrificial layer over the base structure, and forming a semiconductor layer over the sacrificial layer. The sacrificial layer is removed to form a void that is filled with oxide. The semiconductor structure includes a dielectric support feature extending through the semiconductor and oxide layers and/or a portion of the oxide layer extends to the surface of the semiconductor layer.

Abstract: A touch device is provided, including a first substrate and a circuit substrate. The first substrate includes a touch sensing structure and a plurality of first electrodes. The touch sensing structure is disposed on the first substrate. The first electrodes are arranged along a first direction. The first electrodes are disposed on the first substrate and electrically connected to the touch sensing structure, a first gap is formed between two adjacent first electrodes, and a minimum distance between the two adjacent first electrodes is a gap distance. The circuit substrate is partially overlapping the substrate in a vertical projection direction, the circuit substrate including a plurality of second electrodes corresponding to the first electrodes. One of the two adjacent first electrodes has a first electrode side edge facing the first gap. One of the second electrodes has a second electrode side edge located in the first gap.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary method of manufacture comprises receiving a substrate including a semiconductor material stack formed thereon, wherein the semiconductor material stack includes a first semiconductor layer of a first semiconductor material and second semiconductor layer of a second semiconductor material that is different than the first semiconductor material. Patterning the semiconductor material stack to form a trench. The patterning includes performing a first etch process with a first etchant for a first duration and then performing a second etch process with a second etchant for a second duration, where the second etchant is different from the first etchant and the second duration is greater than the first duration. The first etch process and the second etch process are repeated a number of times. Then epitaxially growing a third semiconductor layer of the first semiconductor material on a sidewall of the trench.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first fin structure and a second fin structure extended above a substrate, and a first source/drain structure formed over the first fin structure. The first source/drain structure is made of an N-type conductivity material. The semiconductor device structure also includes a second source/drain structure formed over the second fin structure, and the second source/drain structure is made of an P-type conductivity material. The semiconductor device structure also includes a cap layer formed over the first source/drain structure, wherein the cap layer is made of P-type conductivity material.

Abstract: A method for forming a semiconductor memory structure is provided. The method includes forming a stack over a substrate, and the stack includes first dielectric layers and second dielectric layers vertically alternately arranged. The method also includes forming first dielectric pillars through the stack, and etching the stack to form first trenches. Sidewalls of the first dielectric pillars are exposed from the first trenches. The method also includes removing the first dielectric pillars to form through holes, removing the second dielectric layers of the stack to form gaps between the first dielectric layers, and forming first conductive lines in the gaps.

Abstract: A thin film transistor substrate comprises: a substrate; a scan line disposed on the substrate and extending along a first direction; a semiconductor layer disposed on the scan line; and a drain electrode disposed on the semiconductor layer and comprising an arc edge outside the scan line, wherein a part of the semiconductor layer extends along a second direction perpendicular to the first direction and the arc edge overlaps the part of the semiconductor layer.

Abstract: A semiconductor device structure and a formation method are provided. The semiconductor device structure includes a stack of channel structures and includes a first epitaxial structure and a second epitaxial structure adjacent to opposite sides of the channel structures. The semiconductor device structure also includes a gate stack wrapped around each of the channel structures and a backside conductive contact connected to the second epitaxial structure. The second epitaxial structure is between a top of the backside conductive contact and a top of the gate stack. The semiconductor device structure further includes a dielectric fin stacked over an isolation structure. The dielectric fin is adjacent to the second epitaxial structure, and the isolation structure is adjacent to the backside conductive contact. The isolation structure has a first height, the dielectric fin has a second height, and the second height is greater than the first height.

Abstract: Methods and devices formed thereof that include a fin structure extending from a substrate and a gate structure is formed over the fin structure. An epitaxial feature is formed over the fin structure adjacent the gate structure. The epitaxial feature can include a hollow region (or dielectric filled hollow region) in the epitaxial source/drain region. A selective etching process is performed to remove at least a portion of an epitaxial region having a second dopant type to form the hollow area between the first epitaxial portion and the third epitaxial portion.

Abstract: A method includes etching two source/drain regions over a substrate to form two source/drain trenches; epitaxially growing two source/drain features in the two source/drain trenches respectively; performing a cut process to the two source/drain features; and after the cut process, depositing a contact etch stop layer (CESL) over the two source/drain features.

Abstract: A semiconductor device according to the present disclosure includes a gate-all-around (GAA) transistor in a first device area and a fin-type field effect transistor (FinFET) in a second device area. The GAA transistor includes a plurality of vertically stacked channel members and a first gate structure over and around the plurality of vertically stacked channel members. The FinFET includes a fin-shaped channel member and a second gate structure over the fin-shaped channel member. The fin-shaped channel member includes semiconductor layers interleaved by sacrificial layers.

Abstract: A device includes a substrate, an isolation structure over the substrate, and two fins extending from the substrate and above the isolation structure. Two source/drain structures are over the two fins respectively and being side by side along a first direction generally perpendicular to a lengthwise direction of the two fins from a top view . Each of the two source/drain structures has a near-vertical side, the two near-vertical sides facing each other along the first direction. A contact etch stop layer (CESL) is disposed on at least a lower portion of the near-vertical side of each of the two source/drain structures. And two contacts are disposed over the two source/drain structures, respectively, and over the CESL.