Abstract: A one-time-programmable memory device comprises a one-time-programmable memory cell array, a voltage pumping circuit, and a programming verification circuit. The one-time-programmable memory cell array comprises a plurality of memory cells. Each memory cell is arranged at an intersection of a bit line and a word line. The voltage pumping circuit comprises a plurality of local voltage boost circuits. Each local voltage boost circuit is shared by a corresponding memory cell of the plurality of memory cells. The programming verification circuit is coupled to the one-time-programmable memory cell array for verifying that conduction current of programmed memory cells of the plurality of memory cells is greater than a predetermined current level after programming. Each local boost circuit isolates leakage current of a corresponding programmed memory cell, and prevents programming voltage failure due to current overloading at a corresponding voltage pumping circuit.

Abstract: A non-volatile semiconductor memory device includes a substrate, a first gate formed on a first region of a surface of the substrate, a second gate formed on a second region of the surface of the substrate, a charge storage layer filled between the first gate and the second gate, a first diffusion region formed on a first side of the charge storage layer, and a second diffusion region formed opposite the charge storage layer from the first diffusion region. The first region and the second region are separated by a distance sufficient for forming a self-aligning charge storage layer therebetween.

Abstract: A method of forming a charge-storing layer in a non-volatile memory cell in a logic process includes forming a select gate over an active region of a substrate, forming long polysilicon gates partially overlapping the active region of the substrate, and filling the charge-storing layer between the long polysilicon gates.

Abstract: A non-volatile memory system includes one or more non-volatile memory cells. Each non-volatile memory cell comprises a floating gate, a coupling device, a first floating gate transistor, and a second floating gate transistor. The coupling device is located in a first conductivity region. The first floating gate transistor is located in a second conductivity region, and supplies read current sensed during a read operation. The second floating gate transistor is located in a third conductivity region. Such non-volatile memory cell further comprises two transistors for injecting negative charge into the floating gate during a programming operation, and removing negative charge from the second floating gate transistor during an erase operation. The floating gate is shared by the first floating gate transistor, the coupling device, and the second floating gate transistor, and extends over active regions of the first floating gate transistor, the coupling device and the second floating gate transistor.

Abstract: In a programming method for a NAND flash memory device, a self-boosting scheme is used to eliminate excess electrons in the channel of an inhibit cell string that would otherwise cause programming disturb. The elimination is enabled by applying a negative voltage to word lines connected to the inhibit cell string before boosting the channel, and this leads to bringing high program immunity. A row decoder circuitry to achieve the programming operation and a file system architecture based on the programming scheme to improve the efficiency of file management are also described.

Abstract: A single-polysilicon layer non-volatile memory having a floating gate transistor, a program gate and a control gate is provided. The floating gate transistor has a floating gate and a tunneling dielectric layer. The floating gate is disposed on a substrate. The tunneling dielectric layer is disposed between the floating gate and the substrate. The program gate, the control gate and the erase gate are respectively disposed in the substrate under the floating gate separated by the tunneling dielectric layer. Therefore, during a program operation and an erase operation, charges are injected in and expelled out through different regions of the tunneling dielectric layer, so as to increase reliability of the non-volatile memory.

Abstract: A non-volatile memory unit cell includes a first transistor pair and first and second control gates. The first transistor pair includes first and second transistors that are connected in series and of the same type. The first and second transistors have a first floating polysilicon gate and a second floating polysilicon gate, respectively. The first control gate is coupled to the first floating polysilicon gate through a tunneling junction and the second control gate is coupled to the second floating polysilicon gate through another tunneling junction.

Abstract: The present invention provides a mobile phone accessing system. The mobile phone accessing system comprises: a mobile phone having a first International Mobile Equipment Identity (IMEI) code; and a storage device comprising a first storage region for storing data, a second storage region for storing a second IMEI code, and a controller coupled to the first storage region and the second storage region for executing a security check function to determine whether the mobile phone is qualified to access the first storage region according to the first IMEI code.

Abstract: A mask-defined read-only memory array is formed on a substrate, and includes a first ROM bit and a second ROM bit of opposite polarities. The first ROM bit has a first MOS transistor and a first block layer formed over a first region of the substrate. A second source/drain region of the first MOS transistor and a first diffusion region are formed in a first region of the substrate on opposite sides of the first block layer. The second ROM bit includes a second MOS transistor.

Abstract: A non-volatile semiconductor memory device includes a substrate, a first gate formed on a first region of a surface of the substrate, a second gate formed on a second region of the surface of the substrate, a charge storage layer filled between the first gate and the second gate, a first diffusion region formed on a first side of the charge storage layer, and a second diffusion region formed opposite the charge storage layer from the first diffusion region. The first region and the second region are separated by a distance sufficient for forming a self-aligning charge storage layer therebetween.

Abstract: The present invention provides a method of operating a one-time programmable read only memory (OTPROM). The OTPROM includes at least a select transistor, an electrode and a dielectric layer disposed on a substrate, wherein the electrode is set up on the source region of the select transistor and the dielectric layer is set up between the electrode and the source region. The method of operating the one-time programmable read only memory includes performing a programming operation to write a digital data value of ‘1’ into the memory and performing a programming operation to write a digital data value of ‘0’ into the memory.

Abstract: The present invention provides a mobile phone accessing system. The mobile phone accessing system comprises: a mobile phone having a first International Mobile Equipment Identity (IMEI) code; and a storage device comprising a first storage region for storing data, a second storage region for storing a second IMEI code, and a controller coupled to the first storage region and the second storage region for executing a security check function to determine whether the mobile phone is qualified to access the first storage region according to the first IMEI code.

Abstract: The present invention provides a mobile phone accessing system. The mobile phone accessing system comprises: a mobile phone having a first Subscriber Identity Module (SIM) specification corresponding to a SIM card; and a storage device comprising a first storage region for storing data, a second storage region for storing a second SIM specification, and a controller coupled to the first storage region and the second storage region for executing a security check function to determine whether the mobile phone is qualified to access the first storage region according to the first SIM specification.

Abstract: A data accessing system includes a host computer and a storage device. The host computer has a first media access control (MAC) address, and the storage device includes a first storage region, a second storage region, and a controller. The first storage region is utilized for storing data. The second storage region stores a second media access control address. The controller couples to the first storage region and the second storage region for executing a security checking function to determine if the host computer is qualified to access the first storage region according to the first media access control address.

Abstract: A data accessing system includes a host and a storage device. The host has a security setup function and includes a first identity code storage block. The host executes the security setup function to set a first identity code according to a second identity code, and the second identity code is stored into the first identity code storage block. The storage device has a security check function and includes a second identity code storage block to store the second identity code, and the storage device executes the security check function to determine if the host is allowed to access the storage device according to the first identity code.

Abstract: A data access system includes a host and a storage device. The host has a security setup function and includes a first identity code storage block to store a first identity code. The storage device has a security check function and includes a second identity code storage block. The host executes the security setup function to set a second identity code according to the first identity code, and the second identity code is stored into the second identity code storage block. The storage device executes the security check function to determine if the host is allowed to access the storage device according to the first and second identity codes.

Abstract: A non-volatile memory includes a substrate, a memory unit array, (N+1) bit lines, M word lines, M first control gate lines, and M second control gate lines. The memory unit array includes N memory unit columns, and each memory unit column includes M memory units. The (N+1) bit lines are disposed on the substrate and arranged in parallel in the column direction, and the (N+1) bit lines are corresponding to the N memory unit columns. The M word lines are disposed on the substrate and arranged in parallel in the row direction. The M first control gate lines are arranged on the substrate in parallel in the row direction and respectively connected to the first memory cell in the same row. The M second control gate lines are arranged on the substrate in parallel in the row direction and respectively connected to the second memory cell in the same row.

Abstract: A flash memory cell is provided. A deep well is disposed in a substrate and a well is disposed within the deep well. A stacked gate structure is disposed on the substrate. A source region and a drain region are disposed in the substrate on each side of the stacked gate structure. A select gate is disposed between the stacked gate structure and the source region. A first gate dielectric layer is disposed between the select gate and the stacked gate structure. A second gate dielectric layer is disposed between the select gate and the substrate. A shallow doped region is disposed in the substrate under the stacked gate structure and the select gate. A deep doped region is disposed in the substrate on one side of the stacked gate structure. The conductive plug on the substrate extends through the drain region and the deep doped region.

Abstract: A manufacturing method for a non-volatile memory includes first providing a substrate with a gate structure formed thereon. The gate structure includes a first gate and a gate dielectric layer located between the first gate and the substrate. A first doping and a second doping region are formed on the substrate at two sides of the gate, respectively. A first insulating layer is formed on the substrate, and a portion of the first insulating layer and a portion of the substrate are removed to form a trench, which divides the second doping region into a third doping region and a fourth doping region. Finally, a tunneling dielectric layer, a charge-trapping layer and a top dielectric layer are formed inside the trench, and a second gate which fills the trench is formed on the substrate.

Abstract: An operating method for a non-volatile memory device is applicable on a non-volatile memory device in which a substrate is disposed. The substrate includes a trench, a first conductive type first well region disposed in the substrate, and a second conductive type second well region disposed above the first conductive type first well region. The operating method includes applying a first voltage to a control gate, a second voltage to a drain region, and a third voltage to a source region. Besides, a channel F-N tunneling effect is employed to program a memory cell.