Patents by Inventor Chou Tsai

Chou Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12277379
    Abstract: A method (of generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks, the layout diagram being stored on a non-transitory computer-readable medium) includes: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in a group of cut patterns which violates a design rule; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: April 15, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fong-Yuan Chang, Chin-Chou Liu, Hui-Zhong Zhuang, Meng-Kai Hsu, Pin-Dai Sue, Po-Hsiang Huang, Yi-Kan Cheng, Chi-Yu Lu, Jung-Chou Tsai
  • Patent number: 12216981
    Abstract: A system (for generating a layout diagram of a wire routing arrangement) includes a processor and memory including computer program code for one or more programs, the system generating the layout diagram including: placing, relative to a given one of masks in a multi-patterning context, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining that the first candidate location results in an intra-row non-circular group of a given row which violates a design rule, the intra-row non-circular group including first and second cut patterns which abut a same boundary of the given row, and a total number of cut patterns in the being an even number; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fong-Yuan Chang, Chin-Chou Liu, Hui-Zhong Zhuang, Meng-Kai Hsu, Pin-Dai Sue, Po-Hsiang Huang, Yi-Kan Cheng, Chi-Yu Lu, Jung-Chou Tsai
  • Publication number: 20240354046
    Abstract: A system for displaying an online electronic document includes a document server, a notification server and a remote conference server. The remote conference server is configured to establish a conference call connection between a first electronic device and a second electronic device. The first electronic device and the second electronic device are able to respectively download from the document server and display an electronic document. After one page of the electronic document displayed on the first electronic device is switched to another page, the first electronic device generates a page turning indication and transmits the page turning indication to the notification server via the document server. The notification server transmits the page turning indication to the second electronic device, and one page of the electronic document displayed on the second electronic device is switched to another page in response to the page turning indication.
    Type: Application
    Filed: April 22, 2024
    Publication date: October 24, 2024
    Inventors: PO-CHOU SU, NAN-KUANG LEE, CHANG-CHOU TSAI, JUNG-CHEN LEE
  • Publication number: 20240331592
    Abstract: A display apparatus and an image processing method thereof are provided. The display apparatus includes a display panel and an image processing device. The image processing device receives a low-resolution image from a host. The image processing device tracks a user's gaze to define a region of interest (ROI). The image processing device performs a video super-resolution (VSR) reconstruction on an original ROI image corresponding to the ROI in the low-resolution image to generate a high-definition ROI image. The image processing device pastes the high-definition ROI image back to the ROI in the low-resolution image to generate a processed image. The image processing device controls the display panel to display the processed image.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 3, 2024
    Applicant: Novatek Microelectronics Corp.
    Inventors: Hung-Ming Wang, Sin-Hong Li, Yi-Ting Chen, Chih-Hung Kuo, Ting-Chou Tsai
  • Patent number: 12064754
    Abstract: A titanium catalyst and a synthesizing method of polyester resins are provided in the present disclosure. The titanium catalyst has a chemical structure represented by Formula (I), Formula (II) or Formula (III). The symbols shown in the Formula (I), the Formula (II) or the Formula (III) are defined in the description. The synthesizing method of polyester resins includes providing the titanium catalyst, performing a feeding step, performing a heating and pressurizing step and performing a heating and vacuuming step. The titanium catalyst and a heat stabilizer are added into an autoclave before the feeding step or before the heating and vacuuming step.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: August 20, 2024
    Assignees: NATIONAL TSING HUA UNIVERSITY, CHANG CHUN PLASTICS CO., LTD., CHANG CHUN PETROCHEMICAL CO., LTD., DAIREN CHEMICAL CORP.
    Inventors: Yi-Chou Tsai, John Di Yi Ou, Chuan-Sheng Huang, Yung-Sheng Lin
  • Publication number: 20240274561
    Abstract: An interconnect structure includes a plurality of first pads, a plurality of second pads, and a plurality of conductive lines. The first pads are arranged to form a first column-and-row array, and the second pads are arranged to form a second column-and-row array. The first column-and-row array, the second column-and-row array and the conductive lines are disposed in a same layer. The first pads in adjacent rows in the first column-and-row array are separated from each other by a first vertical distance from a plan view, the second pads in adjacent rows in the second column-and-row array are separated from each other by a second vertical distance from the plan view. A sum of widths of the conductive lines electrically connecting the first pads and the second pads in the same row is less than the first vertical distance and the second vertical distance from the plan view.
    Type: Application
    Filed: April 29, 2024
    Publication date: August 15, 2024
    Inventors: JUNG-CHOU TSAI, FONG-YUAN CHANG, PO-HSIANG HUANG, CHIN-CHOU LIU, YI-KAN CHENG
  • Patent number: 12002776
    Abstract: An interconnect structure includes a plurality of first pads arranged to form a first array and a plurality of second pads arranged to form a second array. Each of the first array has a first row, a second row and an mth row extending along a first direction and parallel to each other along a second direction. The first pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction. The second pads in each of the first row, the second row and the mth row are grouped into a first group, a second group and an nth group extending along the second direction. The interconnect structure further includes a plurality of first conductive lines, a plurality of second conductive lines and a plurality of nth conductive lines.
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jung-Chou Tsai, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Yi-Kan Cheng
  • Publication number: 20240095439
    Abstract: Disclosed are semiconductor devices having an interconnection pattern that includes a plurality of parallel conductors including a first conductor aligned with a first axis and a first dummy pattern aligned with a second axis on a first side of the first axis and offset from the first axis by an axis offset distance LAO in which the first dummy pattern includes N dummy conductors having a first dummy conductor length LDC with the dummy conductors being separated by a dummy conductor-to-dummy conductor spacing EED.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 21, 2024
    Inventors: Wei-Yi HU, Chih-Ming CHAO, Jung-Chou TSAI
  • Publication number: 20230394219
    Abstract: A method (of generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks, the layout diagram being stored on a non-transitory computer-readable medium) includes: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in a group of cut patterns which violates a design rule; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Application
    Filed: August 10, 2023
    Publication date: December 7, 2023
    Inventors: Fong-Yuan CHANG, Chin-Chou LIU, Hui-Zhong ZHUANG, Meng-Kai HSU, Pin-Dai SUE, Po-Hsiang HUANG, Yi-Kan CHENG, Chi-Yu LU, Jung-Chou TSAI
  • Publication number: 20230385522
    Abstract: A system (for generating a layout diagram of a wire routing arrangement) includes a processor and memory including computer program code for one or more programs, the system generating the layout diagram including: placing, relative to a given one of masks in a multi-patterning context, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining that the first candidate location results in an intra-row non-circular group of a given row which violates a design rule, the intra-row non-circular group including first and second cut patterns which abut a same boundary of the given row, and a total number of cut patterns in the being an even number; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Fong-Yuan CHANG, Chin-Chou LIU, Hui-Zhong ZHUANG, Meng-Kai HSU, Pin-Dai SUE, Po-Hsiang HUANG, Yi-Kan CHENG, Chi-Yu LU, Jung-Chou TSAI
  • Patent number: 11790151
    Abstract: A system for generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks (the layout diagram being stored on a non-transitory computer-readable medium), at least one processor, at least one memory and computer program code (for one or more programs) of the system being configured to cause the system to execute generating the layout diagram including: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in at least one of a non-circular group or a cyclic group which violates a design rule; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: October 17, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fong-Yuan Chang, Chin-Chou Liu, Hui-Zhong Zhuang, Meng-Kai Hsu, Pin-Dai Sue, Po-Hsiang Huang, Yi-Kan Cheng, Chi-Yu Lu, Jung-Chou Tsai
  • Patent number: 11775727
    Abstract: A method (of generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks, the layout diagram being stored on a non-transitory computer-readable medium) includes: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in at least one of a non-circular group or a cyclic group which violates a design rule; and temporarily preventing, if there is a violation, placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: October 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Fong-Yuan Chang, Chin-Chou Liu, Hui-Zhong Zhuang, Meng-Kai Hsu, Pin-Dai Sue, Po-Hsiang Huang, Yi-Kan Cheng, Chi-Yu Lu, Jung-Chou Tsai
  • Patent number: 11762041
    Abstract: A connector detecting device for a connector includes a test vehicle, including a plurality of detecting points, to assemble with the connector; and a function module, formed an electrical connection with the test vehicle, configured to determine a conduction status between the connector and the test vehicle according to a loop of the plurality of detecting points and the connector.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: September 19, 2023
    Assignee: Wistron Corporation
    Inventors: Chen-Chou Tsai, Chiao-Pin Wang, Guang-Zong Li, Chung-Yu Lai, I-Hsiu Tseng
  • Publication number: 20230229067
    Abstract: A light source fixing assembly includes an optical engine housing, a circuit board, a light emitting element, a flexible circuit board, a fixing element and an abutting element. The circuit board has a bearing surface, a first fixing region and a first conductive bonding region. The first bonding region and the light emitting element are on the bearing surface. The flexible circuit board is between the optical engine housing and the circuit board. The flexible circuit board has a first surface, a second surface opposite to the first surface, and a second fixing region. The second surface has a second bonding region. The fixing element fixes the circuit board and the flexible circuit board onto the optical engine housing. The abutting element abuts against the flexible circuit board and corresponds to the second bonding region, so that the first bonding region is electrically connected to the second bonding region.
    Type: Application
    Filed: January 5, 2023
    Publication date: July 20, 2023
    Inventors: TUNG-YI KO, YI-CHOU TSAI
  • Publication number: 20230213596
    Abstract: A connector detecting device for a connector includes a test vehicle, including a plurality of detecting points, to assemble with the connector; and a function module, formed an electrical connection with the test vehicle, configured to determine a conduction status between the connector and the test vehicle according to a loop of the plurality of detecting points and the connector.
    Type: Application
    Filed: April 26, 2022
    Publication date: July 6, 2023
    Applicant: Wistron Corporation
    Inventors: Chen-Chou Tsai, Chiao-Pin Wang, Guang-Zong Li, Chung-Yu Lai, I-Hsiu Tseng
  • Publication number: 20230182123
    Abstract: A titanium catalyst and a synthesizing method of polyester resins are provided in the present disclosure. The titanium catalyst has a chemical structure represented by Formula (I), Formula (II) or Formula (III). The symbols shown in the Formula (I), the Formula (II) or the Formula (III) are defined in the description. The synthesizing method of polyester resins includes providing the titanium catalyst, performing a feeding step, performing a heating and pressurizing step and performing a heating and vacuuming step. The titanium catalyst and a heat stabilizer are added into an autoclave before the feeding step or before the heating and vacuuming step.
    Type: Application
    Filed: May 10, 2022
    Publication date: June 15, 2023
    Inventors: Yi-Chou TSAI, John Di Yi OU, Chuan-Sheng HUANG, Yung-Sheng LIN
  • Publication number: 20230142853
    Abstract: Disclosed are semiconductor devices having an interconnection pattern that includes a plurality of parallel conductors including a first conductor aligned with a first axis and a first dummy pattern aligned with a second axis on a first side of the first axis and offset from the first axis by an axis offset distance LAO in which the first dummy pattern includes N dummy conductors having a first dummy conductor length LDC with the dummy conductors being separated by a dummy conductor-to-dummy conductor spacing EED.
    Type: Application
    Filed: January 11, 2023
    Publication date: May 11, 2023
    Inventors: Wei-Yi HU, Chih-Ming CHAO, Jung-Chou TSAI
  • Patent number: 11607116
    Abstract: The endoscopic device includes a main member having a front slot and a shaft member having a spiral strip selectively running through the slot. The spiral strip is connected to a rotational element whose front end is provided with an optical element. A camera support element is extended from the main member and a camera element is supported by the camera support element. By running the spiral strip through the slot to turn the rotational element and the optical element, a viewing direction of the camera element is altered by the optical element.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: March 21, 2023
    Assignee: BROAD PERSPECT BIOMEDICAL TECHNOLOGY CO., LTD.
    Inventors: Tsang-Chou Tsai, John Huang
  • Patent number: 11556691
    Abstract: Disclosed are methods for designing semiconductor devices, conductive layer patterns, and interconnection layer patterns including the operations of analyzing an initial semiconductor design layout to identify excessive open spaces between adjacent conductive elements or lines within an interconnection layer pattern, selecting or generating a dummy pattern to fill a portion of the open space, and generating a modified semiconductor design layout that incorporates the dummy pattern into first interconnection layer pattern to reduce the open space.
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: January 17, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Yi Hu, Chih-Ming Chao, Jung-Chou Tsai
  • Patent number: 11532580
    Abstract: An interconnect structure includes a plurality of first pads, a plurality of second pads, a plurality of first conductive lines in a first layer, a plurality of second conductive lines in a second layer, and a plurality of nth conductive lines in an nth layer. The first pads and the second pads respectively are grouped into a first, a second and an nth group. Each of the first pads in first group is connected to one of the second pads in the first group by one of the first conductive lines. Each of the first pads in the second group is connected to one of the second pads in the second group by one of the second conductive lines. Each of the first pads in the nth group is connected to one of the second pads in the nth group by one of the nth conductive lines.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: December 20, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Jung-Chou Tsai, Fong-Yuan Chang, Po-Hsiang Huang, Chin-Chou Liu, Yi-Kan Cheng