Abstract: A thin film transistor (TFT) is provided, which includes a substrate, a first gate layer, an insulation layer, a first source/drain layer, a second source/drain layer, a semiconductor layer, a passivation layer and a second gate layer. The first gate layer is disposed on the substrate. The insulation layer is disposed on the first gate layer. The first source/drain layer is disposed on the insulation layer. The second source/drain layer is disposed on the insulation layer. The semiconductor layer is disposed on the insulation layer and covers the first source/drain layer and the second source/drain layer. The passivation layer is disposed on the insulation layer and covers the semiconductor layer. The second gate layer is disposed on the passivation layer and contacts the first gate layer through a via so that the two gate layers keep a same voltage level.

Abstract: A method for manufacturing an active array substrate is provided herein. The active array substrate can be manufactured by using only two photolithography process steps. The photolithography process step using a first photomask may be provided for forming a drain electrode, a source electrode, a data line and/or a data line connecting pad and a patterned transparent conductive layer, etc. The photolithography process step using a second photomask may be utilized for forming a gate electrode, a gate line, a gate insulating layer, a channel layer and/or a gate line connecting pad, and so forth.

Abstract: A semiconductor structure includes a gate, an oxide channel layer, a gate insulating layer, a source, a drain and a dielectric stacked layer. The oxide channel layer is stacked over the gate, with the gate insulting layer disposed therebetween. The source and the drain are disposed on a side of the oxide channel layer and in parallel to each other. A portion of the oxide channel layer is exposed between the source and the drain. The dielectric stacked layer is disposed on the substrate and includes plural of first inorganic dielectric layers with a first refraction index and plural of second inorganic dielectric layers with a second refraction index that are stacked alternately. At least one of the first inorganic dielectric layers directly covers the source, the drain and the portion of the oxide channel layer. The first refraction index is smaller than the second refraction index.

Abstract: A packaging substrate is provided, including: a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of first openings for defining a first core circuit layer therebetween, the second surface has a plurality of second openings for defining a second core circuit layer therebetween, each of the first and second openings has a wide outer portion and a narrow inner portion, and the inner portion of each of the second openings is in communication with the inner portion of a corresponding one of the first openings; a first encapsulant formed in the first openings; a second encapsulant formed in the second openings; and a surface circuit layer formed on the first encapsulant and the first core circuit layer. The present invention effectively reduces the fabrication cost and increases the product reliability.

Abstract: An intermediate structure of a flexible display device includes a substrate, an etching layer, a flexible substrate, and a display module. A trench structure is formed in a surface of the substrate. The etching layer is formed on the surface and covers the substrate. The flexible substrate is disposed on the etching layer. The flexible substrate and the substrate are spaced apart from each other by the etching layer. The display module is disposed on the flexible substrate. The flexible substrate can be peeled from the substrate without applying a mechanical force and thus the yield is improved, and the process time and the fabricating cost are also reduced. In addition, the present invention also provides a substrate for fabricating a flexible display device and a method for fabricating a flexible display device.

Abstract: A display device includes a thin film transistor substrate, a display layer, a patterned color resist layer, a patterned UV block layer and a transparent protective layer. The thin film transistor substrate has a substrate and a plurality of thin film transistors. The display layer is disposed on the thin film transistor substrate. The patterned color resist layer is disposed on the display layer. The patterned UV block layer is disposed on the patterned color resist layer. The transparent protective layer is disposed on the patterned UV block layer. The present invention also provides a laser transfer printing method for fabricating the color resist layer and the patterned UV block layer.

Abstract: A fabrication method of a semiconductor package is provided, which includes the steps of: forming a packaging substrate on a first carrier; bonding a second carrier to the packaging substrate; removing the first carrier; disposing a chip on the packaging substrate; forming an encapsulant on the packaging substrate for encapsulating the chip; and removing the second carrier. The first and second carriers provide the thin-type packaging substrate with sufficient rigidity for undergoing the fabrication processes without cracking or warpage, thereby meeting the miniaturization requirement and improving the product yield.

Abstract: A semiconductor package includes: a first insulating layer; a plurality of first conductive elements disposed in the first insulating layer; a first circuit layer formed on the first insulating layer; a semiconductor chip disposed on the first insulating layer; and an encapsulant formed on the first insulating layer and encapsulating the semiconductor chip. The first conductive elements that are bonding wires have a small diameter and thus occupy desired limited space on the first insulating layer. Therefore, more space is available for the first circuit layer.

Abstract: A display device includes a substrate, a driving circuit, an E-paper display layer and a protective coating layer. The driving circuit is arranged on the substrate. The E-paper display layer is disposed on and driven by the driving circuit. The protective coating layer is coated on and in contact with the E-paper display layer. The protective coating layer can provide protection and better optical performance, and it is advantageous to the manufacturing method to overcome the problems such as bubbles and low light transmittance occurring in the conventional manufacturing method.

Abstract: An electrophoretic display apparatus including a substrate and an electrophoretic display film is provided. The substrate has multiple pixel units, each the pixel unit has a transparent region and a reflective region and each the pixel unit includes a pixel electrode and a reflective layer. The pixel electrode is located in the transparent region and the reflective region. The reflective layer is disposed on the pixel electrode and located in the reflective region. The electrophoretic display film is disposed on the substrate and includes a common electrode and multiple microcapsules disposed between the common electrode and the pixel units, in which each the microcapsule includes multiple black electrophoretic particles, and the arrangement of the black electrophoretic particles is controlled by a driving voltage applied between the pixel electrode of each the pixel unit and the common electrode of the electrophoretic display film.

Abstract: An electrophoretic display film is provided, which includes a first protective film, a second protective film and a plurality of display media. The second protective film is opposite to the first protective film. The display media are disposed between the first protective film and the second protective film, in which each of the display media includes an electrophoretic liquid and a plurality of black charged particles and a plurality of charged particles with metallic gloss both distributed in the electrophoretic liquid.

Abstract: A display apparatus includes a driving substrate and an organic light emitting diode device. The driving substrate includes a display area, a non-display area, a substrate and a transparent driving element. The transparent driving element is disposed in the non-display area to form a transparent region. The organic light emitting diode device is disposed over the driving substrate and located in the display area to form a non-transparent region.

Abstract: A method for manufacturing an active array substrate is provided herein. The active array substrate can be manufactured by using only two photolithography process steps. The photolithography process step using a first photomask may be provided for forming a drain electrode, a source electrode, a data line and/or a data line connecting pad and a patterned transparent conductive layer, etc. The photolithography process step using a second photomask may be utilized for forming a gate electrode, a gate line, a gate insulating layer, a channel layer and/or a gate line connecting pad, and so forth.

Abstract: A chip package includes: a substrate having a first and a second surface; a device region and a pad disposed on the first surface; a hole extending from the second surface to the pad; an insulating layer located on a sidewall of the hole; a carrier substrate located on the second surface; a first redistribution layer located between the carrier substrate and the insulating layer and located in the hole to electrically contact with the pad, wherein an edge of the first redistribution layer is exposed on a sidewall formed by the carrier substrate and the insulating layer; a second redistribution layer located on the carrier substrate, extending towards the second surface, and contacting the exposed edge of the first redistribution layer; and a buffer layer located on or below the second surface of the substrate and located between the second redistribution layer and the substrate.

Abstract: A court border module using a display apparatus is disclosed, which uses piezoelectric elements to drive the display apparatus. When a ball hits a court border, which is defined by the display apparatus, a force is applied to the piezoelectric elements which then generate power to drive the corresponding part of the display apparatus. The color of the part of the display apparatus hit by the ball is switched. Therefore the change in the color of the court border can be observed by officials and others to instantly and objectively determine whether the ball has hit the court border.

Abstract: A flexible electronic paper display apparatus includes a drive substrate and a display layer. The display layer is disposed on the drive substrate. The drive substrate includes a plastic substrate, a stainless steel layer, an insulation layer and a circuit unit. The stainless steel layer is disposed on the plastic substrate, the insulation layer is disposed on the stainless steel layer, and the circuit unit is disposed on the insulation layer. Production yield of the flexible electronic paper display apparatus can be increased. Additionally, a manufacturing method for the flexible electronic paper display apparatus is also provided.

Abstract: Disclosed herein is a thin film transistor array substrate. The thin film transistor array substrate includes a display area and a non-display area. The non-display area includes a signal line, a connecting line and a metal contact. The connecting line is formed in a first patterned metal layer. The signal line and the metal contact are formed in a second patterned metal layer. The connecting line is connected to the signal line by a first through-hole, and the connecting line is connected to the metal contact by a second through-hole Furthermore, a method of fabricating the thin film transistor array substrate is also disclosed.

Abstract: A manufacturing method for a flexible display apparatus is provided. A rigid substrate is provided. A flexible substrate having a supporting portion and a cutting portion surrounding the supporting portion is provided. A first adhesive material is formed between the rigid substrate and the cutting portion of the flexible substrate, so that the flexible substrate is adhered onto the rigid substrate by the first adhesive material. The first adhesive material does not locate on the supporting portion of the flexible substrate. At least a display unit is formed on the supporting portion of the flexible substrate. The supporting portion and the cutting portion of the flexible substrate are separated so as to separate the rigid substrate and the flexible substrate, wherein the flexible substrate and the display unit thereon form a flexible display apparatus. In the method, the flexible substrate and the rigid substrate can be easily separated.

Abstract: An electrothermal transfer device includes a substrate, a plurality of electrothermal components and a heating circuit. The electrothermal components are disposed on a surface of the substrate and arranged in a pattern. The heating circuit is electrically connected to the electrothermal components. In an electrothermal transfer method, at first, a transfer substrate is disposed on a workpiece substrate. Then, the electrothermal transfer device is disposed on the transfer substrate so that the electrothermal components contact with the transfer substrate. Thereafter, the heating circuit is used to heat the electrothermal transfer components so that the transfer substrate is heated to be transferred to the workpiece substrate. The electrothermal transfer device and the electrothermal transfer method can reduce cost.

Abstract: A method for manufacturing an oxide thin film transistor includes the steps of forming an oxide semiconductor active layer by a deposition process. In the deposition process, a total flow rate of a gas is more than 100 standard cubic centimeters per minute and an electric power is in a range from 1.5 kilowatts to 10 kilowatts. The oxide thin film transistor manufactured by the above methods has advantages of low leakage currents, high electron mobility, and excellent temperature stability. The present invention also provides a method for manufacturing a display device. The display quality of the display device can be improved.