Abstract: Systems and methods herein describe a network system for federated searching. The systems and methods receive a search query, transmit the search query to search providers, receive search results corresponding to the search query, extract metadata from each search result, generate matched groupings comprising a first search results that have matching metadata, generate a ranked list of the matched groupings and a plurality of relevance scores, identify a second subset of search results based on the ranked list of matched groupings, and cause display of the second subset of search results on a graphical user interface of a computing device.

Abstract: Aspects of the disclosure provide an apparatus for transmitting a circularly polarized signal by linearly polarized antennas. Processing circuitry of the apparatus generates a transmitted baseband signal vector. Based on the transmitted baseband signal vector, power amplifiers (PAs) of the apparatus generates transmitted radio frequency (RF) signals. The transmitted RF signals are received by receiving circuitry of the apparatus to obtain a received baseband signal vector. A controller of the apparatus calibrates the PAs and local oscillator (LO) signals of frequency converters of the apparatus based on the received baseband signal vector. A horizontally polarized antenna and a vertically polarized antenna of the apparatus transmit a circularly polarized signal based on the calibrated PAs and the calibrated LO signals.

Abstract: A semiconductor device including a first pair of stacked transistors having a first upper transistor and a first lower transistor, a second pair of stacked transistors comprising a second upper transistor and a second lower transistor, and a first cross-connection between the first upper transistor and the second lower transistor.

Abstract: An interconnection structure includes a first conductive feature disposed in a dielectric material, a first etch stop layer disposed over the dielectric material, a first dielectric layer disposed over the first etch stop layer, and a second conductive feature extending through the first dielectric layer and the first etch stop layer and in electrical contact with the first conductive feature. The first etch stop layer includes a boron-based layer, and an oxygen-rich boron-containing layer in contact with the boron-based layer.

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

Abstract: Embodiments are described of a sensing network including one or more sensor nodes, wherein each of the one or more sensor nodes includes a gas sensor that can measure the presence, concentration, or both, of one or more airborne pollutants in a nodal coverage area surrounding the sensor node. A sensor base that can measure the presence, concentration, or both, of one or more airborne pollutants is positioned in the nodal coverage area of each of the one or more sensor nodes, wherein the sensor base includes a gas sensor with higher accuracy, higher sensitivity, or both, than the gas sensors of the one or more sensor nodes. One or more servers communicatively coupled to the sensor base and the one or more sensors nodes. The sensor base and the sensor nodes can communicate their measurements to the server and the measurements of the sensor base are used by the server as a reference to correct the measurements of the one or more sensor nodes.

Abstract: Various embodiments of the present application are directed towards image sensors including composite backside illuminated (CBSI) structures to enhance performance. In some embodiments, a first trench isolation structure extends into a backside of a substrate to a first depth and comprises a pair of first trench isolation segments. A photodetector is in the substrate, between and bordering the first trench isolation segments. A second trench isolation structure is between the first trench isolation segments and extends into the backside of the substrate to a second depth less than the first depth. The second trench isolation structure comprises a pair of second trench isolation segments. An absorption enhancement structure overlies the photodetector, between the second trench isolation segments, and is recessed into the backside of the semiconductor substrate. The absorption enhancement structure and the second trench isolation structure collectively define a CBSI structure.

Abstract: A method includes receiving a layout for fabricating a mask, determining a first target contour corresponding to a first set of process conditions, determining a second target contour corresponding to a second set of process conditions, simulating a first potential modification to the layout under the first set of process conditions to generate a first simulated contour, simulating a second potential modification to the layout under the second set of process conditions to generate a second simulated contour, evaluating costs of the first and second potential modifications based on comparing the first and second simulated contours to the first and second target contours, respectively, and providing the layout and one of the first and second potential modifications having a lower cost for fabricating the mask. The first set of process conditions is different from the second set of process conditions.

Abstract: An optical modulator includes a dielectric layer and a waveguide. The waveguide is disposed on the dielectric layer. The waveguide includes an electrical coupling portion, a slab portion, and an optical coupling portion. The slab portion is directly in contact with both of the electrical coupling portion and the optical coupling portion. The slab portion has a first sub-portion and a second sub-portion connected to the first sub-portion. A top surface of the electrical coupling portion, a top surface of the first sub-portion, and a top surface of the second sub-portion are located at different level heights.

Abstract: A GAPDH nucleic acid detection kit includes a primer set for detecting GAPDH nucleic acid. The primer set for detecting GAPDH nucleic acid includes a forward inner primer for GAPDH nucleic acids, a forward outer primer for GAPDH nucleic acids, a backward inner primer for GAPDH nucleic acids and a backward outer primer for GAPDH nucleic acids. The primer set for detecting GAPDH nucleic acid is used in a loop-mediated isothermal amplification (LAMP).

Abstract: Semiconductor devices and methods of forming the same are provided. In an embodiment, a semiconductor device includes a first fin extending along a first direction, a second fin extending parallel to the first fin, and a gate structure over and wrapping around the first fin and the second fin, the gate structure extending along a second direction perpendicular to the first direction. The first fin bents away from the second fin along the second direction and the second fin bents away from the first fin along the second direction.

Abstract: A package substrate and method of manufacturing a package substrate and a semiconductor device package are provided. The package substrate includes a circuit layer, a molding layer and a sacrificial layer. The circuit layer includes conductive traces and conductive pads. The molding layer has an upper surface and a lower surface opposite to the upper surface, wherein the molding layer partially covers the conductive traces and the conductive pads, and first surfaces of the conductive traces and first surfaces of the conductive pads are exposed from the upper surface of the molding layer. The sacrificial layer covers the lower surface of the molding layer, second surfaces of the conductive pads.

Abstract: The present technology is directed to determining an accuracy of an infrared (IR) camera, and more particularly, validating a distortion accuracy of an IR camera. The present technology can receive one or more images of a calibration harp captured by the IR camera, wherein the one or more images include a plurality of lines corresponding to a plurality of strings of the calibration harp. The present technology can further determine a degree of distortion of the plurality of lines based on a distortion error coefficient, wherein the distortion error coefficient is computed based on edge points of the plurality of lines on the one or more images.

Abstract: An electronic device, including a device body, a case, at least one power supply module, and a power distribution module, is provided. The case is disposed on the device body. The at least one power supply module is disposed in the case. The power distribution module includes a main body, a handle, and an anti-removal frame. The main body is detachably disposed on the device body. The handle is rotatably connected to the main body. The anti-removal frame is slidably disposed in the case. The power supply module is configured to push against the anti-removal frame, so that the anti-removal frame slides toward the handle and restricts the handle from rotating relative to the main body. In addition, a power distribution module configured for the electronic device is also provided.

Abstract: A damper device for use in an automated beverage preparation apparatus is disclosed. The damper device includes: a damper base having a material entrance hole, a material exit hole, and a material buffer chamber positioned between the material entrance hole and the material exit hole; a diaphragm covered on the material buffer chamber; and a fastening element positioned on the diaphragm and having a hollow portion. When the volume of liquid material within the material buffer chamber exceeds a predetermined amount, the diaphragm deforms to protrude outward, so that a part of the diaphragm enters the hollow portion of the fastening element.

Abstract: A method of making a fabric-creped absorbent cellulosic sheet. The method includes compactively dewatering a papermaking furnish to form a web having a consistency of about thirty percent to about sixty percent, creping the web under pressure in a creping nip between a transfer surface and a structuring fabric, and drying the web to form the absorbent cellulosic sheet. The absorbent sheet has SAT capacities of at least about 9.5 g/g and at least about 500 g/m2. A creping ratio is defined by the speed of the transfer surface relative to the speed of the structuring fabric, and the creping ratio is less than about 25%.

Abstract: A system for generating a layout diagram of a wire routing arrangement in a multi-patterning context having multiple masks (the layout diagram being stored on a non-transitory computer-readable medium), at least one processor, at least one memory and computer program code (for one or more programs) of the system being configured to cause the system to execute generating the layout diagram including: placing, relative to a given one of the masks, a given cut pattern at a first candidate location over a corresponding portion of a given conductive pattern in a metallization layer; determining whether the first candidate location results in at least one of a non-circular group or a cyclic group which violates a design rule; and temporarily preventing placement of the given cut pattern in the metallization layer at the first candidate location until a correction is made which avoids violating the design rule.

Abstract: Various embodiments herein define a performance data and measurement job creation solutions for advanced networks including network slicing, based on a service-based framework. The embodiments allow different kinds of consumers to flexibly use performance management services and performance data services, to collect real-time performance data and/or periodical performance data.

Abstract: A material output volume detecting device for use in an automated beverage preparation apparatus is disclosed. The material output volume detecting device includes: a damper device arranged to operably buffer liquid material flowing therethrough; and a flowmeter arranged to operably measure the flow of liquid material outputted from the damper device. The damper device includes: a damper base having a material entrance hole, a material exit hole, and a material buffer chamber positioned between the material entrance hole and the material exit hole; a diaphragm covered on the material buffer chamber; and a fastening element positioned on the diaphragm and having a hollow portion. When the volume of liquid material within the material buffer chamber exceeds a predetermined amount, the diaphragm deforms to protrude outward, so that a part of the diaphragm enters the hollow portion of the fastening element.

Abstract: A method of forming a semiconductor device includes forming photodiodes extending from a front-side surface of a semiconductor layer into the semiconductor layer; forming transistors on the front-side surface of the semiconductor layer; forming an interconnect structure over the transistors, the interconnect structure comprising an inter-metal dielectric and metal lines in the inter-metal dielectric; etching first regions of a backside surface of the semiconductor layer to form trenches in the semiconductor layer and non-overlapping the photodiodes; after forming the trenches, etching second regions of the backside surface of the semiconductor layer to form pits in the semiconductor layer and overlapping the photodiodes; and depositing a dielectric material in the trenches and the pits.