Patents by Inventor Chou

Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11783107
    Abstract: An IC device includes a first anti-fuse structure including a first dielectric layer between a first gate conductor and a first active area, and a second anti-fuse structure including a second dielectric layer between a second gate conductor and the first active area. A first via is electrically connected to the first gate conductor at a first location a first distance from the first active area, a second via is electrically connected to the second gate conductor at a second location a second distance from the first active area, and the first distance is approximately equal to the second distance.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Meng-Sheng Chang, Shao-Yu Chou, Yao-Jen Yang, Chen-Ming Hung
  • Patent number: 11781163
    Abstract: Provided microorganisms genetically modified to overexpress an imine/enamine deaminase to enhance the production of lysine and lysine derivatives by the microorganism. Also provided a method of generating such microorganism, and methods of producing lysine and lysine derivatives using the genetically modified microorganisms.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: October 10, 2023
    Assignees: CATHAY BIOTECH INC., CIBT AMERICA INC.
    Inventors: Howard Chou, Ling Chen, Xiucai Liu
  • Patent number: 11785760
    Abstract: The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a first stack structure positioned on a first substrate, a first impurity region and a second impurity region respectively positioned on opposing sides of the first stack structure and operatively associated with the first stack structure, a second stack structure positioned above the first stack structure with a middle insulation layer interposed therebetween, and a third impurity region positioned on one side of the second stack structure and electrically coupled to the second impurity region. The first stack structure includes a plurality of first semiconductor layers and a plurality of gate assemblies alternatively arranged. The plurality of gate assemblies includes a gate dielectric and a gate electrode. The second stack structure includes a plurality of second semiconductor layers and a plurality of capacitor sub-units alternatively arranged.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: October 10, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventor: Liang-Pin Chou
  • Patent number: 11782188
    Abstract: The invention discloses a microwave rain attenuation law based artificial rainfall experimental method with an adjustable link length, including the following steps of: 1) designing and calculating rainfall intensities in different return periods to form an experimental rainfall process, and simulating artificial rainfall by using an artificial rainfall hall; 2) building a corner reflector to dynamically adjust the microwave link length; 3) installing an experimental microwave device, and selecting a microwave link with a specific microwave frequency band as an experimental link; 4) using a self-recording rain gauge to obtain measured data on the experimental link under different rainfall intensities; and 5) according to the measured data, obtaining a whole process of the experimental rainfall intensity change, and analyzing and calculating the microwave rain attenuation law.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: October 10, 2023
    Assignee: HOHE UNIVERSITY
    Inventors: Tao Yang, Xin Zheng, Pengfei Shi, Lina Chou, Youwei Qin, Zhenya Li, Xudong Zhou
  • Patent number: 11784065
    Abstract: A method includes rotating a wafer, dispensing a liquid from a center of the wafer to an edge of the wafer to control a temperature of the wafer, and etching an etch layer of the wafer with an etchant during or after dispensing the liquid. The liquid is dispensed through a nozzle.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Manish Kumar Singh, Bo-Wei Chou, Jui-Ming Shih, Wen-Yu Ku, Ping-Jung Huang, Pi-Chun Yu
  • Patent number: 11782215
    Abstract: An optical device is provided. The optical device includes a fiber array and an optical assembly. The fiber array includes a common channel and a plurality of divided channels arranged in parallel in a first direction and extending along a second direction, and the fiber array has a first surface from a top view perspective. The optical assembly is coupled to the first surface of the fiber array. The first surface and the common channel of the fiber array form an angle less than 90 degrees from the top view perspective.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: October 10, 2023
    Assignee: BROWAVE CORPORATION
    Inventors: Jung-Tsung Chou, Chih-Yang Liao, Yuan-Hung Chuang, Hung-Kuang Hsu
  • Patent number: 11779222
    Abstract: The disclosure provides a method of and an imaging system for clinical sign detection. The method uses an imaging system having an RGB image sensor and the processing device disclosed herein. An image of a patient or examinee is captured by the RGB image sensor to generate an RGB image. Clinical signs of the patient or examinee are detected by the processing device based on the RGB images.
    Type: Grant
    Filed: July 9, 2020
    Date of Patent: October 10, 2023
    Assignees: COMPAL ELECTRONICS, INC., National Taiwan University Hospital
    Inventors: Tung-Hung Su, Cheng-Fu Chou, Shann-Ching Chen
  • Publication number: 20230317852
    Abstract: A method includes forming a 2-D semiconductor material layer over a substrate; forming source/drain contacts over source/drain regions of the 2-D semiconductor material layer; and forming a gate structure over a channel region of the 2-D semiconductor material layer. Forming the source/drain contacts includes performing a first deposition process to deposit a first metal layer over the 2-D semiconductor material layer; and after the first deposition process is completed, performing a second deposition process to deposit a second metal layer over the first metal layer, in which the second metal layer has a higher melting point than the first metal layer.
    Type: Application
    Filed: March 18, 2022
    Publication date: October 5, 2023
    Applicants: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., NATIONAL TAIWAN UNIVERSITY
    Inventors: Shun-Siang JHAN, Ang-Sheng CHOU, I-Chih NI, Chih-I WU
  • Publication number: 20230317821
    Abstract: A semiconductor structure and forming method thereof are provided. A substrate includes a region. A first gate structure and a sacrificial gate structure are recessed in the substrate and disposed in the region. The sacrificial gate structure is adjacent to the first gate structure. A first contact is electrically connected to the first gate structure. A sacrificial gate masking structure is disposed over the sacrificial gate structure. An upper surface of the sacrificial gate structure is entirely covered by the sacrificial gate masking structure.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 5, 2023
    Inventors: JHU-MIN SONG, CHIEN-CHIH CHOU, YU-CHANG JONG
  • Publication number: 20230318242
    Abstract: A crimping plier includes a clamp handle mechanism, a crimping mechanism, and a driving mechanism. The clamp handle mechanism includes a first clamp handle and a second clamp handle pivoted to each other. The crimping mechanism includes a main body, a crimping tooth member and a crimping member. One end of the crimping tooth member has a tooth-shaped structure, and the tooth-shaped structure corresponds to a terminal accommodation portion of the main body. The crimping member has a flat end positioned in a first position or a second position. The driving mechanism includes a first connecting rod and a second connecting rod respectively connected to the first clamp handle and the second clamp handle. The first connecting rod and the second connecting rod are jointly connected to the crimping tooth member and the crimping member.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 5, 2023
    Inventor: Chien-Chou Liao
  • Publication number: 20230317571
    Abstract: An electronic device with a conductive lead having an internal first section and an external second section extending outside a molded package structure, the first section having an obstruction feature extending vertically from a top or bottom side of the conductive lead and engaging a portion of the package structure to oppose movement of the conductive lead outward from the package structure.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 5, 2023
    Inventors: Hsiang Ming Hsiao, Hung-Yu Chou, Yuh-Harng Chien, Chih-Chien Ho, Che Wei Tu, Bo-Hsun Pan, Megan Chang
  • Publication number: 20230309949
    Abstract: A wearable heart sound detection system, which includes an acoustic sensing device for collecting heart sound signals of the body, performing signal amplification, filtering, digitization and other preprocessing on the collected heart sound signals, and outputting the preprocessed heart sound signals; a computing electronic device communicatively coupled to the acoustic sensing device for acquiring the preprocessed heart sound signal, and a cloud data database communicatively coupled to the external computing electronic device. The acoustic device includes a capacitive sound sensor, a piezoelectric sound sensor and a circuit assembly. The circuit assembly is respectively electrically connected with the capacitive sound sensor and the piezoelectric sound sensor. The circuit assembly, the capacitive sound sensor and the piezoelectric sound sensor are integrated on a flexible substrate.
    Type: Application
    Filed: October 15, 2022
    Publication date: October 5, 2023
    Inventors: Yao-Sheng Chou, Wei-Sheng Su, Hsiao-Yi Lin
  • Publication number: 20230319501
    Abstract: A method for providing better connecting signals is disclosed. Coordinates of multiple mobile terminals are obtained. Distances between a mobile Wi-Fi (MIFI) device and the mobile terminals are calculated according to received signal strength indicator (RSSI) values between the mobile terminals and the MIFI device, and a relative coordinate of the MIFI device is then calculated based on the distances. Unit vectors of the mobile terminals relative to the MIFI device are calculated according to the relative coordinate of the MIFI device and the coordinates of the mobile devices. Reference signal receiving power (RSRP) values of the mobile terminals are calculated and are multiplied by the unit vectors to obtain RSRP vectors of the mobile terminals. The RSRP vectors are added up to generate a position where the MIFI device moves to a base station.
    Type: Application
    Filed: March 30, 2022
    Publication date: October 5, 2023
    Inventors: WEI-FAN LAI, YUNG-MING CHOU
  • Publication number: 20230318617
    Abstract: A device includes a phase detector circuit, a charge pump circuit, a sample and hold circuit, a comparator, and a controller. The phase detector circuit detects a clock skew between a reference signal and an input signal. The charge pump circuit translates the clock skew into a voltage. A sample and hold circuit samples the voltage, at a first time, and maintain the sampled voltage until a second time. The comparator (i) detects a loop gain associated with the input signal based on the sampled voltage and the voltage at the second time and (ii) outputs a loop gain signal for adjustment of the input signal. The controller is coupled to the phase detector, the comparator, and the sample and hold circuit. The controller generates a plurality of control signals for automatically controlling operation of the phase detector, the comparator, and the sample and hold circuit.
    Type: Application
    Filed: June 6, 2023
    Publication date: October 5, 2023
    Inventors: Mao-Hsuan Chou, Ya-Tin Chang, Ruey-Bin Sheen, Chih-Hsien Chang
  • Publication number: 20230309710
    Abstract: A dual use device and a furniture module including the dual use device are disclosed. The dual use device is adapted to be used with furniture, and includes two covering elements and a cover body. The two covering elements are partially connected and are selectively closed together or opened. When the two covering elements are closed together, an internal space is formed between the two covering elements, the cover body is foldably received in the internal space, and the dual use device serves as a throw pillow or a bolster pillow. When the two covering elements are opened, the cover body is adapted to be unfolded and cover the furniture.
    Type: Application
    Filed: July 7, 2022
    Publication date: October 5, 2023
    Inventor: Liang Chou Chen
  • Publication number: 20230315576
    Abstract: During operation, a controller node, in multiple nodes in a cluster, may provide to the multiple nodes a set of operations associated with an update of controller software for a controller, where at least the controller node implements the controller. Moreover, at least a first node in the multiple nodes may perform the set of operations associated with the update of the controller software. Furthermore, at least a second node in the multiple nodes may monitor the performing of the set of operations by at least the first node. When the performing of the set of operations is completed by at least the first node, the first node may terminate the performing of the set of operations by the multiple nodes. Alternatively, when a failure occurs during the update of the controller software, at least the first node or the second node may automatically recover the multiple nodes.
    Type: Application
    Filed: March 30, 2023
    Publication date: October 5, 2023
    Applicant: ARRIS Enterprises LLC
    Inventors: Hung Fu Chen, Hao Chuang, Chin Hou Chou
  • Publication number: 20230312567
    Abstract: The present disclosure relates generally to certain compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions disclosed herein may be used for the treatment or prevention of a Retroviridae viral infection, including an infection caused by the HIV virus.
    Type: Application
    Filed: February 15, 2023
    Publication date: October 5, 2023
    Inventors: Chienhung Chou, Darryl Kato, Scott E. Lazerwith, John O. Link, Scott D. Schroeder, Winston C. Tse, Jennifer R. Zhang
  • Publication number: 20230317541
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a substrate and an interconnect structure on the substrate. The interconnect structure includes a plurality of interconnects disposed within a dielectric structure. A dielectric protection layer is along a sidewall of the interconnect structure and along a sidewall and a recessed surface of the substrate. A bottommost surface of the dielectric protection layer rests on the recessed surface of the substrate.
    Type: Application
    Filed: June 8, 2023
    Publication date: October 5, 2023
    Inventors: Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai, Kuo-Ming Wu
  • Publication number: 20230315933
    Abstract: The swiveling table system comprises a 3D sensor and a swiveling table device disposed on a base having a central turntable and a lifting platform. The central turntable includes a central tray and a central rotation column coupled with the central tray for rotating the central tray. The lifting platform includes an outer ring tray and a lifting column coupled with the outer ring tray for lifting the outer ring tray. The outer ring tray and the central tray are coplanar. When a fabric is placed on the coplanar and the lifting column is controlled to lower the outer ring tray in a free-fall manner, the central rotating column rotates the central tray and the 3D sensor captures a rotating image of the fabric to build a 3D model of the fabric.
    Type: Application
    Filed: March 28, 2023
    Publication date: October 5, 2023
    Inventors: Hsien CHOU, Cheng-Kai LIN
  • Publication number: 20230313378
    Abstract: Substrate support, substrate support assemblies and process chambers comprising same are described. The substrate support has a thermally conductive body with a top surface, a bottom surface and an outer edge, and a plurality of long edge purge channel outlet opening at the outer edge of the thermally conductive body. The substrate support is configured to support a substrate to be processed on a top surface of the substrate support. The top surface of the thermally conductive body may have a ceramic coating. Each of the plurality of purge channel outlet is in fluid communication with a long edge purge channel. The long edge purge channel is coated with a long edge purge channel coating. A substrate support assembly includes the substrate support and the support post coupled to the substrate support. The processing chamber include a chamber body and the substrate support within the chamber body.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Yongjing Lin, Lei Zhou, Muhannad Mustafa, Shih Chung Chen, Zhihui Liu, Chi-Chou Lin, Bin Cao, Janardhan Devrajan, Mario D. Silvetti, Mandyam Sriram