Abstract: A micro-electromechanical system (MEMS) current sensor is described as including a first conductor, a magnetic field shaping component for shaping a magnetic field produced by a current in the first conductor, and a MEMS-based magnetic field sensing component including a magneto-MEMS component for sensing the shaped magnetic field and, in response thereto, providing an indication of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.

Abstract: A micro-electromechanical system (MEMS) current sensor is described as including a first conductor, a magnetic field shaping component for shaping a magnetic field produced by a current in the first conductor, and a MEMS-based magnetic field sensing component including a magneto-MEMS component for sensing the shaped magnetic field and, in response thereto, providing an indication of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.

Abstract: A method is provided. The method includes forming a conductive layer on an inner surface of a substrate and providing a sacrificial layer over the conductive layer. The method includes forming a plurality of channels in the sacrificial layer and plating the sacrificial layer to substantially fill the plurality of channels with a plating material comprising conducting material. The method also includes etching the sacrificial layer to form a conducting structure having fins where conducting material remains separated by microchannels where the sacrificial layer is etched.

Abstract: Crosslinkable polymeric materials are disclosed useful for the temporal stabilization of a poling-induced noncentrosymmetric host lattice containing guest nonlinear optical chromophores. The materials are also suitable as crosslinkable coatings in the absence of chromophores. Also disclosed is a method of crosslinking such polymeric material.

Abstract: A piezoelectric planar composite apparatus to provide health monitoring of a structure and associated methods are provided. The piezoelectric planar composite apparatus includes a piezoelectric electric material layer, multiple electrodes positioned in electrical contact with the piezoelectric material layer, and multiple sets of electrode interconnect conductors each positioned in electrical contact with a different subset of the of the electrodes and positioned to form multiple complementary electrode patterns. Each of the complementary electrode patterns is positioned to form an electric field having an electric field axis oriented along a different physical axis from that of an electric field formed by at least one other of the complementary electrode patterns. The interconnect conductors can be distributed over several electrode interconnect conductor carrying layers to enhance formation of the different complementary electrode patterns.

Abstract: A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component a structural component comprising a silicon substrate and a compliant layer comprising a material selected from the group consisting of silicon dioxide and silicon nitride, a magnetic-to-mechanical converter coupled to the structural component to provide a mechanical indication of the magnetic field, and a strain responsive component coupled to the structural component to sense the mechanical indication and to provide an indication of the current in the current carrying conductor in response thereto.

Abstract: An apparatus is provided that includes a substrate having a top surface, at least one optical data transport medium coupled to the substrate, one or more lens devices coupled to the substrate, and one or more reflective devices coupled to the substrate. The one or more lens devices and the one or more reflective devices are at least partially passively aligned with the at least one optical transport medium by use of one or more pins.

Abstract: A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component having a capacitive magneto-MEMS component, a compensator and an output component for sensing magnetic fields and for providing, in response thereto, an indication of the current present in a respective conductor to be measured. In one embodiment, first and second mechanical sense components are electrically conductive and operate to sense a change in a capacitance between the mechanical sense components in response to a mechanical indicator from a magnetic-to-mechanical converter.

Abstract: A micro-electromechanical system (MEMS) based current & magnetic field sensor includes a MEMS-based magnetic field sensing component a structural component comprising a silicon substrate and a compliant layer comprising a material selected from the group consisting of silicon dioxide and silicon nitride, a magnetic-to-mechanical converter coupled to the structural component to provide a mechanical indication of the magnetic field, and a strain responsive component coupled to the structural component to sense the mechanical indication and to provide an indication of the current in the current carrying conductor in response thereto.

Abstract: A micro-electromechanical system (MEMS) current sensor is described as including a first conductor, a magnetic field shaping component for shaping a magnetic field produced by a current in the first conductor, and a MEMS-based magnetic field sensing component including a magneto-MEMS component for sensing the shaped magnetic field and, in response thereto, providing an indication of the current in the first conductor. A method for sensing a current using MEMS is also described as including shaping a magnetic field produced with a current in a first conductor, sensing the shaped magnetic field with a MEMS-based magnetic field sensing component having a magneto-MEMS component magnetic field sensing circuit, and providing an indication of the current in the first conductor.

Abstract: A method of fabricating a stamping mold suitable for use in the formation of a tapered waveguide structure includes defining a stamping pattern upon the surface of a silicon wafer, and removing portions of the silicon wafer surface in accordance with the stamped pattern, thereby creating tapered vertical surfaces within the wafer.

Abstract: A mechanism and a method for framing a low-distortion flexible dielectric substrate during subsequent flex circuit processing. The processing method comprising the following steps: making a flexible dielectric substrate having an outer periphery; joining a continuous portion of the flexible dielectric substrate near the outer periphery to a rigid open frame, the flexible dielectric substrate being in a state other than a state of substantially uniform tension as a result of the joinder; causing the joined flexible dielectric substrate to undergo a change to the state of substantially uniform tension; and printing an electrical conductor on the flexible dielectric substrate while the flexible dielectric substrate is joined to the frame and in the state of substantially uniform tension. The frame is in the shape of a polygon (e.g., a rectangle) with rounded vertices.

Abstract: A piezoelectric microvalve and method for controlling a fluid flow through a piezoelectric microvalve are provided. The microvalve includes an inlet plenum and a flow directing structure for directing a fluid flow, wherein a first side of the structure is in fluid communication with the inlet plenum. The microvalve also includes a piezoelectric bending actuator comprising a flap portion responsive to a command signal for controlling a fluid flow through the flow directing structure. The microvalve further includes an outlet plenum in fluid communication with a second side of the flow directing structure.

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path; and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

Abstract: A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.

Abstract: A method for packaging a microelectromechanical system (MEMS) device comprises: using a partially-cured adhesive to attach a release sheet to a MEMS package flexible layer; providing a cavity extending through the release sheet and at least partially through the MEMS package flexible layer; removing the release sheet; and attaching the MEMS device to the MEMS package flexible layer with a MEMS structure of the MEMS device being positioned within the cavity.

Abstract: A mechanism and a method for framing a low-distortion flexible dielectric substrate during subsequent flex circuit processing. The processing method comprising the following steps: making a flexible dielectric substrate having an outer periphery; joining a continuous portion of the flexible dielectric substrate near the outer periphery to a rigid open frame, the flexible dielectric substrate being in a state other than a state of substantially uniform tension as a result of the joinder; causing the joined flexible dielectric substrate to undergo a change to the state of substantially uniform tension; and printing an electrical conductor on the flexible dielectric substrate while the flexible dielectric substrate is joined to the frame and in the state of substantially uniform tension. The frame is in the shape of a polygon (e.g., a rectangle) with rounded vertices.

Abstract: A chip-on-flex HDI module is fabricated by dispensing encapsulant material onto the components of a populated dielectric film or sheet in an interrupted pattern which leaves the backsides of selected components free of encapsulant. The dispensing is accomplished by relative motion of the dispenser tip and the populated film, with the dispenser tip at a height slightly above the desired liquid fill height during dispensing. At the locations of the components which are to be free of encapsulant, the dispensing stops, and the tip may be raised to prevent residual viscous matter on the dispenser tip from contacting the backside of the exposed component.

Abstract: An optoelectronic package is fabricated by a method which includes: positioning an optical device within a window of a substrate active-side up and below a top substrate surface; filling the window with an optical polymer material; planarizing surfaces of the optical polymer material and the substrate; patterning waveguide material over the optical polymer material and the substrate to form an optical interconnection path and to form a mirror to reflect light from the optical device to the interconnection path; and forming a via to expose a bond pad of the optical device.

Abstract: A method for making a multichip “HDI” module includes the step of making a substrate for supporting the semiconductor or solid-state chips by applying electrical conductor in a pattern to a first dielectric sheet, and applying encapsulating material to the electrical conductor. Apertures are made in the first dielectric sheet at locations at which the chips are to be located. The chips are affixed to a second dielectric sheet at locations registered with the apertures in the first sheet, and the sheets are juxtaposed with the chips extending into the apertures. Electrical connection is made to the pads of the chips by means of a multilayer structure of dielectric sheets with conductor patterns, interconnected by means of plated-through vias.