Patents by Inventor Christopher James Kapusta

Christopher James Kapusta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180020548
    Abstract: A system and method for providing a packaged electronics module having a dry film battery incorporated therein is disclosed. The packaged electronics module includes a first dielectric layer, at least one electronic component attached to or embedded in the first dielectric layer, a dry film battery formed on the first dielectric layer, and metal interconnects mechanically and electrically coupled to the at least one electronic component and the dry film battery to form electrical interconnections thereto. Electronic components in the form of a MEMS type sensor, semiconductor device and communications device may be included in the module along with the battery to provide a self-powered module capable of communicating with other like packaged electronics modules.
    Type: Application
    Filed: July 13, 2016
    Publication date: January 18, 2018
    Inventors: Christopher James Kapusta, Kaustubh Ravindra Nagarkar
  • Patent number: 9814419
    Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: November 14, 2017
    Assignee: General Electric Company
    Inventors: Jason Harris Karp, Christopher James Kapusta, Paul Jeffrey Gillespie, Christopher Fred Keimel, Jeffrey Michael Ashe, James Enrico Sabatini
  • Patent number: 9806390
    Abstract: A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
    Type: Grant
    Filed: February 10, 2017
    Date of Patent: October 31, 2017
    Assignee: General Electric Company
    Inventors: Yongjae Lee, Joseph Alfred Iannotti, Christopher Fred Keimel, Christopher James Kapusta
  • Publication number: 20170191167
    Abstract: A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
    Type: Application
    Filed: March 21, 2017
    Publication date: July 6, 2017
    Inventors: Christopher James Kapusta, Marco Francesco Aimi
  • Publication number: 20170155179
    Abstract: A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
    Type: Application
    Filed: February 10, 2017
    Publication date: June 1, 2017
    Inventors: Yongjae Lee, Joseph Alfred Iannotti, Christopher Fred Keimel, Christopher James Kapusta
  • Patent number: 9666516
    Abstract: An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: May 30, 2017
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Scott Smith, Christopher James Kapusta, Glenn Alan Forman, Eric Patrick Davis
  • Patent number: 9642566
    Abstract: A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: May 9, 2017
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, Eric Patrick Davis, Jason Harris Karp
  • Publication number: 20170062890
    Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.
    Type: Application
    Filed: August 28, 2015
    Publication date: March 2, 2017
    Inventors: Yongjae Lee, Joseph Alfred Iannotti, Christopher Fred Keimel, Christopher James Kapusta
  • Publication number: 20170063326
    Abstract: In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.
    Type: Application
    Filed: August 31, 2015
    Publication date: March 2, 2017
    Inventors: Christopher James Kapusta, Marco Francesco Aimi
  • Publication number: 20170062889
    Abstract: A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.
    Type: Application
    Filed: August 28, 2015
    Publication date: March 2, 2017
    Inventors: Yongjae Lee, Joseph Alfred Iannotti, Christopher Fred Keimel, Christopher James Kapusta
  • Patent number: 9570783
    Abstract: A RF MEMS package includes a MEMS die assembly having a signal line formed on a top surface of a first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and two pairs of ground pads formed on the top surface of the first mounting substrate adjacent respective portions of the signal line. The pairs of ground pads are positioned adjacent respective sides of the MEMS device. A ground assembly is electrically coupled to the pairs of ground pads and includes a second mounting substrate and a ground region formed on a surface of the second mounting substrate. The ground region faces the top surface of the first mounting substrate and is electrically coupled to the pairs of ground pads. A cavity is formed between the ground region and the signal line.
    Type: Grant
    Filed: August 28, 2015
    Date of Patent: February 14, 2017
    Assignee: General Electric Company
    Inventors: Yongjae Lee, Joseph Alfred Iannotti, Christopher Fred Keimel, Christopher James Kapusta
  • Publication number: 20160380317
    Abstract: A strain sensor, a system for monitoring a state of a battery cell, and a battery including the strain sensor. The strain sensor includes a thin, flexible substrate, a plurality of piezoresistors mounted on the substrate, an input for receiving a voltage signal, an output for providing an output voltage signal from the plurality of piezoresistors. The plurality of piezoresistors are connected to form a circuit that is insensitive to a change in temperature and an in-plane deformation of the substrate. The system includes the strain sensor, a source of voltage, and an analysis module configured for receiving a voltage signal based on the output voltage signal provided at the output of the strain sensor and calculating a state of charge or a state of health of a battery cell based on the received voltage signal. The battery includes the strain sensor and a space for spacing adjacent battery cells.
    Type: Application
    Filed: August 21, 2015
    Publication date: December 29, 2016
    Inventors: Yizhen Lin, Aaron Jay Knobloch, Christopher James Kapusta, Jason Harris Karp
  • Publication number: 20160370210
    Abstract: The invention is directed to modular flexible sensor arrays that are adaptable, easy to manufacture, and which reduce material waste. A method of making a modular flexible sensor array is provided, including the steps of applying at least one sensing element to a first substrate to form at least one sensor, applying at least one electrically conductive interconnect to a surface of a second flexible substrate, and coupling the at least one sensor to the at least one electrically conductive interconnect such that the at least one sensor is electrically connected thereto.
    Type: Application
    Filed: June 18, 2015
    Publication date: December 22, 2016
    Inventors: Christopher James Kapusta, Aaron Jay Knobloch, Jason Karp
  • Publication number: 20160220158
    Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.
    Type: Application
    Filed: April 7, 2016
    Publication date: August 4, 2016
    Inventors: Jason Harris Karp, Christopher James Kapusta, Paul Jeffrey Gillespie, Christopher Fred Keimel, Jeffrey Michael Ashe, James Enrico Sabatini
  • Publication number: 20160155693
    Abstract: An electronic package and a method of making the same in provided. The electronic package includes a dielectric layer and a conformal masking layer disposed on at least a portion of the dielectric layer. The electronic package further includes a routing layer disposed on at least a portion of the masking layer and a micro-via disposed at least in part in the conformal masking layer and the routing layer. Further, at least a portion of the routing layer forms a conformal electrically conductive layer in at least a portion of the micro-via. Also, the conformal masking layer is configured to define a size of the micro-via. The electronic package further includes a semiconductor die operatively coupled to the micro-via.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 2, 2016
    Inventors: Scott Smith, Christopher James Kapusta, Glenn Alan Forman, Eric Patrick Davis
  • Patent number: 9299661
    Abstract: An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film.
    Type: Grant
    Filed: May 18, 2009
    Date of Patent: March 29, 2016
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, James Sabatini
  • Publication number: 20150340744
    Abstract: The invention provides a battery sensing system comprising a battery module comprising a plurality of battery cells, at least one sensor coil coupled to or placed adjacent to one of more of the plurality of battery cells to determine cell expansion during cell operation, and a battery management system comprising one or more processors and/or microcontrollers that control operation of the plurality of battery cells.
    Type: Application
    Filed: March 24, 2015
    Publication date: November 26, 2015
    Inventors: Aaron J. KNOBLOCH, Yuri Alexeyevich PLOTNIKOV, Christopher James KAPUSTA, Jason Harris KARP, Yizhen LIN
  • Publication number: 20150133753
    Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 14, 2015
    Applicant: General Electric Company
    Inventors: Jason Harris Karp, Christopher James Kapusta, Paul Jeffrey Gillespie, Christopher Fred Keimel, Jeffrey Michael Ashe, James Enrico Sabatini
  • Patent number: 9024447
    Abstract: An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: May 5, 2015
    Assignee: General Electric Company
    Inventors: Christopher James Kapusta, James Sabatini
  • Publication number: 20150099948
    Abstract: A flexible embedded sensor array includes a first substrate, an electrically conductive pad disposed on at least a portion of the first substrate, and a plurality of sensors disposed on at least a portion of electrically conductive pads. Further, the flexible embedded sensor array includes an electrically non-conductive adhesive material disposed in proximity to one or more of the plurality of sensors, a second substrate, and an electrical contact disposed between at least a portion of the sensor and at least a portion of the second substrate.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 9, 2015
    Applicant: General Electric Company
    Inventors: Christopher James Kapusta, Eric Patrick Davis, Jason Harris Karp