Patents by Inventor Chuan Lin
Chuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12293952Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.Type: GrantFiled: May 9, 2024Date of Patent: May 6, 2025Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
-
Publication number: 20250088210Abstract: A mobile device protective case set is suitable for cooperating with a mobile device, the mobile device protective case set includes a main frame and an assembling component, the main frame has an inner circular surface, a back flange and at least one positioning portion, the inner circular surface encloses to define a space, the space is suitable for accommodating the mobile device, the back flange protrudes from the inner circular surface towards the space, the back flange has a device abutting surface, which is suitable for a back side of the mobile device to abut, and the positioning portion is disposed at the device abutting surface; the assembling component has a base portion and at least one clamping portion, the clamping portion is disposed at a partial outer periphery of the base portion, the clamping portion is suitable for combining the positioning portion, and the device abutting surface and the clamping portion are suitable to abut against the back side of the mobile device.Type: ApplicationFiled: September 10, 2024Publication date: March 13, 2025Applicant: EVOLUTIVE LABS CO., LTD.Inventors: SHENG-CHE SU, CHE-WEI HSU, YU-CHUAN LIN
-
Publication number: 20250062637Abstract: A method for detecting whether a battery is disconnected, an online UPS and an offline UPS using the method. The method comprises the following steps: determining whether a charging circuit charging a battery is in a constant voltage charging mode; and when the determination result is yes, executing a battery disconnection detection, which comprising the following steps: alternately performing a first operation and a second operation on a PWM signal, wherein the duty cycle of the PWM signal is used to control the output voltage of the charging circuit, the first operation is increasing the duty cycle of the PWM signal by a first preset value for a first preset time, and the second operation is reverting the PWM signal to the original duty cycle for a second preset time; and determining whether the voltage at the output terminal of the charging circuit rises and reaches a second preset value.Type: ApplicationFiled: October 24, 2023Publication date: February 20, 2025Inventors: MING-CHUAN LIN, JUNG-HUA WENG, YU-CHIEH KUNG
-
Patent number: 12227976Abstract: A locking device for connecting a first housing to a second housing is provided, wherein the first housing and the second housing are arranged along a first direction. The locking mechanism includes a first hook, a second hook, a movable member, and a driving member. The first hook and the second hook are affixed to the first housing, and respectively have a first engaging recess and a second engaging recess. The first engaging recess and the second engaging recess are arranged along the first direction. The movable portion has an engaging portion. The driving member is connected to the second housing and the movable member, and is configured to drive the movable member to move relative to the second housing. When the first housing is affixed to the second housing via the locking mechanism, the engaging portion is accommodated in the first engaging recess.Type: GrantFiled: May 17, 2022Date of Patent: February 18, 2025Assignee: DELTA ELECTRONICS, INC.Inventors: Ting-Shou Chen, Hung-Chuan Lin
-
Patent number: 12221483Abstract: The present disclosure provides a fusion protein and the nucleic acid encoding sequence thereof, and uses of the same. The fusion protein of the present disclosure achieves the effect of treating cancer, immunoregulation and activating immune cells through various efficacy experiments.Type: GrantFiled: January 30, 2024Date of Patent: February 11, 2025Assignee: CHINA MEDICAL UNIVERSITY HOSPITALInventors: Der-Yang Cho, Shao-Chih Chiu, Shi-Wei Huang, Chih-Ming Pan, Mei-Chih Chen, Yu-Chuan Lin, Yeh Chen, Yi-Wen Chen, Ming-You Shie, Kai-Wen Kan
-
Publication number: 20250037858Abstract: The present invention disclose a medical image-based system for predicting lesion classification and a method thereof. The system comprises a feature data extracting module for providing a raw feature data based on a medical image, and a predicting module for outputting a predicted class and a risk index according to the raw feature data. The predicting module comprises a classification unit for generating the predicted class and a prediction score corresponding thereto according to the raw feature data, and a risk evaluation unit for generating the risk index according to the prediction score. The system provides medical personnels a reference score and a risk index to determine progression of a certain disease.Type: ApplicationFiled: February 1, 2024Publication date: January 30, 2025Inventors: YI-SHAN TSAI, YU-HSUAN LAI, CHENG-SHIH LAI, CHAO-YUN CHEN, MENG-JHEN WU, YI-CHUAN LIN, YI-TING CHIANG, PENG-HAO FANG, PO-TSUN KUO, YI-CHIH CHIU
-
Publication number: 20240420992Abstract: A manufacturing method of a semiconductor structure includes: etching a substrate such that the substrate has a first top surface and a second top surface higher than the first top surface; implanting the first top surface of the substrate by boron to increase a p-type concentration of the first top surface of the substrate; forming a first dielectric layer on the substrate; and forming a second dielectric layer on the first dielectric layer.Type: ApplicationFiled: August 26, 2024Publication date: December 19, 2024Inventors: Chuan-Lin HSIAO, Wei-Ming LIAO
-
Publication number: 20240407079Abstract: A carrier structure is provided, in which a ground layer is formed on a dielectric body, a circuit layer is formed in the dielectric body, and a conductive via is formed in the dielectric body and electrically connected to the circuit layer and the ground layer, where the ground layer has at least one first groove that exposes a surface of the dielectric body, so that the noise of the circuit layer is easy to spread out of the dielectric body, so as to prevent the problem of crosstalk from occurring in the circuit layer.Type: ApplicationFiled: August 30, 2023Publication date: December 5, 2024Inventors: Chien-Sheng CHEN, Chia-Chu LAI, Ho-Chuan LIN
-
Patent number: 12152764Abstract: A lamp device applicable to a display includes a lamp main body, a lamp arm component, a lamp light component and a fixing base. The fixing base is arranged on the back surface of the display, so that the lamp main body can be positioned on the fixing base to be arranged on the back surface. When the lamp arm component is rotated to the first position relative to the lamp main body, the lamp light component has a first height relative to the display, so that a first use state is provided. When the lamp arm component is rotated to the second position relative to the lamp main body, the lamp light component can be detached from the lamp arm component and then reversely installed thereon. The lamp light component has a second height different relative to the display, so that a second use state is provided.Type: GrantFiled: April 29, 2024Date of Patent: November 26, 2024Assignee: Qisda CorporationInventors: Li-Chuan Lin, Yung-Ming Yen, Min-Han Zhan
-
Publication number: 20240388248Abstract: A photovoltaic-inverter heat-dissipation assembly is disclosure and includes a front housing-base, a rear cover, a first heat-generating device, a first fan, a second heat-generating device and a second fan. The rear cover and the front housing-base are combined to separately form a first heat-dissipation space and a second heat-dissipation space. The rear cover includes a first air-inlet, a second air-inlet and an air-outlet. The first air-inlet and the second air-inlet are in communication with the air-outlet through the first heat-dissipation space and the second heat-dissipation space, respectively. The first fan generates a first airflow, which enters through the first air-inlet, flows through the first heating-generating device accommodated in the first heat-dissipation space, and flows out through the air-outlet.Type: ApplicationFiled: July 7, 2023Publication date: November 21, 2024Inventors: Chia-Hao Yeh, Hung-Chuan Lin
-
Publication number: 20240387102Abstract: An inductor module is provided, in which a first coil and a second coil surrounding an outer circumference of the first coil are formed on a carrier structure to generate magnetic flux. The first coil includes a first conductive layer bonded to the carrier structure, and a plurality of first wires arranged on the carrier structure and connected to the first conductive layer. The second coil includes a second conductive layer bonded to the carrier structure, a plurality of conductive pillars embedded in the carrier structure and connected to the second conductive layer, and a plurality of second wires arranged on the carrier structure and connected to the conductive pillars. The first conductive layer and the second conductive layer are arranged at intervals in different layers of the carrier structure.Type: ApplicationFiled: August 8, 2023Publication date: November 21, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Huei-Chi YANG, Tai-Tsung HSU, Ho-Chuan LIN
-
Publication number: 20240377050Abstract: A lamp device applicable to a display includes a lamp main body, a lamp arm component, a lamp light component and a fixing base. The fixing base is arranged on the back surface of the display, so that the lamp main body can be positioned on the fixing base to be arranged on the back surface. When the lamp arm component is rotated to the first position relative to the lamp main body, the lamp light component has a first height relative to the display, so that a first use state is provided. When the lamp arm component is rotated to the second position relative to the lamp main body, the lamp light component can be detached from the lamp arm component and then reversely installed thereon. The lamp light component has a second height different relative to the display, so that a second use state is provided.Type: ApplicationFiled: April 29, 2024Publication date: November 14, 2024Applicant: Qisda CorporationInventors: Li-Chuan LIN, Yung-Ming YEN, Min-Han ZHAN
-
Publication number: 20240379477Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Inventors: Ho-Chuan LIN, Min-Han CHUANG, Chia-Chu LAI
-
Publication number: 20240365530Abstract: A memory structure includes a substrate, a first word line and a first word line. The substrate has a plurality of active areas and an isolation structure surrounding the active areas. The first word line trench is formed across a first active area of the active areas and the isolation structure. The first word line trench includes a first slot and a first groove. The first slot is recessed from a top surface of the substrate. The first groove expands from a bottom of the first slot. A first sidewall is connected between the bottom of the first slot and a top of the first groove. A first word line is formed in the first word line trench. The first word line comprises a gate dielectric conformally formed on the first groove and the first slot.Type: ApplicationFiled: July 5, 2024Publication date: October 31, 2024Inventors: Tseng-Fu LU, Chuan-Lin HSIAO
-
Publication number: 20240340477Abstract: A server for handling operations in a live streaming platform, comprising: receiving an operation from a user terminal of a user; sending a message to the user terminal of the user in response to detecting an issue from the operation; and determining type of customer service according to information of the operation and the issue. The present disclosure may provide real-time support to customers and allow issues to be resolved in a quick and efficient manner. Moreover, the number of customer complaints may be reduced and overall customer satisfaction may be improved. Therefore, the user experience may be improved.Type: ApplicationFiled: August 7, 2023Publication date: October 10, 2024Inventor: Chu-Chuan LIN
-
Patent number: 12107002Abstract: A manufacturing method of a semiconductor structure includes: etching a substrate such that the substrate has a first top surface and a second top surface higher than the first top surface; implanting the first top surface of the substrate by boron to increase a p-type concentration of the first top surface of the substrate; forming a first dielectric layer on the substrate; and forming a second dielectric layer on the first dielectric layer.Type: GrantFiled: October 11, 2023Date of Patent: October 1, 2024Assignee: NANYA TECHNOLOGY CORPORATIONInventors: Chuan-Lin Hsiao, Wei-Ming Liao
-
Patent number: 12100648Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.Type: GrantFiled: August 16, 2023Date of Patent: September 24, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ho-Chuan Lin, Chia-Chu Lai, Min-Han Chuang
-
Patent number: 12100633Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.Type: GrantFiled: June 27, 2023Date of Patent: September 24, 2024Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Ho-Chuan Lin, Min-Han Chuang, Chia-Chu Lai
-
Publication number: 20240290691Abstract: An electronic package and a manufacturing method thereof are provided, in which a magnetically permeable member and a plurality of supporting members having conductive through vias are disposed on a carrier structure having a circuit layer, the magnetically permeable member is located between two supporting members, and a conductive member is disposed on the supporting members to cover the magnetically permeable member, so that the circuit layer, the conductive through vias and the conductive member form a coil surrounding the magnetically permeable member to increase the inductance.Type: ApplicationFiled: June 26, 2023Publication date: August 29, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Min-Han CHUANG, Ho-Chuan LIN, Chia-Chu LAI
-
Publication number: 20240290674Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.Type: ApplicationFiled: May 6, 2024Publication date: August 29, 2024Inventors: Ho-Chuan LIN, Min-Han CHUANG, Chia-Chu LAI