Abstract: A manufacturing method of a semiconductor structure includes: etching a substrate such that the substrate has a first top surface and a second top surface higher than the first top surface; implanting the first top surface of the substrate by boron to increase a p-type concentration of the first top surface of the substrate; forming a first dielectric layer on the substrate; and forming a second dielectric layer on the first dielectric layer.

Abstract: An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.

Abstract: A photovoltaic inverter includes a casing, at least one circuit board located in the casing, a current sensor located on the at least one circuit board, an arc detector located on the at least one circuit board, a self-test coil located on the at least one circuit board, and at least one direct current input terminal located on the casing and connected to the at least one circuit board, wherein the self-test coil is configured to deliver a test signal to be sensed by the arc detector, and the direct current input terminal is configured to deliver a direct current through the arc detector, wherein the current sensor is configured to detect a magnitude of the direct current passing through the direct current input terminal.

Abstract: A manufacturing method of a semiconductor structure includes: etching a substrate such that the substrate has a first top surface and a second top surface higher than the first top surface; implanting the first top surface of the substrate by boron to increase a p-type concentration of the first top surface of the substrate; forming a first dielectric layer on the substrate; and forming a second dielectric layer on the first dielectric layer.

Abstract: The present disclosure provides a method for manufacturing a semiconductor device having a buried wordline. The method includes forming a first recessed portion in a first dielectric layer in a substrate; forming a second recessed portion spaced apart from the first recessed portion and in the substrate; disposing a protection layer on the substrate to cover the second recessed portion; and disposing a second dielectric layer on the first dielectric layer.

Abstract: A display device includes a light guide plate a first area, a plurality of first eccentric microstructures positioned in the first area with a first eccentric orientation, a second area arranged at one side of the first area, and second eccentric microstructures positioned in the second area with a second eccentric orientation. An angle between the first eccentric orientation and the second eccentric orientation is less than 90 degrees. First and second light sources are disposed on a first side of the light guide, and configured to project light towards a corresponding one of the first and second eccentric microstructures.

Abstract: An electronic device and a sensitivity adjustment method of a sensor are disclosed. The method includes: in a situation that a target program is executed by the electronic device, receiving sensing data from a target sensor; activating a sensitivity adjustment rule according to the target program; adjusting the sensing data according to the sensitivity adjustment rule; and providing the adjusted sensing data to the target program.

Abstract: An electronic device includes an outer housing, a touch display module, and at least one optical assembly. The outer housing has an accommodating portion and an engaging portion. The touch display module is disposed in the accommodating portion and engaged with the engaging portion. The touch display module includes a thin-film transistor substrate, a color filter substrate, and a touch electrode layer. The color filter substrate is disposed on a side of the thin-film transistor substrate facing the outer housing. The touch electrode layer is disposed between the thin-film transistor substrate and the color filter substrate. The optical assembly is disposed on a side of the color filter substrate away from the thin-film transistor substrate.

Abstract: A method for correcting abnormal point cloud is disclosed. Firstly, receiving a Primitive Point Cloud Data set by an operation unit for dividing a point cloud array into a plurality of sub-point cloud sets and obtaining a plurality of corresponding distribution feature data according to an original vector data of the Primitive Point Cloud Data set. Furthermore, recognizing the sub-point cloud sets according to the corresponding distribution feature data for correcting recognized abnormal point cloud. Thus, when the point cloud array is rendered to a corresponding image, the color defect of the point cloud array will be improved or decreased for obtaining lossless of the corresponding image.

Abstract: The invention provides a voltage doubler switched capacitor circuit capable of detecting short circuit of flying capacitor and a detection method thereof. The voltage doubler switched capacitor circuit provides a way to connect the flying capacitor in parallel to the charging path, and calculate whether it is charged to a predetermined voltage in the designed charging time interval, and then it can effectively detect whether the flying capacitor is short-circuited.

Abstract: An electronic module is provided, in which a first metal layer, an insulating layer and a second metal layer are sequentially formed on side faces and a non-active face of an electronic component to serve as a capacitor structure, where the capacitor structure is exposed from an active face of the electronic component so that by directly forming the capacitor structure on the electronic component, a distance between the capacitor structure and the electronic component is minimized, such that the effect of suppressing impedance can be optimized.

Abstract: The present application provides a method of manufacturing a memory device having several word lines (WL) with reduced leakage. The method includes steps of providing a semiconductor substrate defined with an active area and including an isolation surrounding the active area; forming a first recess extending into the semiconductor substrate and across the active area; forming a first lining portion of a first insulating layer conformal to the first recess; disposing a first conductive material conformal to the first lining portion; forming a first conductive member surrounded by the first conductive material; disposing a second conductive material over the first conductive member to form a first conductive layer enclosing the first conductive member; and forming a first protruding portion of the first insulating layer above the first conductive layer and the first conductive member.

Abstract: A display device includes a light guide plate substrate having a first area, a plurality of first eccentric microstructures positioned in the first area with a first eccentric orientation, a second area arranged at one side of the first area, and second eccentric microstructures positioned in the second area with a second eccentric orientation. An angle between the first eccentric orientation and the second eccentric orientation is less than 90 degrees. First and second light sources are disposed on a first side of the light guide, and configured to project light towards a corresponding one of the first and second eccentric microstructures.

Abstract: A controller and a wire take-up assembly thereof are provided. The wire take-up assembly can be installed on a side of a grip, so as to accommodate a connection wire. The wire take-up assembly includes an accommodating body and an operating component. The accommodating body has an accommodating groove, and the accommodating groove can accommodate a part of the connection wire. A part of the operating component is located in the accommodating groove. The operating component can move relative to the accommodating body, so that the connection wire in the accommodating groove is pulled by the operating component and a part of the connection wire exposed outside the accommodating groove is accommodated into the accommodating groove. Accordingly, the controller and the wire take-up assembly thereof can quickly accommodate the connection wire.

Abstract: An EMI filter system includes a circuit board and a choke. The circuit board includes at least three capacitors. The choke mounts on the circuit board and includes a non-circular magnetic core and at least three windings. The at least three windings are wound on the non-circular magnetic core. The at least three capacitors are disposed adjacent to the choke, and first outlet ends of the at least three windings are respectively connected to the corresponding at least three capacitors.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: The present disclosure provides an anti-T-cell nanobody that specifically binds to CD3 ?. The present disclosure also provides the nucleic acid sequence of the anti-T-cell nanobody, use of the anti-T-cell nanobody for treating cancer, immunoregulation and activating immune cells, and a method for detecting expression levels of CD3 ?.