Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: A memory structure includes a substrate, a first word line and a first word line. The substrate has a plurality of active areas and an isolation structure surrounding the active areas. The first word line trench is formed across a first active area of the active areas and the isolation structure. The first word line trench includes a first slot and a first groove. The first slot is recessed from a top surface of the substrate. The first groove expands from a bottom of the first slot. A first sidewall is connected between the bottom of the first slot and a top of the first groove. A first word line is formed in the first word line trench. The first word line comprises a gate dielectric confomally formed on the first groove and the first slot.

Abstract: An electronic device and a sensitivity adjustment method of a sensor are disclosed. The method includes: in a situation that a target program is executed by the electronic device, receiving sensing data from a target sensor; activating a sensitivity adjustment rule according to the target program; adjusting the sensing data according to the sensitivity adjustment rule; and providing the adjusted sensing data to the target program.

Abstract: A virtual reality acupuncture system contains a virtual reality device comprising: a head-mounted display for viewing a virtual scene model and a mannequin, and a joystick for tracking hand movements for needle insertion determination; an computing host that transmits data with a head-mounted display and constructs an acupoint database, and an acupuncture virtual reality application which is executed to build a virtual reality model, in which the acupuncture virtual reality application constructs a situational scene model for simulating the actual condition of the consultation room; and a virtual 3D spherical acupoint model of the human body, which has a sphere area located at a certain depth below the skin surface, and has a skin distance model, so that the needle can sense the distance depth after touching the skin, which can be used to determine whether the needle position is not outside the sphere area.

Abstract: A reference element of an infrared sensor includes a substrate, a sacrificial layer, a supporting structure, a fence structure and an infrared sensing structure. The sacrificial layer is disposed on the substrate. The supporting structure is disposed on the substrate wherein the top surface of the supporting structure is coplanar with the top surface of the sacrificial layer. The fence structure is disposed on the substrate and surrounds the sacrificial layer wherein the top surface of the fence structure is coplanar with the top surface of the sacrificial layer, and there is an air gap between the fence structure and the supporting structure. The infrared sensing structure is disposed on the sacrificial layer, the supporting structure and the fence structure, and the infrared sensing structure has an opening corresponding to the air gap.

Abstract: An electronic package is provided, in which a ground layer is arranged on one side of an insulator, and a first antenna portion and a second antenna portion embedded in the insulator are vertically disposed on the ground layer, where a gap is formed between the first antenna portion and the second antenna portion, such that the first antenna portion and the second antenna portion are electrically matched with each other, and the ground layer is electrically connected to the second antenna portion but free from being electrically connected to the first antenna portion.

Abstract: A three-phase uninterruptible power system and an operation method thereof are provided. The three-phase uninterruptible power system comprises a DC bus, three power conversion circuits and a control circuit. When the three-phase uninterruptible power system enters a line mode from a battery mode, the control circuit performs a huge current suppression for each power conversion circuit according to a predetermined sequence. The huge current suppression performed for any of the power conversion circuits comprises the following steps: disabling the DC-DC conversion of the power conversion circuit, and having the other two power conversion circuits to additionally share the original load of the disabled power conversion circuit; and after the DC-DC conversion of the power conversion circuit is disabled, enabling the AC-DC conversion of the power conversion circuit, and having the power conversion circuits revert to their original load.

Abstract: An electronic package is provided, in which an electronic component with a conductive layer on an outer surface thereof is embedded in an encapsulant, where at least one electrode pad is disposed on an active surface of the electronic component, and at least one wire electrically connected to the electrode pad is arranged inside the electronic component, so that the conductive layer is electrically connected to the wire, such that the electrode pad, the wire and the conductive layer are used as a power transmission structure which serves as a current path to reduce DC resistance and improve an impedance issue associated with the supply of power.

Abstract: The present disclosure provides an anti-tumor antigen nanobody that specifically binds to a human leukocyte antigen-G. The present disclosure also provides the nucleic acid sequence of the anti-tumor antigen nanobody, use of the anti-tumor antigen nanobody for treating cancer and immune-related disorders, and a method for detecting expression levels of HLA-G.

Abstract: A three-phase uninterruptible power system and an operation method thereof are provided. The three-phase uninterruptible power system comprises a DC bus, three power conversion circuits and a control circuit. When the three-phase uninterruptible power system enters a line mode from a battery mode, the control circuit performs a huge current suppression for each power conversion circuit according to a predetermined sequence. The huge current suppression performed for any of the power conversion circuits comprises the following steps: disabling the DC-DC conversion of the power conversion circuit, and having the other two power conversion circuits to additionally share the original load of the disabled power conversion circuit; and after the DC-DC conversion of the power conversion circuit is disabled, enabling the AC-DC conversion of the power conversion circuit, and having the power conversion circuits revert to their original load.

Abstract: An authority control system includes a biometric identification unit, a near field communication (NFC) signal transmission unit, and an NFC signal receiving unit. The biometric identification unit stores associated data, configured to obtain first biometric data, obtains encoded data according to the first biometric data and the associated data, and transmits the encoded data. The NFC signal transmission unit is configured to receive the encoded data transmitted by the biometric identification unit, and transmit the encoded data by using an NFC transmission technology. The NFC signal receiving unit stores authorization type comparison data. The NFC signal receiving unit is configured to receive the encoded data transmitted by the NFC signal transmission unit, and determines an authorization type according to the encoded data and the authorization type comparison data.

Abstract: The present invention demonstrated a Cre-loxP based cofilin-1 transgenic animal model to address the pathophysiological role of over-expressed cofilin-1 on systemic development.

Abstract: A connector assembly includes a base, a wire unit, and a wire fixing unit. The base includes a body and two side wings. The two side wings are respectively rotatably connected to two opposite sides of the body, and each of the side wings includes a first fixing portion. The wire unit is located between the two side wings. The wire unit includes a connection seat disposed in the body, and various wires disposed in the connection seat and protruding from one side of the connection seat. The wire fixing unit includes two second fixing portions and various through holes, in which the through holes are located between the two second fixing portions, the two first fixing portions respectively clamp the two second fixing portions, and the wires correspondingly pass through the through holes.

Abstract: A sample rack manipulation device (10), a testing system (1) and a testing method using the sample rack manipulation device (10), and a computer-readable medium implementing the testing method. The sample rack manipulation device (10) comprises: a loading/unloading zone (TA) in which a plurality of sample racks (50) carrying sample containers (51) containing samples can be arranged side by side; a sampling zone (TD, TE) in which samples in each sample container (51) on the sample racks (50) are sampled by an automatic testing apparatus; and a docking device (114) configured to transfer the sample racks (50) between the loading/unloading zone (TA) and the sampling zone (TD, TE). The docking device (114) is configured to be able to remove the sample racks (50) loaded in the loading/unloading zone (TA) in any order and to transfer the removed test sample racks (50) to the sampling zone (TD, TE) for sampling.

Abstract: A sample rack recovery method after an accidental interruption of operation of a sample rack manipulation device (10), a sample rack manipulation device (10) capable of performing the method, an automatic detection system (1) comprising the device (10), and a computer-readable medium in which a program for executing the method is stored. The device (10) comprises a conveying device (103) adapted to move in a transport area (TB) to convey a sample rack (30) between a loading/unloading area (TA), sampling areas (TD, TE) and a buffer area (TC). The method comprises: a conveying device detection step of detecting the state of a conveying device (103); a sample rack detection step of detecting the position of a sample rack (30) in a sample rack manipulation device (10); and a sample rack recovery step of conveying the sample rack (30) to a loading/unloading area (TA) by the conveying device (103) according to the detection results of the conveying device (103) and the sample rack (30).

Abstract: A manufacturing method of a semiconductor structure includes: etching a substrate such that the substrate has a first top surface and a second top surface higher than the first top surface; implanting the first top surface of the substrate by boron to increase a p-type concentration of the first top surface of the substrate; forming a first dielectric layer on the substrate; and forming a second dielectric layer on the first dielectric layer.

Abstract: An electronic package is provided, in which a mesh structure is disposed between a circuit structure and an electronic element to increase the shunt path of current. Therefore, when the electronic element is used as an electrode pad of a power contact, the current can be passed through a conductive sheet of the circuit structure via the mesh structure, such that the power loss can be reduced and the IR drop of the electronic element can meet the requirements.

Abstract: A photovoltaic inverter includes a casing, at least one circuit board located in the casing, a current sensor located on the at least one circuit board, an arc detector located on the at least one circuit board, a self-test coil located on the at least one circuit board, and at least one direct current input terminal located on the casing and connected to the at least one circuit board, wherein the self-test coil is configured to deliver a test signal to be sensed by the arc detector, and the direct current input terminal is configured to deliver a direct current through the arc detector, wherein the current sensor is configured to detect a magnitude of the direct current passing through the direct current input terminal.